Matches 1 - 9 out of 9
Match Document Document Title
7381586 Methods for manufacturing thin film transistors that include selectively forming an active channel layer from a solution  
A method for manufacturing TFTs is provided. It can be applied to both inverted staggered and co-planar TFT structures. The manufacturing method for the staggered TFT includes the formation of a...
7341882 Method for forming an opto-electronic device  
A method for forming an opto-electronic device through low temperature processes is provided. An active layer is bonded to a substrate by a common adhesive to maintain or increase the luminous...
RE40137 Methods for forming integrated circuits within substrates  
The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a...
7338882 Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same  
A method of fabricating a nano silicon on insulator (SOI) wafer having an excellent thickness evenness without performing a chemical mechanical polishing (CMP) and a wafer fabricated by the same...
7307006 Method of manufacturing semiconductor device  
It is an object of the present invention to provide a technology to manufacture a semiconductor sheet or a semiconductor chip with a high yield using a circuit having a thin film transistor. A...
7294587 Component built-in module and method for producing the same  
A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an...
7256455 Double gate semiconductor device having a metal gate  
A semiconductor device may include a substrate, an insulating layer formed on the substrate and a conductive fin formed on the insulating layer. The conductive fin may include a number of side...
7235423 Molded memory card production using carrier strip  
Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through...
7192805 Semiconductor device and method of manufacturing the same  
A semiconductor device includes at least one semiconductor structure having a plurality of external connection portions on an upper surface, and an insulating member which is made of a resin...
Matches 1 - 9 out of 9