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7626207 Integrated optocoupler with organic light emitter and inorganic photodetector  
An optocoupler has an organic light emitter and an inorganic photodetector with a detector area, the detector area being optically coupled to the organic light emitter. The organic light emitter...
7626153 System and/or method for reading, measuring and/or controlling intensity of light emitted from an LED  
A system and/or a method for reads, measures and/or controls intensity of light emitted from a light-emitting diode (LED). The system and/or the method have a light intensity detector adjacent to...
7622743 Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device  
An LED bare chip which is one type of a semiconductor light emitting device ( 2 ) includes a multilayer epitaxial structure ( 6 ) composed of a p-GaN layer ( 12 ), an InGaN/GaN MQW light emitting...
7619260 Light-emitting diode and method for its production  
A Light-emitting diode which comprises a pair of metal plate leads connected to a light-emitting element. The pair of metal plate leads comprise, at the edges of the metal plates, surface...
7612385 High power light-emitting diode package comprising substrate having beacon  
Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip...
7612383 Reflector packages and semiconductor light emitting devices including the same  
Reflectors for a semiconductor light emitting device include a lower sidewall portion defining a reflective cavity. A substantially horizontal shoulder portion extends outwardly from the sloped...
7608862 Light emitting device and a lighting apparatus  
A light emitting device comprises at least two lead wires, a light emitting element that is disposed on an end portion of at least one of said lead wires and connected electrically with the end...
7608860 Light emitting devices suitable for flip-chip bonding  
Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive...
7605402 Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver  
A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a...
7593236 Semiconductor light emitting device  
A semiconductor light emitting device 1 includes: a plurality of light emitting elements 2 ; a light emitting element mounting member 3 on which said light emitting elements 2 are mounted;...
7592654 Reduced crosstalk CMOS image sensors  
CMOS image sensor having high sensitivity and low crosstalk, particularly at far-red to infrared wavelengths, and a method for fabricating a CMOS image sensor. A CMOS image sensor has a substrate,...
7592633 Semiconductor light emitting device  
A semiconductor lamination portion is formed on a substrate by laminating semiconductor layers so as to form a light emitting layer, and a plurality of light emitting units are formed by separating...
7592631 LED package frame and LED package having the same  
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted...
7589355 Light emitting diode, method of manufacturing light emitting diode, light emitting diode backlight, light emitting diode illuminating device, light emitting diode display, and electronic apparatus  
A light emitting diode is provided. The light emitting diode includes a semiconductor layer that forms a light emitting diode structure and has a major face and an end face inclined at an angle θ...
7586125 Light emitting diode package structure and fabricating method thereof  
A light emitting diode (LED) package structure including a first substrate, an LED chip, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface...
7583873 Fabrication method of optical module, optical module, and platform for optical module  
In assembly of a number of optical devices (optical waveguide devices) to fabricate an optical module, the fabrication method of the optical module comprising: filling a plurality of openings for...
7582909 Mounting and adhesive layer for semiconductor components  
An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting...
7579628 Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave  
A semiconductor light emitting device of the present invention includes a plurality of light emitting elements, a package body for storing the light emitting elements, wiring patterns being...
7576402 Semiconductor device, method of manufacturing the same, and camera module  
The invention provides a package type semiconductor device and a method of manufacturing the same where reliability and yield are enhanced without making a manufacturing process complex. A resin...
7576371 Structures and methods to improve the crosstalk between adjacent pixels of back-illuminated photodiode arrays  
Structures and methods to improve the crosstalk between adjacent pixels of back-illuminated photodiode arrays on a substrate having first and second surfaces, including providing a first matrix of...
7573189 Illumination system comprising a radiation source and a fluorescent material  
The invention relates to an illumination system comprising a radiation source and a fluorescent material comprising at least one phosphor capable of absorbing a portion of the light emitted by the...
7573076 Vertical gallium-nitride based light emitting diode  
A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably...
7573071 Light emitting diode package  
A light emitting diode (LED) package including a carrier, an LED chip, a first transparent encapsulant, a transparent cap, and a second transparent encapsulant is provided. The carrier has a...
7569989 Light emitting device  
A light emitting device, free from change of color even when the wavelength of a light emitting element shifts, includes a light emitting element ( 106 ) for emitting primary light having an...
7569859 Manufacturing method of light emitting device and manufacturing device thereof  
It is an object of the present invention to provide a light emitting device having a structure wherein oxygen and moisture are prevented from reaching to the light emitting device, and to provide a...
