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8174112 Integrated circuit device with low capacitance and high thermal conductivity interface  
An integrated circuit device includes an integrated circuit formed in a semiconductor die and an integrated circuit package containing the semiconductor die. The integrated circuit package includes...
8138585 Four mosfet full bridge module  
A molded, leadless packaged semiconductor multichip module includes 100 has four mosfets 10, 12, 14, 16 for a full bridge circuit. The mosfets may include two N-channel and two P-channel devices or...
8134232 Heat dissipation for integrated circuit  
A packaged integrated circuit having a thermal pathway to exhaust heat from the integrated circuit. The integrated circuit is disposed on a package substrate, with an encapsulant disposed around...
8120167 System with semiconductor components having encapsulated through wire interconnects (TWI)  
A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate...
8115305 Integrated circuit package system with thin profile  
An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an...
8093699 Circuit device with circuit board and semiconductor chip mounted thereon  
A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that...
8094457 Electronic apparatus  
An electronic apparatus includes a substrate, electronic components mounted on the substrate, an antenna mounted on the substrate, and a resin material containing a dielectric constant adjusting...
8089085 Heat sink base for LEDS  
An LED assembly can include a heat sink base, at least one LED die attached to the heat sink base, and a lens. One or more layers of phosphor can be formed upon the lens. A heat sink, such as a...
8072053 Leadless integrated circuit package having electrically routed contacts  
A leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical...
8062933 Method for fabricating heat dissipating package structure  
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; an encapsulant formed on the chip carrier and for...
8064203 Process for preparing conductive films and articles prepared using the process  
A free standing film includes: i. a matrix layer having opposing surfaces, and ii. an array of nanorods, where the nanorods are oriented to pass through the matrix layer and protrude an average...
8058736 Semiconductor device having heat spreader with center opening  
The present invention provides a semiconductor device including: a semiconductor chip mounted on a substrate; a heat spreader provided above the semiconductor chip; and a sealing resin interposed...
8053878 Substrate, semiconductor device using the same, method for inspecting semiconductor device, and method for manufacturing semiconductor device  
A substrate including therein a plurality of conductor layers laminated via insulating layers, the substrate mounting at least one semiconductor integrated circuit, wherein the substrate includes a...
8049314 Integrated circuit package system with insulator over circuitry  
An integrated circuit package system includes: providing a connection array; attaching a base integrated circuit adjacent the connection array; attaching a package integrated circuit over the base...
8039316 Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof  
A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of...
8035237 Integrated circuit package system with heat slug  
An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the...
8030768 Semiconductor package with under bump metallization aligned with open vias  
A semiconductor package with a semiconductor chip having under bump metallizations (UBMs) on a first surface and a substrate having open vias. The substrate is attached to the semiconductor chip...
8030755 Integrated circuit package system with a heat sink  
An integrated circuit package system is provided forming a substrate having an integrated circuit die thereon, thermally connecting a heat slug and a resilient thermal structure to the integrated...
8030756 Plastic ball grid array package with integral heatsink  
A plastic ball grid array semiconductor package employs a metal heat spreader having supporting arms embedded in the molding cap, in which the embedded supporting arms are not directly affixed to...
8022513 Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same  
A packaging substrate structure with electronic components embedded therein and a method for fabricating the same are disclosed. The packaging substrate structure comprises a core board with a...
8022516 Metal leadframe package with secure feature  
A fabrication method for a BGA or LGA package includes a low-cost metal leadframe with internally extended leads. I/O attach lands can be placed at any location on the metal leadframe, including...
8018043 Semiconductor package having side walls and method for manufacturing the same  
A semiconductor package includes a semiconductor chip having an upper surface, side surfaces connected with the upper surface, and bonding pads formed on the upper surface. A first insulation layer...
8018072 Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate  
A semiconductor device has a substrate. A die is attached to a first surface of the substrate. A heat sink is provided having an approximately planer member and support members extending from the...
