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7345316 |
Wafer level packaging for optoelectronic devices
An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A...
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7345298 |
Horizontal emitting, vertical emitting, beam shaped, distributed feedback (DFB) lasers by growth over a patterned substrate
A structure using integrated optical elements is comprised of a substrate, a buffer layer grown on the substrate, one or more patterned layers formed on the buffer layer and one or more active...
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7342259 |
Optical element
An optical element includes a substrate, a columnar section that is formed above the substrate and has an upper surface for light emission or light incidence, a first protection layer formed above...
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7342254 |
Light-emitting device having a diffractive film on its light-output face and manufacturing method therefor
Affords efficiently and at low cost practical, tiny light-emitting devices having an optically diffractive film on their light-output face. A light-emitting device (LD) includes a diffractive film...
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7342246 |
Light-emitting element and display device and lighting device using same
A light-emitting element is provided having a layered structure composed of at least a light-emitting layer having a light-emitting region and a reflective layer for reflecting light emitted from...
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7339201 |
Light emitting diode and process for producing the same
A light emitting diode includes a casing having a concave surface, a reflecting surface formed by depositing a metallic layer on a concave surface thereof, and a lead having a light emitting...
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7339200 |
Light-emitting diode and vehicular lamp
A light-emitting diode including a curved surface portion 14 a A formed in the front face of a sealing member 14 with the cross-sectional shape of the curved surface portion being in the shape...
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7339202 |
Backlight module and a light-emitting-diode package structure therefor
The LED package structure includes a substrate, an LED chip, a plastic package body, and two leading legs. In addition, the LED chip is arranged on the substrate and covered by the packaging...
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7339199 |
Semiconductor package including light emitter and IC
The is to disclose a semiconductor package featuring inclusion of light emitter(s) providing light to indicate the states of the semiconductor package as a whole and/or the chip(s) therein. The...
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7339198 |
Light-emitting diode chip package body and packaging method thereof
AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface....
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7335920 |
LED with current confinement structure and surface roughening
An LED having a p-type layer of material with an associated p-contact, an n-type layer of material with an associated n-contact and an active region between the p-type layer and the n-type layer,...
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7335924 |
High-brightness light emitting diode having reflective layer
An LED structure is disclosed herein, which comprises, sequentially arranged in the following order, a light generating structure, a non-alloy ohmic contact layer, a metallic layer, and a...
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7335916 |
Electrode structure, and semiconductor light-emitting device having the same
A semiconductor light emitting device comprising: a transparent substrate; an electron injection layer of N-type GaN-based semiconductor; an active layer on the electron injection layer; a hole...
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7334907 |
Light-emitting diode
A light-emitting diode comprising a substrate having a surface on which connecting electrodes are formed and another surface on which terminal electrodes conducting with the connecting electrodes...
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7332365 |
Method for fabricating group-III nitride devices and devices fabricated using method
A method according to the present invention for fabricating high light extraction photonic devices comprising growing an epitaxial semiconductor structure on a substrate and depositing a first...
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7332862 |
Led lamp including a resist bonded to a copper film
In an LED lamp, a copper film is first formed on a substrate by plating. A resist is then bonded onto the copper film so that shaped like a ring viewed from the whole of the LED lamp. A nickel and...
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7332746 |
Light-emitting apparatus
A novel configuration of a light-emitting apparatus that can emit white light, in which a primary light source composed of a group III nitride compound semiconductor is used in combination with a...
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7332747 |
Light-emitting diode for decoration
A light emitting diode includes a light emitting body, a lead frame supplying power to the light emitting body and a light transmitting resin covering the light emitting body and part of the lead...
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7332106 |
Light-emitting device and phosphor
The present invention provides a light-emitting device having an excitation source which emits a light having a wavelength of from 420 to 500 nm and a phosphor in combination, and having a high...
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7329905 |
Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
A packaged light emitting device includes a carrier substrate having a top surface and a bottom surface, first and second conductive vias extending from the top surface of the substrate to the...
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7329942 |
Array-type modularized light-emitting diode structure and a method for packaging the structure
An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate and an upper...
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7329904 |
LED lamp device
An LED lamp device includes a light emitting element that emits light in a blue-based or violet-based color, an LED having a fluorescent material that emits fluorescent light in a yellow to...
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7329982 |
LED package with non-bonded optical element
Light sources are disclosed utilizing LED dies having at least one emitting surface. An optical element is provided for efficiently extracting light out of an LED die by controlling the angular...
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7329371 |
Red phosphor for LED based lighting
Disclosed are phosphor compositions having the formula (RE 1-y Ce y )Mg 2-x Li x Si 3-x P x O 12 , where RE is at least one of Sc, Lu, Gd, Y, and Tb, 0.0001<x<0.1 and 0.001<y<0.1. When...
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7329903 |
Semiconductor light emitting element having three side surfaces inclined to connect the top and bottom surfaces of the transparent substrate
For the purpose of enhancing the light extracting efficiency, improving the production yield and elongating the lifetime of a semiconductor light emitting element or a semiconductor light emitting...
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7326967 |
Light emitting diode having an omnidirectional reflector including a transparent conductive layer
The present invention is related to a light emitting diode of an omnidirectional reflector providing with a transparent conductive layer. In the present invention, a cohesion layer is formed...
