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Match Document Document Title
7615842 Inductor integrated chip  
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
7612443 Inter-chip communication  
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods...
7602052 Semiconductor device  
To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according...
7595220 Image sensor package and fabrication method thereof  
The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A...
7582958 Semiconductor package  
A semiconductor package which includes a plurality of leads embedded in a ceramic body, a semiconductor device electrically coupled to the leads, and a molded housing encapsulating at least the...
7573125 Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods  
Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods are disclosed herein. One such device can include a first support member, a second...
7572671 Stacked module systems and methods  
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a...
7569411 Metal MEMS devices and methods of making same  
Metal MEMS structures are fabricated from metal substrates, preferably titanium, utilizing micromachining processes with a new deep etching procedure to provide released microelectromechanical...
7566632 Lock and key structure for three-dimensional chip connection and process thereof  
A method positions a first wafer with respect to a second wafer such that key studs on the first wafer are fit (positioned) within lock openings in the second wafer. The key studs contact...
7564125 Electronic array and methods for fabricating same  
A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections...
7550843 Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member  
A semiconductor device includes a base member made of a material containing at least a thermosetting resin, and at least one semiconductor constructing body mounted on the base member, and having a...
7545017 Wafer level package for surface acoustic wave device and fabrication method thereof  
A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top...
7528005 Method of manufacturing chip size package semiconductor device without intermediate substrate  
A method of manufacturing a semiconductor device includes providing a first semiconductor chip having a plurality of pads, providing a second semiconductor chip having a plurality of pads, fixing...
7524754 Interconnect shunt used for current distribution and reliability redundancy  
In one embodiment of the invention, an integrated circuit package includes an integrated circuit, a package substrate, a first bump, a second bump and a shunt to provide for current distribution...
7524753 Semiconductor device having through electrode and method of manufacturing the same  
A method of manufacturing a semiconductor device having a through electrode, includes forming through holes 36 in a substrate 31 , forming a first metal layer 39 from one surface side of the...
7521289 Package having dummy package substrate and method of fabricating the same  
A package may include a stack of unit chip packages, and each unit chip package may include a printed circuit board. The printed circuit board may support a semiconductor chip and a connection...
7521283 Manufacturing method of chip integrated substrate  
A manufacturing method of a chip integrated substrate is disclosed. The manufacturing method includes a first step that forms a wiring structure to be connected to a semiconductor chip on a first...
7518227 Multiple die stack apparatus employing T-shaped interposer elements  
Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor...
7514793 Metal interconnection lines of semiconductor devices and methods of forming the same  
Metal interconnection lines of semiconductor devices and methods of forming the same are disclosed. Improved reliability is achieved in a disclosed metal line of a semiconductor device by...
7514291 Methods relating to singulating semiconductor wafers and wafer scale assemblies  
Methods relating to singulation of dice from semiconductor wafers. Trenches or channels are formed in the bottom surface of a semiconductor wafer, corresponding in location to wafer streets. The...
7508052 Crack protection for silicon die  
A wafer containing a plurality of die separated by streets which are to be sawn has a nitride passivation layer which has openings over die contact locations and gaps leaving nitride strips along...
7479693 Arrangement of conductive connectors in a power semiconductor device  
One of the aspects of the present invention is to provide a power semiconductor device, including a first substrate having a first circuit pattern formed thereon, and a second substrate having a...
7479407 Digital and RF system and method therefor  
A stacked die system ( 10 ) has a first die ( 16 ) having a first surface with active circuitry, a second die ( 18 ) having a first surface with active circuitry, and a conductive shield ( 28 )...
7473992 Multi-layer interconnection circuit module and manufacturing method thereof  
The present invention is directed to a multi-layer interconnection circuit module in which plural unit wiring layers are interlayer-connected to each other through a large number of via holes so...
7468549 Method for producing a package for an electronic circuit and a substrate for a package  
The invention relates a substrate for a package for an electronic circuit and methods for packaging an electronic circuit with a substrate. The substrate comprises at least one conduction region...