7566909 Surface emitting type device having a resistance to damage by static electricity  
A surface-emitting type device includes a rectification section including a substrate and a first semiconductor layer formed above the substrate, an emission section including a second...
7564111 Imaging apparatus  
In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible...
7564067 Device having spacers  
An electroluminescent device comprising: a substrate; one or more light-emitting elements formed over the substrate, the one or more light-emitting elements including first and second spaced-apart...
7564066 Multi-chip assembly with optically coupled die  
Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the...
7564065 Light emitting device and a lighting apparatus  
The present invention provides in one embodiment a light emitting device that has a high efficacy even in a range of low color temperatures, a long-term reliability, and an improved color rendering...
7561610 Semiconductor laser apparatus and optical apparatus  
A semiconductor laser apparatus comprises a first semiconductor laser device that emits a blue-violet laser beam, a second semiconductor laser device that emits a red laser beam, and a conductive...
7557381 Semiconductor component  
A semiconductor component having a light-emitting semiconductor layer or a light-emitting semiconductor element, two contact locations and a vertically or horizontally patterned carrier substrate,...
7557380 Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads  
Light emitting devices include an active region of semiconductor material and a first contact on the active region. The first contact is configured such that photons emitted by the active region...
7556400 Backside accessible display  
A light board is made with a receptacle substrate for holding cassette light units. The convenience of assembly and disassembly of the light units from the receptacle substrate makes the product...
7547566 Organic electroluminescent device and method of manufacturing the same  
The invention provides an organic electroluminescent device and a method of manufacturing the same which conveniently reduce or suppress the transfer of ionic impurities into a light-emitting...
7531842 Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate  
A semiconductor wafer comprises an SOI comprising a device layer on an oxide layer supported on a handle layer. Micro-mirrors are formed in the device layer, and access bores extend through the...
7528422 Package for a light emitting element with integrated electrostatic discharge protection  
A package includes a substrate with a recess in which a light emitting element is mounted. A surface of the substrate forms an exterior surface of the package. A lid may be attached to the...
7528420 Image sensing devices and methods for fabricating the same  
Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device includes a first substrate having a first side and a second side opposing each other. A...
7525131 Photoelectric surface and photodetector  
Disclosed is a photoelectric surface including: a first group III nitride semiconductor layer that produces photoelectrons according to incidence of ultraviolet rays; and a second group III nitride...
7525124 Submount for light emitting diode and its manufacturing method  
A submount for a light emitting diode and its manufacturing method, the submount including a reflector and having a compact size. The submount for the light emitting diode comprises a Si base...
7525123 Semiconductor device  
A semiconductor device with high reliability, low voltage, and high luminance is provided by preventing detachment of an electrode by way of obtaining good adhesion of the electrode, even in cases...
7521724 Light emitting diode package and process of making the same  
A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer...
7518159 Packaging technique for the fabrication of polarized light emitting diodes  
A polarized light emitting diode (LED) includes a marker indicating a polarization direction. A package for the LED also includes a marker indicating the polarization direction. The markers on the...
7514718 LED package, manufacturing method thereof, and LED array module using the same  
An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and...
7510889 Light emitting chip package and manufacturing method thereof  
A method for manufacturing a light emitting chip package includes bonding a patterned metal plate having at least a thermal enhanced plate and many contacts around the same to a substrate and...
7508002 Surface-mountable light-emitting diode structural element  
A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part...
7501660 Housing for an electronic component  
A housing is specified for an electronic component having at least two connecting parts ( 4 a, 4 b ), which are partially in contact with the housing. The conductivity of at least subareas of the...
7501657 Semiconductor light emitting device, lighting module, illumination apparatus, surface mount LED, and bullet LED  
Disclosed is a semiconductor light emitting device ( 10 ) that includes an LED chip ( 14 ) mounted on a base substrate ( 12 ) and a phosphor ( 16 ) covering the LED chip ( 14 ). The LED chip ( 14 )...
7495322 Light-emitting device  
A light-emitting device ( 200 ) has a submount ( 100 ) and a plate for heat transfer ( 300 ) having a metallic plate ( 30 ). The submount ( 100 ) has a mount base ( 10 ), at least one...
7495259 Light-emitting diode  
A light-emitting diode capable of making its light emission more uniform without too high a concentration current and of improving the efficiency of outgoing light and its life. In the...
Matches 1 - 50 out of 565 1 2 3 4 5 6 7 8 9 10 11 12 >