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6613631 |
Method of forming a non-volatile semiconductor memory device with a tunnel barrier film defined by side walls
A tunnel barrier structure includes a first semiconductor ridged portion having a grooved first top surface; an insulating layer burying the groove, the insulating layer having a first upper...
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6614069 |
Nonvolatile semiconductor memory cell and method for fabricating the memory cell
A nonvolatile semiconductor memory cell includes a transistor component formed on a substrate and a storage node that determines the switching state of the transistor component. The storage node is...
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6613630 |
Nonvolatile memory device and fabricating method thereof
A nonvolatile memory device includes two metal layers, which act respectively as a floating gate and a control gate, and each of which has a downwardly extended portion. Thereby, a surface area per...
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6611020 |
Memory cell structure
A new capacitor structure of a Flash memory (Flash) cells on a supporting substrate's existing topography, including existing topography provided by adjacent word lines is provided. The gate of the...
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6610577 |
Self-aligned polysilicon polish
A method for removing polysilicon from isolation regions on a substrate during semiconductor fabrication is disclosed. The method includes depositing a layer of polysilicon over the substrate, and...
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6607990 |
Semiconductor device and its manufacturing method
A semiconductor device includes a semiconductor substrate; a gate oxide film made on the semiconductor substrate; and first transistors each having a first gate formed on the gate oxide film and a...
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6605840 |
Scalable multi-bit flash memory cell and its memory array
The scalable multi-bit flash memory cell includes three regions: the first-side region, the gate region, and the second-side region, in which the gate region includes two stack-gate transistors and...
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6602750 |
Container structure for floating gate memory device and method for forming same
A floating gate memory device comprises a first conductive floating gate layer which is horizontally oriented and a second conductive floating gate layer which is predominantly vertically oriented....
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6602774 |
Selective salicidation process for electronic devices integrated in a semiconductor substrate
A selective silicidation process for electronic devices that are integrated on a semiconductor substrate is presented. The devices have a number of active elements formed with gate region that has...
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6600188 |
EEPROM with a neutralized doping at tunnel window edge
An improved method for fabricating a tunnel oxide window for use in an EEPROM memory cell is provided so as to produce better programming endurance. P-type lightly-doped drain regions are located...
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6596587 |
Shallow junction EEPROM device and process for fabricating the device
A shallow junction EEPROM device and process for fabricating the device includes the formation of a control-gate region and a tunnel region in a semiconductor substrate in which the control-gate...
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6596574 |
Method for forming a flash reference cell
A method is used to form a flash reference memory cell and comprises the following steps. A floating well is formed in a substrate. A first dielectric layer is formed to cover the substrate. A...
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6596588 |
Method of fabricating a flash memory cell
A semiconductor substrate has a V-shape structure positioned in the semiconductor substrate. A first ion implantation process is then performed to form a first doping region around the V-shape...
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6597036 |
Multi-value single electron memory using double-quantum dot and driving method thereof
A multi-value single electron memory using a multi-quantum dot, in which the floating gates (FG) of a EEPROM or a flash memory are formed to act as two quantum dots, and the two quantum dots are...
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6594193 |
Charge pump for negative differential resistance transistor
An integrated circuit device includes a charge pump for providing a bias signal to a field effect transistor (FET) that is capable of operating in a negative differential resistance mode. The bias...
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6594182 |
Semiconductor memory device having controlled impurity concentration profile, method for manufacturing thereof, and semiconductor manufacturing apparatus
A tunnel gate insulating film is formed on a substrate. Next, a floating gate electrode containing no impurities in the vicinities of upper and lower end surfaces is formed on the tunnel gate...
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6593186 |
Method for manufacturing non-volatile semiconductor memory device
In a non-volatile semiconductor memory device that has a floating gate that is formed on a semiconductor substrate with an intervening first gate insulation film, a second gate insulation film that...
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6593187 |
Method to fabricate a square poly spacer in flash
A square poly-spacer and making of the same are disclosed. The square poly-spacer is formed adjacent a floating poly-gate sharing a common source line with another floating poly-gate. The common...