7442576 Placement of absorbing material in a semiconductor device  
A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is...
7436047 Wafer having scribe lanes suitable for sawing process, reticle used in manufacturing the same, and method of manufacturing the same  
A wafer that is less susceptible to chipping or peeling during a sawing process is disclosed. The wafer includes a plurality of chips, scribe lanes formed between the plurality of chips, and a...
7429797 Electronic device and carrier substrate  
Consistent with an example embodiment, an electronic device comprises a semiconductor device, particularly an integrated circuit, and a carrier substrate with conductive layers on the first side...
7425462 Methods relating to the reconstruction of semiconductor wafers for wafer-level processing  
Methods relating to the reconstruction of semiconductor wafers for wafer-level processing are disclosed. Selected semiconductor dice having alignment cavities formed in a surface thereof are placed...
7420267 Image sensor assembly and method for fabricating the same  
An assembly device of an image sensor chip is disclosed. A flexible circuit has a die-attached portion, a plurality of bendable portions, and a plurality of bonding portions where the bendable...
7417324 Semiconductor device and method for manufacturing the same  
A semiconductor device is composed of a semiconductor chip, aluminum pads formed on the semiconductor chip, alloy ball bumps, which are formed on the aluminum pads, containing gold and Pd, and gold...
7417309 Circuit device and portable device with symmetrical arrangement  
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first...
7416910 Pyramid socket suspension  
An apparatus and method for flexibly suspending a sensing mechanism between a pair of cover plates, including a sensing mechanism formed in a crystalline silicon substrate; a pair of cover plates...
7411304 Semiconductor interconnect having conductive spring contacts  
An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor...
7408251 Semiconductor packaging device comprising a semiconductor chip including a MOSFET  
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
7405474 Low cost thermally enhanced semiconductor package  
In one embodiment, a device is packaged using a low-cost thermally enhanced ball grid array (LCTE-BGA) package. The device may include a die with its backside mounted to the bottom side of a...
7400046 Semiconductor device with guard rings that are formed in each of the plural wiring layers  
A semiconductor IC device which includes a circuit region and a peripheral region on a main surface of a semiconductor substrate, a first insulating film formed over the main surface, external...
7387913 3D optoelectronic micro system  
A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in...
7378748 Solid-state imaging device and method for manufacturing the same  
A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing,...
7378727 Memory device and a method of forming a memory device  
A memory device includes a semiconductor substrate having a surface, a plurality of first and second conductive lines, a plurality of memory cells, and a plurality of landing pads. Each of the...
7378721 Chip on lead frame for small package speed sensor  
A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds...
7372142 Vertical conduction power electronic device package and corresponding assembling method  
A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at...
7372135 Multi-chip image sensor module  
A multi-chip image sensor module includes a flexible module board, an image sensor chip, a transparent cover, and at least an IC chip. The flexible module board has a first die-attached portion, a...
7368809 Pillar grid array package  
A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an...
7368749 Method of detecting misalignment of ion implantation area  
A method of detecting misalignment of ion implantation areas comprises forming at least one standard pattern consisting of a first area and a second area for use in measuring resistance, implanting...
7348210 Post bump passivation for soft error protection  
A structure and a method for forming the same. The method includes (a) providing a structure which includes (i) a dielectric layer, (ii) an electrically conducting bond pad on and in direct...
7344919 Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener  
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of...
7335971 Method for protecting encapsulated sensor structures using stack packaging  
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the...
7321166 Wiring board having connecting wiring between electrode plane and connecting pad  
It is to provide a wiring board for a semiconductor integrated circuit package, which exhibits an excellent signal property and a high effect for decreasing the switching noise at the time of...
7297571 Electrostatically actuated low response time power commutation micro-switches  
The field of the invention is that of microsystems of the electrostatically actuated microswitch type that are used in electronics to carry out switching functions, especially in the microwave...
Matches 1 - 50 out of 76 1 2 >