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Match Document Document Title
7405107 Semiconductor device, method and apparatus for fabricating the same  
A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said...
7400049 Integrated circuit package system with heat sink  
An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit...
7399657 Ball grid array packages with thermally conductive containers  
Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the...
7388286 Semiconductor package having enhanced heat dissipation and method of fabricating the same  
A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal...
7378731 Heat spreader and package structure utilizing the same  
A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a...
7372146 Semiconductor module  
A semiconductor module includes a parts-mounting or packaging substrate, a plurality of power metal insulator semiconductor (MIS) chips which have top surfaces and back surfaces and are mounted by...
7371617 Method for fabricating semiconductor package with heat sink  
A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof,...
7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7365422 Package of leadframe with heatsinks  
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed...
7359201 Heat-generating electronic part cover and cover mounting method  
A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body ( 20 ) of rectangular prism shape having...
7355289 Packaged integrated circuit with enhanced thermal dissipation  
A semiconductor package ( 10 ) uses a plurality of thermal conductors ( 56 - 64 ) that extend upward within an encapsulant ( 16 ) from one or more thermal bond pads ( 22, 24, 26 ) on a die ( 14 )...
7335982 Chip package structure and chip packaging process  
A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The...
7323769 High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package  
An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die...
RE39957 Method of making semiconductor package with heat spreader  
A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least...
7304372 Semiconductor package  
A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration.
7285855 Packaged device and method of forming same  
A method of packaging an integrated circuit die ( 12 ) includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a...
7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7265444 Resin molded semiconductor device  
To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. A resin molded semiconductor device including...
7259451 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7253505 IC substrate with over voltage protection function  
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
7250672 Dual semiconductor die package with reverse lead form  
A semiconductor package that includes two semiconductor die each disposed on a respective die pad and a large tracking distance interposed between at least two leads of the package for better...
7247944 Connector assembly  
An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die...
7247929 Molded semiconductor device with heat conducting members  
A power element package includes a semiconductor chip, radiating members, a mold resin member, a lead terminal for control signals, and lead terminals for large electric current. On a heat...
7245004 Semiconductor device  
A semiconductor device mountable on a wiring board with the bottom surface being opposed to the wiring board including a semiconductor chip; a mold resin encapsulating the semiconductor chip; a...
7235889 Integrated heatspreader for use in wire bonded ball grid array semiconductor packages  
The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor...
7235876 Semiconductor device having metallic plate with groove  
A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block...
7230829 Overmolded electronic assembly with insert molded heat sinks  
An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material....
7227249 Three-dimensional stacked semiconductor package with chips on opposite sides of lead  
A three-dimensional stacked semiconductor package includes first and second chips, first and second adhesives, first and second wire bonds, a lead and an encapsulant. The chips are disposed on...
7224057 Thermal enhance package with universal heat spreader  
A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically...
7217598 Method for manufacturing plastic ball grid array package with integral heatsink  
A plastic ball grid array semiconductor package employs a metal heat spreader having supporting arms embedded in the molding cap, in which the embedded supporting arms are not directly affixed to...
7205651 Thermally enhanced stacked die package and fabrication method  
A substrate is provided. A first die is attached to the substrate. The first die is electrically connected to the substrate. A heat sink having an undercut around its periphery is attached to the...
7199718 RFID tag with thermal conductive cover  
The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a...
7196904 IC package with an implanted heat-dissipation fin  
An IC package with an implanted heat-dissipation fin is introduced. The IC package provides a plastic package to seal an IC chip. One end of the heat-dissipation fin is implanted inside the plastic...
7193320 Semiconductor device having a heat spreader exposed from a seal resin  
A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a...
7193303 Supporting frame for surface-mount diode package  
A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame...
7190066 Heat spreader and package structure utilizing the same  
A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a...
7187075 Stress relieving film for semiconductor packages  
Techniques for reducing the mechanical stress imposed upon semiconductor dice by protective molding compounds during times of temperature fluctuation. A thermoplastic material is attached to a top...
7164210 Semiconductor package with heat sink and method for fabricating same  
A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof,...
7153725 Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor  
A method for fabricating a semiconductor package with a substrate in a strip format is provided. Semiconductor devices are attached in a strip format to the substrate, and a thermal interface...
7148554 Discrete electronic component arrangement including anchoring, thermally conductive pad  
An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically...
7145254 Transfer-molded power device and method for manufacturing transfer-molded power device  
A semiconductor device includes a semiconductor chip that generates heat in operation, a pair of heat sinks for cooling the chip, and a mold resin, in which the chip and the heat sinks are...
7141886 Air pocket resistant semiconductor package  
A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An...
7138707 Semiconductor package including leads and conductive posts for providing increased functionality  
A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the...
7135782 Semiconductor module and production method therefor and module for IC cards and the like  
A semiconductor module includes: a printed wiring board made of an insulator with conductor patterns formed on both sides thereof. An IC chip is mounted on the printed wiring board and sealed with...
7135754 Chip type solid electrolytic capacitor having a small size and a simple structure  
In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent...
7126218 Embedded heat spreader ball grid array  
A heat slug or spreader is attached directly to a surface of the die in a ball grid array (BGA) package. The heat spreader roughly conforms to the topological profile of the die, underlying...
7122911 Heat spreader and semiconductor device package having the same  
The present invention relates to a heat spreader and a semiconductor device package having the same. The semiconductor device package comprises a substrate, a semiconductor die, a plurality of...
7122388 Method of detecting misalignment of ion implantation area  
A method of detecting misalignment of ion implantation areas comprises forming at least one standard pattern consisting of a first area and a second area for use in measuring resistance, implanting...
7115989 Adhesive sheet for producing a semiconductor device  
An adhesive sheet for producing a semiconductor device, which includes a base layer and an adhesive layer and is used in the process for producing the semiconductor device including the step of...
7091603 Semiconductor device  
In a semiconductor device having semiconductor chips, a lower heat sink which is joined on the principal rear surface side of the semiconductor chips and an upper heat sink which is joined on the...
Matches 1 - 50 out of 500 1 2 3 4 5 6 7 8 9 10 >