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8183581 |
LED arrangement
An LED arrangement (light emitting diode) has a plurality of adjacent radiating LEDs that are nearly identically aligned for forming an extended area light source. The LEDs are attached to a...
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8183591 |
Light-emitting devices
Light-emitting devices are provided, the light-emitting devices include a light-emitting structure layer having a first conductive layer, a light-emitting layer and a second conductive layer...
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8183585 |
Lighting module
A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive...
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8182111 |
Low profile flexible cable lighting assemblies and methods of making same
A cable lighting assembly (10) comprising a flexible electrical cable (14, 47) and an LED (43). The electrical insulation of the electrical cable has a portion that is removed to expose at least...
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8183761 |
Light emitting apparatus
A light emitting apparatus can include a base, a light emitting device and a resin portion on one side of the base for covering the light emitting device, a wiring thereof, and the like. The light...
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8183592 |
Light emitting device having a pluralilty of light emitting cells and package mounting the same
A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on...
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8183590 |
Image display apparatus having raised parts disposed on a substrate
An image display apparatus displaying an image by selectively emitting light from a plurality of semiconductor light emitting elements being regularly arranged, includes a substrate; a first...
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8178891 |
Semiconductor light emitting device and method for manufacturing the same
Certain embodiments provide a semiconductor light emitting device including: a first metal layer; a stack film including a p-type nitride semiconductor layer, an active layer, and an n-type nitride...
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8179037 |
High power LED module assembly and method for manufacturing the same
A high power LED module assembly may include at least one high power LED module each of which includes a MCPCB and a high power LED disposed on the MCPCB, a flex tube which includes a base engaging...
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8178892 |
LED chip having micro-lens structure
A light-emitting diode (LED) chip having a micro-lens structure includes a light-emitting structure and a light guide lens. The light-emitting structure emits a light from a light-emitting surface...
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8178888 |
Semiconductor light emitting devices with high color rendering
A packaged light emitting device (LED) includes a light emitting diode configured to emit primary light having a peak wavelength that is less than about 465 nm and having a shoulder emission...
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8178895 |
Semiconductor light-emiting device and method
A semiconductor light-emitting device can include a submount on which a semiconductor light-emitting element is mounted. The device can have a high light utilization efficiency with high...
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8178886 |
Multi-layered LED epitaxial structure with light emitting unit
A method for manufacturing a semiconductor light emitting device includes: (a) providing a temporary substrate; (b) forming a multi-layered LED epitaxial structure, having at least one light...
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8178890 |
Light emitting diode package structure
A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip...
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8178893 |
Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate
The invention provides a semiconductor element mounting substrate that, by virtue of an improvement in thermal conduction efficiency between the substrate and another member, can reliably prevent,...
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8178894 |
Light emitting device package and method of fabricating the same
A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting...
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8174005 |
Organic light emitting diode lighting apparatus
An organic light emitting diode lighting apparatus is disclosed. The apparatus includes a plurality of electrode lines that feed current to or from a plurality of light emitting diodes, and a...
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8174038 |
Light emitting device
A light emitting device includes a board, a semiconductor light emitting element formed on the board optionally via a submount, a cap sealing the semiconductor light emitting element and a...
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8173991 |
Optoelectronic semiconductor chip having a multiple quantum well structure
An optoelectronic semiconductor chip is specified, which has an active zone (20) containing a multi quantum well structure provided for generating electromagnetic radiation, which comprises a...
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8174027 |
Semiconductor light emitting device and method for manufacturing same
A semiconductor light emitting device, includes: a substrate including a first major surface and a second major surface, the first major surface including a recess and a protrusion, the second...
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8174043 |
Light emitting apparatus
In a light-emitting apparatus using a silicone resin as a sealant of its light-emitting element, it is intended to prevent discoloration of its lead frame. A light-emitting element fixed to a lead...
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8174039 |
Light-emitting diode device with high luminescent efficiency
The invention discloses a light-emitting diode including a substrate, a main stack structure, a plurality of secondary pillars, a transparent insulating material, a transparent conducting layer, a...
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8174044 |
Light emitting diode package and method for forming the same
A light emitting diode package is provided, which includes a semiconductor substrate having a first surface and a second surface; at least a through-hole passing through the semiconductor...
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8168996 |
Semiconductor light emitting device
An excellent light emitting element capable of improving problems caused by a material having high light-reflectivity and susceptible to electromigration, especially Al used for the electrode. FIG....
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8168994 |
Light emitting diode comprising semiconductor nanocrystal complexes
A light emitting diode (LED) formed by depositing an LED chip and coupling a stability layer to the LED chip. Semiconductor nanocrystals are placed in a first matrix material to form a nanocrystal...