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6590260 |
Memory device having improved programmability
A method for enhancing the operating characteristics of memory devices ( 400 C), such as flash memory devices, by manipulating the Fermi energy levels of the substrate ( 406 ) and the floating gate...
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6589835 |
Method of manufacturing flash memory
A process of manufacturing a flash memory device having a tunnel oxide layer with high reliability, low defect and interface trap by using semi-atmospheric pressure chemical vapor deposition...
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6589842 |
Manufacturing method of a gate-split flash memory
The present invention relates to discloses a manufacturing method of a gate-split flash memory, which is suitable for a self-align contact process and fully-salicide-compatible process. The present...
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6586331 |
Low sheet resistance of titanium salicide process
A method for establishing low sheet resistance for the Titanium Salicide process that teaches a C-54 TiSi x process by means of an additional vacuum bake. The present invention teaches an...
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6587396 |
Structure of horizontal surrounding gate flash memory cell
The present invention discloses a structure of a horizontal surrounding gate (HSG) flash memory cell. The HSG flash memory cell of the present invention is located on a trench of an isolation...
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6586302 |
Method of using trenching techniques to make a transistor with a floating gate
A method for making an electrically programmable and erasable memory cell is disclosed. Specifically, a method for creating a floating gate using shallow trench isolation-type techniques is...
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6586806 |
Method and structure for a single-sided non-self-aligned transistor
A transistor includes a non-self-aligned gate-terminal junction in a substrate having a relatively thick oxide layer disposed between a gate region and a terminal region and a relatively thin oxide...
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6583479 |
Sidewall NROM and method of manufacture thereof for non-volatile memory cells
An non-volatile read only memory transistor for use in a memory array is disclosed. The non-volatile read only memory transistor features a substantially vertically oriented channel fabricated in a...
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6583466 |
Vertical split gate flash memory device in an orthogonal array of rows and columns with devices in columns having shared source regions
A vertical transistor memory device includes FET cells formed in rows and columns with the rows orthogonally arranged relative to the columns. Several cells in a single row have a common source...
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6582998 |
Method for fabricating nonvolatile semiconductor memory device
Ions of arsenic are selectively implanted at a high concentration into a substrate through a first passivation film of silicon dioxide to obtain a shallow junction, thereby forming a source region...
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6580118 |
Non-volatile semiconductor memory cell having a metal oxide dielectric, and method for fabricating the memory cell
A non-volatile semiconductor memory cell and an associated method are disclosed, in which a conventional dielectric ONO layer ( 10 ) is replaced by a very thin metal oxide layer ( 6 ) of WO x ...
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6580120 |
Two bit non-volatile electrically erasable and programmable memory structure, a process for producing said memory structure and methods for programming, reading and erasing said memory structure
A planar high-density EEPROM split gate memory structure, is formed using two poly-layers and chemical-mechanical-polishing processes. Stripes of contiguous poly lines, alternately formed in one of...
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6576515 |
Method of forming transistor gate
A method of forming a transistor gate. A substrate having a source/drain terminals, a gate dielectric layer, a lower section of a floating gate, a dielectric layer over the substrate is provided....
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6574143 |
Memory device using hot charge carrier converters
A flash memory cell is based on a floating gate transistor design in which a floating gate is separated from a channel by a tunnel oxide. The cell is programmed and erased by electrons tunnelling...
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6573555 |
Source side injection programming and tip erasing P-channel split gate flash memory cell
A split gate P-channel flash memory cell and method of forming a split gate P-channel flash memory cell which avoids of high erasing voltage, reverse tunneling during programming, drain disturb and...
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6573141 |
In-situ etch and pre-clean for high quality thin oxides
The present invention provides a method for improving the quality of thin oxides formed upon a semiconductor body. The etch and pre-clean processes are performed in situ, taking place in a single...
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6573140 |
Process for making a dual bit memory device with isolated polysilicon floating gates
The present invention relates generally to semiconductor memory devices and more particularly to multi-bit flash electrically erasable programmable read only memory (EEPROM) devices that employ...
