|
Match
|
Document |
Document Title |
|
|
4135292 |
Integrated circuit contact and method for fabricating the same
An integrated circuit aluminum-silicon electrical contact may be fabricated in a diffusion region formed in a monocrystalline silicon semiconductor layer by converting the upper portion of the...
|
|
|
4133704 |
Method of forming diodes by amorphous implantations and concurrent annealing, monocrystalline reconversion and oxide passivation in <100> N-type silicon
Boron implantation regions in <100> N-type silicon are subjected to a severe damage implant before anneal in a strongly oxidizing atmosphere that provides a passivating silicon dioxide...
|
|
|
4130891 |
Methods of gray scale recording and archival memory target produced thereby
One of a multiplicity of data values is permanently recorded at each data site in a two-dimensional data site array defined upon the surface of a semiconductor diode target by implanting an...
|
|
|
4128439 |
Method for forming self-aligned field effect device by ion implantation and outdiffusion
A method is provided for making a field effect transistor which comprises forming a layer of an ion beam masking material on the surface of a semiconductor body of one-type conductivity having at...
|
|
|
4118250 |
Process for producing integrated circuit devices by ion implantation
In this process of producing a bipolar transistor, all the regions of the device except the emitter region are formed by ion implantation through an inorganic dielectric layer of uniform thickness....
|
|
|
4118251 |
Process for the production of a locally high, inverse, current amplification in a planar transistor
A process for the production of a locally high inverse current amplification in a preferably double diffused or implanted inversely operated transistor which includes forming a low doped epitaxial...
|
|
|
4111719 |
Minimization of misfit dislocations in silicon by double implantation of arsenic and germanium
A method for forming N conductivity-type regions in a silicon substrate comprising ion implanting arsenic to form a region in said substrate having an arsenic atom concentration of at least 1 × 10...
|
|
|
4110779 |
High frequency transistor
A high-frequency transistor is provided having a small effective emitter width and a low base bulk resistance. The transistor is isolated from adjacent components by insulating material portions....
|
|
|
4107835 |
Fabrication of semiconductive devices
An improved Schottky barrier connection is made to a desired region of a silicon wafer by implanting the region with ions to peak at a particular depth; depositing a suitable contact material, such...
|
|
|
4106953 |
Method of producing an ion implanted tuning diode
Semiconductor devices with special reference to the process for fabricating tuning diodes. This invention includes the super-position of a multiplicity of ion implants and thermal redistribution...
|
|
|
4107719 |
Inverse planar transistor
This invention relates to an inverse planar transistor in which a base region of one conductivity type is formed in a semiconductor body of the opposite conductivity type adjacent a planar surface...
|
|
|
4106954 |
Method of manufacturing transistors by means of ion implantation
A method of manufacturing transistors by means of ion implantation is characterized by the implantation of a uniform extrinsic base zone, by providinbg a mask having at least two windows, and by...
|
|
|
4104784 |
Manufacturing a low voltage n-channel MOSFET device
A novel MOSFET circuit and method of manufacture utilizing a double ion implant process for manufacturing a low voltage high performance n-channel device that includes an enhancement transistor...
|
|
|
4096622 |
Ion implanted Schottky barrier diode
A Schottky barrier diode having a subsurface metalsemiconductor rectifying barrier with electrical rectification properties immune to semiconductor surface contamination. A special ion implantation...
|
|
|
RE29660 |
Process and product for making a single supply N-channel silicon gate device
A process is described wherein an N-channel silicon gate device operates from a single voltage supply. This process includes an ion implantation step into the gate region of both the load and...
|
|
|
4092209 |
Silicon implanted and bombarded with phosphorus ions
A composition of matter produced by a process wherein silicon is bombarded by phosphorus ions and phosphorus ions are implanted therein. A method for rendering silicon substantially unetchable in a...
|
|
|
4091408 |
High frequency ion implanted passivated semiconductor devices and mircowave intergrated circuits and planar processes for fabricating both
The specification describes new high frequency ion implanted semiconductor devices, novel microwave integrated circuits employing same, and a planar fabrication process for both wherein initially...
|
|
|
4089020 |
High power semiconductor diode
A semiconductor diode consists of a low resistivity n conductivity type semiconductor substrate, a high resistivity n conductivity type semiconductor layer, formed on the surface of the substrate,...
|
|
|
4070687 |
Composite channel field effect transistor and method of fabrication
An improved composite channel field effect transistor and method of fabrication, which exhibits high density characteristics and yields high performance with less sensivity to threshold shift due...
|
|
|
4064620 |
Ion implantation process for fabricating high frequency avalanche devices
Disclosed are new high frequency ion implanted passivated semiconductor devices and a planar fabrication process therefor wherein initially an ion implantation and PN junction passivation mask is...
|
|
|
4063964 |
Method for forming a self-aligned schottky barrier device guardring
The method allows the formation of a self-aligned guardring surrounding a Schottky barrier device. The resulting guardring is as close to the Schottky barrier device as is possible. This reduces...