8018068 Semiconductor package including a top-surface metal layer for implementing circuit features  
A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top...
8014152 Electronic substrate device  
This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat...
8008759 Pre-molded clip structure  
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first...
8004089 Semiconductor device having wiring line and manufacturing method thereof  
On the lower surface of a semiconductor construct having an external connection electrode, there are formed an insulating film having a planar size greater than that of the semiconductor construct,...
8003447 Multi-chip module for battery power control  
A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first...
7999372 Organic light emitting display device and method of fabricating the same  
Provided is an organic light emitting display device. An organic light emitting display device according to one embodiment of the present invention comprises a first substrate; a second substrate...
7993978 Method of manufacturing a semiconductor device and molding die  
A method of manufacturing a semiconductor device capable of obtaining high joining force between a heat spreader and resin is provided. The method of manufacturing a semiconductor device according...
7989839 Method and apparatus for using light emitting diodes  
The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the...
7989947 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a semiconductor element 1, a thermal conductor 91 located opposite a major surface of the semiconductor element 1, and a mold resin member 6 molding the...
7973412 Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead  
In a semiconductor device bonded to a motherboard with a bonding material having a melting point of 200° C. to 230° C., a bonding material 15 which is a die bonding material for bonding a s...
7968982 Thermal enhanced upper and dual heat sink exposed molded leadless package  
A semiconductor package includes a semiconductor device 30 and a molded upper heat sink 10. The heat sink has an interior surface 16 that faces the semiconductor device and an exterior surface 15...
7969018 Stacked semiconductor chips with separate encapsulations  
Stacked semiconductor chips. One embodiment provides a device having a first body. A first power semiconductor chip and first external contact elements is provides. A second body includes a second...
7968925 Power semiconductor module for inverter circuit system  
A double-face-cooled semiconductor module with an upper arm and a lower arm of an inverter circuit includes first and second heat dissipation members, each having a heat dissipation surface on one...
7952107 Solid state light sheet and encapsulated bare die semiconductor circuits with electrical insulator  
An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the...
7948091 Mounting structure for semiconductor element  
A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a...
7944045 Semiconductor module molded by resin with heat radiation plate opened outside from mold  
A semiconductor module and a method of manufacturing the same are disclosed including a semiconductor element having an electrode, a heat radiation plate placed in thermal contact with a main...
7932590 Stacked-die electronics package with planar and three-dimensional inductor elements  
An apparatus and a method for producing three-dimensional integrated circuit packages. In one embodiment, an electronics package with at least two dice are stacked one atop another is disclosed. A...
7923826 Semiconductor device mounted on heat sink having protruded periphery  
A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by...
7915729 Load driving semiconductor apparatus  
A load driving semiconductor apparatus includes: a driving transistor, which operates based on an input voltage from an external circuit; a power semiconductor device controlling power supply to a...
7902648 Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods  
An interposer includes a substrate, a conductive structure configured to contact the back side of a semiconductor device and contact pads. The interposer may include first and second sets of...
7888852 LED heat dissipation structure  
A light-emitting diode (LED) heat dissipation structure is provided, including a package body, a heat dissipation frame, at least one light emitting die, a plurality of conductive leads, and a...
7883908 Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)  
A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate...
7884455 Semiconductor device  
A power module includes: an encapsulation-target portion having at least one semiconductor element; and an encapsulation member that has first and second planes between which the...
7880280 Electronic component and method for manufacturing an electronic component  
An electronic component has at least two semiconductor devices, a contact clip and a leadframe with a device carrier portion and a plurality of leads. The contact clip extends between the first...
7868432 Multi-chip module for battery power control  
A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first...
7868472 Thermal dissipation in integrated circuit systems  
Integrated circuit systems with thermal dissipation enhancement features are described. In one aspect, an integrated circuit system includes a die incorporating an integrated circuit. The die has a...
7868443 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability  
A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from...
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