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8168987 |
Semiconductor light emitting device
The embodiment discloses a semiconductor light emitting device. The semiconductor light emitting device includes a first conductive semiconductor layer; a first electrode layer below the first...
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8168991 |
Optical element and optoelectronic component comprising such an optical element
An optical element (1) is specified comprising an optical body (2) containing a plastic material. The optical body (2) is completely encapsulated by a protective layer (3) containing a silicon...
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8168998 |
LED with remote phosphor layer and reflective submount
A light emitting device comprises a flip-chip light emitting diode (LED) die mounted on a submount. The top surface of the submount has a reflective layer. Over the LED die is molded a...
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8168995 |
Nitride based semiconductor light emitting diode
A nitride based semiconductor LED is provided. In the nitride based semiconductor LED, an n-type nitride semiconductor layer is formed on a substrate. The n-type nitride semiconductor layer has the...
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8168993 |
Light emtting device, method for manufacturing light emitting device, and light emitting apparatus
A light emitting device according to the embodiment includes a reflecting layer; an adhesion layer including an oxide-based material on the reflecting layer; an ohmic contact layer on the adhesion...
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8169046 |
Light emitting diode with a temperature detecting pattern and manufacturing method thereof
A light emitting diode (LED) includes a substrate, a temperature detecting pattern, and a semiconductor structure. The temperature detecting pattern is formed on the substrate. Then the...
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8168990 |
Apparatus for dissipating thermal energy generated by current flow in semiconductor circuits
A thermal energy dissipating arrangement includes a semiconductor device and a thermally conductive medium. The semiconductor device includes a semiconductor circuit defining a semiconductor...
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8168997 |
Light emitting diode package
Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum...
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8169141 |
Method and apparatus for generating phosphor film with textured surface
An optical device deploring a phosphor layer having a textured surface to improve output of visual light is disclosed. A light emitting device includes a solid state light emitter and a phosphor...
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8164102 |
Semiconductor light emitting device
A semiconductor light emitting device may include a first lead; a second lead; a first semiconductor light emitting element mounted on the first lead, being configured to emit a light having an...
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8164103 |
Multiple circuit power supply interface for light-emitting-diode color mixing
The present invention discloses an light emitting diode (LED) light source and an interface for providing power to the LED. The LED light source includes an LED unit and a second coupling unit. The...
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8164105 |
Light emitting device and method for fabricating the same
Disclosed is a light emitting device. The light emitting device comprises a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, a second conductive...
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8162510 |
LED chip package structure with multifunctional integrated chips and a method for making the same
A LED chip package structure with multifunctional integrated chips includes a substrate unit, a light-emitting unit, a chip unit, and a package colloid unit. The light-emitting unit has a plurality...
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8164267 |
Electro-optical device, matrix substrate, and electronic apparatus
To provide a wiring layout of electric power lines, which improves the aperture ratio of the pixel while forming pixels with the same pixel pitch. An electric-optical apparatus according to the...
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8159835 |
Laser apparatus
A laser apparatus comprises: a lead frame comprising a first outer lead and a first inner lead connected to the first outer lead; mold resin that has a top surface, does not seal the first outer...
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8158988 |
Interlevel conductive light shield
A CMOS image sensor pixel includes a conductive light shield, which is located between a first dielectric layer and a second dielectric layer. At least one via extends from a top surface of the...
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8158997 |
Optical element package and method of manufacturing the same
An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex...
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8158999 |
Reinforced chip package structure
A reinforced chip package structure includes a light emitting element, a base, and a package member. The base has a base deck and a jutting bearing deck on the base deck to hold the light emitting...
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8158996 |
Semiconductor light emitting device package
A semiconductor light emitting device package according to an embodiment comprising: a package body comprising a groove section; an electrode in the groove section; at least one semiconductor light...
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8159000 |
LED package having an array of light emitting cells coupled in series
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body....
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8154031 |
Module comprising radiation-emitting semiconductor bodies
A module comprising a regular arrangement of individual radiation-emitting semiconductor bodies (1) which are applied on a mounting area (6) of a carrier (2), wherein a wire connection is fitted...
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8154046 |
Semiconductor light emitting device including bonding layer and semiconductor light emitting device package
A light emitting device is provided. The light emitting device comprises: a conductive support substrate; a bonding layer on the conductive support substrate; a reflective layer on the bonding...
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8154033 |
LED device and method of packaging the same
A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent...
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8154045 |
Semiconductor light-emitting device
A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The...
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8154040 |
Light-emitting diode arrangement and method for producing the same
A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side (101) and which are fixed by their...
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