|
|
|
4053924 |
Ion-implanted semiconductor abrupt junction
A semiconductor abrupt junction having a relatively heavily doped region of first conductivity type, a relatively lightly doped region of opposite conductivity type, and immediately adjacent the...
|
|
|
4045248 |
Making Schottky barrier devices
A semiconductor device comprising a semiconductor body portion having a shallow surface layer which is higher doped than the bulk of the semiconductor body portion, and a metal electrode on this...
|
|
|
4045251 |
Process for producing an inversely operated transistor
A process for producing an inversely operated transistor in a body of semiconductor material which has arranged on its surface collector, base and emitter zones and wherein the base is doped by ion...
|
|
|
4038106 |
Four-layer trapatt diode and method for making same
A method for making a four-layer P+PNN+ or N+NPP+ diode, and the diode, wherein the impurity profile about the PN junction is optimally graded for TRAPATT operation throughout the span of the...
|
|
|
4033787 |
Fabrication of semiconductor devices utilizing ion implantation
Semiconductor material stress sensors are provided where the sensing resistors therein have good electrical stability while being sufficiently protected without degrading sensor performance. This...
|
|
|
4033026 |
High density/high speed MOS process and device
A process for fabricating MOS silicon gate transistors which provide high density and high speed devices. The process includes the use of a boron ion implantation step to prevent punch-through and...
|
|
|
4030943 |
Planar process for making high frequency ion implanted passivated semiconductor devices and microwave integrated circuits
The specification describes new high frequency ion implanted semiconductor devices, novel microwave integrated circuits employing same, and a planar fabrication process for both wherein initially...
|
|
|
3979272 |
Method of producing semiconductor devices with minority charge carriers having a long lifetime and devices produced thereby
A method of fabricating semiconductor devices having a long lifetime for the minority charge carriers by applying a voltage across one electrode composed of a piece of intrinsic semiconductor...
|
|
|
3966501 |
Process of producing semiconductor devices
A silicon substrate is selectively implanted with ions and heated in a oxidizing atmosphere. Thus an oxide film is formed on the substrate so that portions of the film formed on regions implanted...
|
|
|
RE28704 |
Semiconductor devices
A method for making an IGFET is described. The method utilizes impurity ion implantation into the surface channel to determine the conductivity thereof. The advantages include special impurity...
|
|
|
3921199 |
Junction breakdown voltage by means of ion implanted compensation guard ring
The breakdown voltage of a semiconductor device with planar structure can be raised to the bulk breakdown level, if a high resistivity on lightly doped guard ring is formed around the priphery of...
|
|
|
3912545 |
Process and product for making a single supply N-channel silicon gate device
A process is described wherein an N-channel silicon gate device operates from a single voltage supply. This process includes an ion implantation step into the gate region of both the load and...
|
|
|
3909307 |
Process for compensating boundary charges in silicon thin layers epitaxially grown on a substrate
Process for compensating for the presence of boundary charges in semiconductor layers which are grown on a monocrystalline insulating substrate including the step of introducing doping atoms into...
|
|
|
3895392 |
Bipolar transistor structure having ion implanted region and method
Bipolar transistor structure formed of a semiconductor body having a substantially planar surface with collector, base and emitter regions formed therein and a layer of insulating material on said...
|
|
|
3890163 |
Ultra high frequency transistors manufacturing process
The production sequence of the UHF transistors includes at least one ion implantation step for doping the emitter, which takes place after doping of the base, through an emitter window etched from...
|
|
|
3856578 |
BIPOLAR TRANSISTORS AND METHOD OF MANUFACTURE
A bipolar transistor is fabricated by a process which involves a two-step base formation and an emitter formed by diffusion or ion implantation. One processing step in forming the base is either a...
|
|
|
3655457 |
METHOD OF MAKING OR MODIFYING A PN-JUNCTION BY ION IMPLANTATION
Monolithic integrated circuits are made utilizing various ion implantation techniques for making diodes, transistors, resistors, capacitors, underpass connections, sub-collector junctions, etc.,...
|
|
|
3653978 |
METHOD OF MAKING SEMICONDUCTOR DEVICES
A method for making an IGFET is described. The method utilizes impurity ion implantation into the surface channel to determine the conductivity thereof. The advantages include special impurity...
|
|
|
3635767 |
METHOD OF IMPLANTING IMPURITY IONS INTO THE SURFACE OF A SEMICONDUCTOR
Disclosed is a method of implanting impurity ions wherein such ions are implanted into the surface of a semiconductor partially exposed by a hole in two layers, one being made of silicon oxide and...
|
|
|
3533857 |
METHOD OF RESTORING CRYSTALS DAMAGED BY IRRADIATION
|
|
|
3534235 |
IGFET WITH OFFSET GATE AND BICONDUCTIVITY CHANNEL REGION
|
|
|
2842466 |
Method of making p-nu junction semiconductor unit
|
|
|
3589949 |
Title is not available
|
|
|
3563809 |
Title is not available
|
|
|
3728161 |
Title is not available
|
|
|
3756861 |
Title is not available
|