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7326966 |
Electroluminescence display device and method of manufacturing the same
An electroluminescence display device including a thin film transistor layer formed on a substrate, at least one insulating layer, and a pixel layer that includes a first electrode layer, a second...
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7323723 |
Semiconductor light-emitting device using phosphors for performing wavelength conversion
A semiconductor light-emitting device includes substrate ( 3 ), a plurality of light-emitting-element-layers ( 10 a, 10 b, 10 c, . . . ) of semiconductor material formed on the substrate ( 3 )...
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7323720 |
Light-emitting device, image forming apparatus, and electronic apparatus with an integrated circuit mounted on a substrate
A light-emitting device includes a substrate having a plurality of light-emitting elements and a light emission region arranged on one surface thereof, light being emitted from one surface of the...
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7323724 |
Nitride semiconductor device
A nitride semiconductor device includes a semiconductor layer, a first electrode for establishing an ohmic contact disposed on the semiconductor layer, and a second electrode on the first...
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7321161 |
LED package assembly with datum reference feature
An LED package includes a datum reference feature that is external to the insulating body of the LED package and has a known, fixed relationship to the heat sink. The LED die is mounted to the heat...
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7321137 |
RGB light emitting diode package with improved color mixing properties
An RGB light emitting diode package with improved color mixing properties includes red, green, and blue light emitting diode chips provided on a reflector. A photomixing material and a filler resin...
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7319243 |
Flat panel display device and method of manufacturing the same
A flat panel display includes a pixel electrode having an opening portion formed on an insulating substrate, a semiconductor layer formed over a surface of the insulating substrate, spaced apart...
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7319244 |
Lens assembly for sideward light emission
A lens assembly for sideward light emission includes a lens and a lens cap. The lens has a cup portion, an open end portion, and first and second refracting portions. The cup portion surrounds a...
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7319246 |
Luminescent sheet covering for LEDs
A lighting apparatus comprising at least one light emitting diode is disposed on an interconnect board to emit ultraviolet or blue radiation. A polymeric layer including a luminophor is disposed...
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7319242 |
Substrate with recess portion for microlens, microlens substrate, transmissive screen, rear type projector, and method of manufacturing substrate with recess portion for microlens
A microlens substrate is provided having a plurality of first microlenses and a plurality of second microlenses which are located between the plurality of first microlenses. The second microlenses...
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7319245 |
Radiation emitting semiconductor component with luminescent conversion element
A radiation-emitting semiconductor component, comprising a semiconductor body which emits a primary light, a luminescent conversion element which emits fluorescent light, in which the luminescent...
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7318651 |
Flash module with quantum dot light conversion
A flash module includes a first light source emitting a first primary light has a first wavelength-converting overlay disposed on the first light source to provide a first color of light. The first...
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7316851 |
Electroluminescent material, electroluminescent element and color conversion filter
An electroluminescent element is disclosed, comprising an electroluminescent material and a fluorescent substance emitting light having an emission maximum at the wavelength different from that of...
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7317211 |
Light-emitting device, light-emitting apparatus, image display apparatus, method of manufacturing light-emitting device, and method of manufacturing image display apparatus
Light-emitting devices, light-emitting apparatuses, image display apparatuses and methods of manufacturing same are provided. The devices and apparatuses include a transparent electrode that is...
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7317212 |
Light emitting diode
The present invention relates to a light emitting diode. According to the present invention, a structure capable of reducing total reflection of light, including micro-lenses or projections made of...
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7315048 |
Method and apparatus for mixing light emitted by a plurality of solid-state light emitters
In one embodiment, light emitted by a plurality of solid-state light emitters is mixed by mounting the plurality of solid-state light emitters on a transparent to translucent substrate so that they...
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7315046 |
Semiconductor light-emitting device and method for manufacturing the device
A semiconductor light-emitting device has a pair of leads placed in parallel, a light-emitting element on the upper end of one lead, a bonding wire for electrically connecting the semiconductor...
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7315049 |
LED assembly with vented circuit board
A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a...
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7312520 |
Interface module for connecting LSI packages, and LSI-incorporating apparatus
An interface module for connecting LSI packages includes a connecting member which is to be mounted on an LSI package including an LSI chip and which includes lines to be electrically connected to...
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7312477 |
Led lamp for light source
Whereas incandescent light bulbs and other similar light sources known in the related art emit light in all directions, LED lamps can emit light in a single direction, and this is manifested in the...
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7312476 |
Optical element and its manufacturing method
To improve the reliability of an optical element and its manufacturing method. An optical element 100 includes a substrate 110 , a columnar section 130 formed above the substrate 110 and...
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7311858 |
Silicate-based yellow-green phosphors
Novel phosphor systems are disclosed having the formula A 2 SiO 4 :Eu 2+ D, where A is at least one of a divalent metal selected from the group consisting of Sr, Ca, Ba, Mg, Zn, and Cd; and D is a...
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7312479 |
Side-emission type semiconductor light-emitting device and manufacturing method thereof
A side-emission type semiconductor light-emitting device 10 includes a substrate 12 , and the substrate 12 is provided with a case 14 formed of a resin having opacity and reflectivity. The...
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7309882 |
Surface light source with photonic crystal LED
A backlight system ( 20 ) includes a light guide plate ( 220 ), a reflector ( 230 ) disposed below the light guide plate, and an LED ( 210 ) emitting light beams into the light guide plate. The LED...
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