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6570215 |
Nonvolatile memories with floating gate spacers, and methods of fabrication
In a nonvolatile memory, a floating gate includes a portion of a conductive layer ( 150 ), and also includes conductive spacers ( 610 ). The spacers increase the capacitive coupling between the...
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6570212 |
Complementary avalanche injection EEPROM cell
A non-volatile memory cell at least partially formed in a semiconductor substrate, comprising a first avalanche injection element having a first active region of a first conductivity type and a...
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6570211 |
2Bit/cell architecture for floating gate flash memory product and associated method
The invention relates to a flash memory devices and a method associated therewith in which combined source/drain regions are shared by more than two memory cells. For example, source/drain regions...
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6570209 |
Merged self-aligned source and ONO capacitor for split gate non-volatile memory
A non-volatile memory cell having a oxide-nitride-oxide (ONO) capacitor merged with a polysilicon strap diffusion region is obtained by forming a film stack on a surface of a substrate, said film...
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6563154 |
Polysilicon layer having improved roughness after POCl3 doping
An improved method for depositing the polysilicon layer from which a gate pedestal is later formed is described. Deposition takes place in two stages. Initially, the conventional deposition...
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6562682 |
Method for forming gate
The invention provides a method for forming a semiconductor gate, by forming spacers to isolate the interface between the HDP dielectric layer and the polysilicon gate being exposed, thereby...
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6559470 |
Negative differential resistance field effect transistor (NDR-FET) and circuits using the same
An improved negative differential resistance field effect transistor (NDR-FET) is disclosed. The NDR FET includes a charge trapping layer formed at or extremely near to an interface between a...
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6559007 |
Method for forming flash memory device having a tunnel dielectric comprising nitrided oxide
The present invention provides a flash memory integrated circuit and a method of fabricating the same. A tunnel dielectric in an erasable programmable read only memory (EPROM) device is nitrided...
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6551879 |
Method for forming an oxide layer on a nitride layer
A method for forming a semiconductor device that includes defining a substrate to include a peripheral section and a core section, masking the peripheral section of the substrate, growing a first...
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6551946 |
TWO-STEP OXIDATION PROCESS FOR OXIDIZING A SILICON SUBSTRATE WHEREIN THE FIRST STEP IS CARRIED OUT AT A TEMPERATURE BELOW THE VISCOELASTIC TEMPERATURE OF SILICON DIOXIDE AND THE SECOND STEP IS CARRIED OUT AT A TEMPERATURE ABOVE THE VISCOELASTIC TEMPERATURE
A process for forming an oxide layer includes forming a first oxide portion over a substrate at a temperature below a threshold temperature. A second oxide portion is formed under the first oxide...
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6548830 |
Semiconductor device formed of single crystal grains in a grid pattern
A semiconductor device comprising a source/drain region and a channel region formed in a silicon thin film composed of a group of silicon single crystal grains which are each approximately...
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6548353 |
Method of making nonvolatile memory device having reduced capacitance between floating gate and substrate
This invention discloses a method of making a nonvolatile memory device, wherein the capacitance between the floating gate and the substrate is reduced to result in a high capacitive coupling...
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6544844 |
Method for forming a flash memory cell having contoured floating gate surface
Methods are provided for forming a contoured floating gate for use in a floating gate memory cell. One method includes forming a floating gate that has a polysilicon layer over a substrate, forming...
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6545313 |
EEPROM tunnel window for program injection via P&plus contacted inversion
An improved method for fabricating a tunnel oxide window for use in an EEPROM memory cell is provided so as to produce better programming endurance. A P+ implant is provided at the tunnel window...
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6544848 |
Method to form an asymmetrical non-volatile memory device using small in-situ doped polysilicon spacers
A new method of forming a sharp tip on a floating gate in the fabrication of a EEPROM memory cell is described. A first gate dielectric layer is provided on a substrate. A second gate dielectric...
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