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7622515 |
Composition of epoxy resin, phenolic resin, silicone compound, spherical alumina and ultrafine silica
The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor...
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7612458 |
Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
There is provided an epoxy resin composition for semiconductor encapsulating use comprising: an epoxy resin (A); a phenol resin (B); a curing accelerator (C); and an inorganic filler (D), wherein...
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7605213 |
Semiconductor encapsulant of epoxy resin, phenolic resin, phosphine-quinone adduct and OH compound
There is provided an epoxy resin composition for encapsulating a semiconductor essentially comprising (A) a phenolaralkyl type epoxy resin having a phenylene structure, (B) a phenolaralkyl resin...
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7544727 |
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate
An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor...
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7511383 |
Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices
A flame retardant featuring: an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1)
(X is a single bond, CH 2 , C(CH 3 ) 2 , SO...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7504460 |
Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine
Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure:
...
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7485489 |
Electronics circuit manufacture
A circuit with embedding components ( 13 ) is produced by placing the components ( 13 ) on a substrate ( 14 ) and applying sheets ( 15 ) of prepreg. The prepreg sheets ( 15 ) have apertures to...
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7470754 |
Biphenylaralkyl epoxy and phenolic resins
An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor free from a harmful substance out of regard for the environment, which exhibits excellent...
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7442729 |
Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt
A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device...
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7432603 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at...
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7431990 |
Resin composition for encapsulating semiconductor chip and semiconductor device therewith
An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack...
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7429800 |
Molding composition and method, and molded article
A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than...
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7408264 |
SMT passive device noflow underfill methodology and structure
An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing...
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7408259 |
Sheet to form a protective film for chips
A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer...
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7399657 |
Ball grid array packages with thermally conductive containers
Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the...
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7397139 |
Epoxy resin molding material for sealing use and semiconductor device
An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12...
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7381359 |
Method for making filled epoxy resin compositions
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and...
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7378721 |
Chip on lead frame for small package speed sensor
A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds...
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7345368 |
Semiconductor device and the manufacturing method for the same
A semiconductor device has a semiconductor substrate having first and second surface, a first resin film formed on the first surface of the semiconductor substrate and a second resin film formed on...
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7345102 |
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D):
(A) an epoxy resin component comprising a novolak type epoxy resin having at...
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7332822 |
Flip chip system with organic/inorganic hybrid underfill composition
A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting...
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7321005 |
Encapsulant composition and electronic package utilizing same
A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a...
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7317258 |
Thermal interface apparatus, systems, and fabrication methods
An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.
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7315083 |
Circuit device and manufacturing method thereof
A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid...
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7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same
A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection...
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7307128 |
Epoxy compound, preparation method thereof, and use thereof
The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property...
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7304391 |
Modified chip attach process and apparatus
A method of packaging a die includes reflowing the solder to electrically connect the die to a substrate at a first temperature, cooling the die and substrate to a second temperature, and placing a...
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7288838 |
Circuit board for mounting a semiconductor chip and manufacturing method thereof
It is an object of the invention to provide a circuit board for mounting a semiconductor chip and a manufacturing method thereof that prevent post-reflow warping and prevent peeling of the...
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7279781 |
Two-stage transfer molding device to encapsulate MMC module
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the...
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7268191 |
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby
A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy...
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7265167 |
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the...
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7262514 |
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
An epoxy resin composition for semiconductor encapsulation in producing surface mount lead-less thin semiconductor devices. The epoxy resin composition for surface mount lead-less semiconductor...
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7262507 |
Semiconductor-mounted device and method for producing same
Semiconductor-mounted device comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and sealing resin...
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7211888 |
Encapsulation of pin solder for maintaining accuracy in pin position
Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.
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7205669 |
Semiconductor device
A semiconductor device that exhibits an enhanced inhibition to a generation of voids in an underfill resin for encapsulation supplied between a semiconductor chip and an electronic component, which...
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7193331 |
Semiconductor device and manufacturing process thereof
One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor...
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7183661 |
Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof
Epoxy-resin systems resistant to aging, molded materials and components generated from them, and their utilization. An epoxy-resin system especially suitable in the application of casting-resin...
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7183657 |
Semiconductor device having resin anti-bleed feature
A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are...
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7183588 |
Light emission device
A light emission device. A lead frame comprises a first lead frame segment and a second lead frame segment. A light source is coupled to the first lead frame segment. A wire bond is coupled to the...
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7178235 |
Method of manufacturing an optoelectronic package
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic...
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7163973 |
Composition of bulk filler and epoxy-clay nanocomposite
A molding composition or encapsulant for an electronic component and its method of preparation provides reduced moisture uptake without undue swelling and comprises melt-blending an epoxy resin,...
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7138723 |
Deformable semiconductor device
A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an...
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7122910 |
Packaged semiconductor device
A semiconductor device in which moisture penetration into the package interior is suppressed, comprising a rewiring layer formed by plating, with improved reliability of electrical characteristics....
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7122896 |
Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component
To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in...
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7122587 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene...
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7115989 |
Adhesive sheet for producing a semiconductor device
An adhesive sheet for producing a semiconductor device, which includes a base layer and an adhesive layer and is used in the process for producing the semiconductor device including the step of...
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7115982 |
Semiconductor component having stiffener, stacked dice and circuit decals
A semiconductor component includes a stiffener, a circuit decal attached to the stiffener, and a semiconductor die attached to the stiffener. The circuit decal includes conductors which function as...
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7109592 |
SMT passive device noflow underfill methodology and structure
An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing...
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7109591 |
Integrated circuit device
An integrated circuit device having a semiconductor device and an encapsulating material on at least a portion of the semiconductor device and a method for encapsulating an integrated circuit...
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