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7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
A panel and a semiconductor component including a composite board with semiconductor chips and plastic package molding compound and a method for the production thereof is disclosed. In one...
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7618845 |
Fabrication of an integrated circuit package
A QFN integrated circuit is mounted on a leadframe having multiple lead lands and resin material encapsulates the integrated circuit leaving the lead lands exposed. Subsequently a sawing operation...
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7608915 |
Heat dissipation semiconductor package
A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is...
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7598123 |
Semiconductor component and method of manufacture
A semiconductor component comprising two stacked semiconductor dice and a method of manufacture. A leadframe having an active area that includes leadframe leads and a cavity is mounted to a support...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7554210 |
Semiconductor device with semiconductor chip mounted in package
A semiconductor device including a semiconductor chip having first and second principal surfaces is disclosed. The semiconductor chip includes a first electrode formed on the first principal...
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7554179 |
Multi-leadframe semiconductor package and method of manufacture
A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached...
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7550843 |
Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
A semiconductor device includes a base member made of a material containing at least a thermosetting resin, and at least one semiconductor constructing body mounted on the base member, and having a...
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7547964 |
Device packages having a III-nitride based power semiconductor device
A semiconductor device package includes a die pad, a substrate disposed on the die pad, and a III-nitride based semiconductor device disposed on the substrate. The device package may also include a...
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7545017 |
Wafer level package for surface acoustic wave device and fabrication method thereof
A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top...
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7535087 |
Semiconductor device with lead frames
By disposing a rear surface of a first island 12 and a top surface of a second island 13 so as to at least partially overlap each other, a first semiconductor chip on the first island and a...
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7535085 |
Semiconductor package having improved adhesiveness and ground bonding
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
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7528467 |
IC substrate with over voltage protection function
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
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7528415 |
Semiconductor laser
A semiconductor laser improved in heat sinkability of portions in the vicinity of a light-emitting end face of a main body in order to prevent occurrence of COD is provided. A main body 150 ...
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7521794 |
Intrinsic thermal enhancement for FBGA package
A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the...
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7518233 |
Sealing structure for multi-chip module
A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in...
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7504736 |
Semiconductor packaging mold and method of manufacturing semiconductor package using the same
A semiconductor packaging mold includes first and second mold bodies, a cavity defined by the first and second mold bodies to provide a space for molding a semiconductor package, and a resin bleed...
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7501585 |
Semiconductor device support element with fluid-tight boundary
A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at...
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7491583 |
Power module fabrication method and structure thereof
A power module fabrication method and structure thereof is disclosed. The method includes steps of: providing a metal plate and defining a pattern on the metal plate; cutting the metal plate...
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7479693 |
Arrangement of conductive connectors in a power semiconductor device
One of the aspects of the present invention is to provide a power semiconductor device, including a first substrate having a first circuit pattern formed thereon, and a second substrate having a...
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7476967 |
Composite carbon nanotube thermal interface device
Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may...
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7473995 |
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
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7446408 |
Semiconductor package with heat sink
A package is provided for a semiconductor device including a semiconductor device support substrate having at least one interconnect metal therein connectible to a ground and having at least one...
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7405107 |
Semiconductor device, method and apparatus for fabricating the same
A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said...
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7400049 |
Integrated circuit package system with heat sink
An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit...
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7399657 |
Ball grid array packages with thermally conductive containers
Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the...
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7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same
A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal...
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7378731 |
Heat spreader and package structure utilizing the same
A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a...
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7372146 |
Semiconductor module
A semiconductor module includes a parts-mounting or packaging substrate, a plurality of power metal insulator semiconductor (MIS) chips which have top surfaces and back surfaces and are mounted by...
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7371617 |
Method for fabricating semiconductor package with heat sink
A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof,...
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7368810 |
Invertible microfeature device packages
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
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7365422 |
Package of leadframe with heatsinks
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed...
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7359201 |
Heat-generating electronic part cover and cover mounting method
A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body ( 20 ) of rectangular prism shape having...
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7335982 |
Chip package structure and chip packaging process
A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The...
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7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package
An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die...
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RE39957 |
Method of making semiconductor package with heat spreader
A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least...
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7304372 |
Semiconductor package
A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration.
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7285855 |
Packaged device and method of forming same
A method of packaging an integrated circuit die ( 12 ) includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a...
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7265444 |
Resin molded semiconductor device
To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. A resin molded semiconductor device including...
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7250672 |
Dual semiconductor die package with reverse lead form
A semiconductor package that includes two semiconductor die each disposed on a respective die pad and a large tracking distance interposed between at least two leads of the package for better...
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7247944 |
Connector assembly
An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die...
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7247929 |
Molded semiconductor device with heat conducting members
A power element package includes a semiconductor chip, radiating members, a mold resin member, a lead terminal for control signals, and lead terminals for large electric current. On a heat...
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7245004 |
Semiconductor device
A semiconductor device mountable on a wiring board with the bottom surface being opposed to the wiring board including a semiconductor chip; a mold resin encapsulating the semiconductor chip; a...
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7235889 |
Integrated heatspreader for use in wire bonded ball grid array semiconductor packages
The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor...
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7235876 |
Semiconductor device having metallic plate with groove
A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block...
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7230829 |
Overmolded electronic assembly with insert molded heat sinks
An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material....
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7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead
A three-dimensional stacked semiconductor package includes first and second chips, first and second adhesives, first and second wire bonds, a lead and an encapsulant. The chips are disposed on...
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7224057 |
Thermal enhance package with universal heat spreader
A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically...
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7217598 |
Method for manufacturing plastic ball grid array package with integral heatsink
A plastic ball grid array semiconductor package employs a metal heat spreader having supporting arms embedded in the molding cap, in which the embedded supporting arms are not directly affixed to...
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