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7626265 |
Semiconductor package having flexible lead connection plate for electrically connecting base and chip
A semiconductor package has a base, a chip attached to the base, a flexible connection plate mounted on and electrically connecting the chip and the base, and an encapsulant encapsulating the chip...
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7622812 |
Semiconductor module
A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending...
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7622805 |
Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
Multiple semiconductor device components and passive device components fixed to a substrate are embedded within an electroconductive-film/insulating-resin-film structure, and are thermally bonded...
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7622804 |
Semiconductor device and method of manufacturing the same
Provided is a semiconductor device including a semiconductor chip, a film (first film) which is provided so as to cover an active region with a peripheral portion of the semiconductor chip being...
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7622684 |
Electronic component package
An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the...
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7622325 |
Integrated circuit package system including high-density small footprint system-in-package
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are...
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7619318 |
No-flow underfill composition and method
In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At...
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7619317 |
Carrier structure for semiconductor chip and method for manufacturing the same
A carrier structure for a semiconductor chip and a method for manufacturing the same are disclosed. The method includes the following steps: providing a carrier board having at least one through...
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7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
A panel and a semiconductor component including a composite board with semiconductor chips and plastic package molding compound and a method for the production thereof is disclosed. In one...
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7618845 |
Fabrication of an integrated circuit package
A QFN integrated circuit is mounted on a leadframe having multiple lead lands and resin material encapsulates the integrated circuit leaving the lead lands exposed. Subsequently a sawing operation...
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7615872 |
Semiconductor device
A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective...
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7615859 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same
Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that...
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7615855 |
IC card and method of manufacturing the same
An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured....
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7612458 |
Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
There is provided an epoxy resin composition for semiconductor encapsulating use comprising: an epoxy resin (A); a phenol resin (B); a curing accelerator (C); and an inorganic filler (D), wherein...
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7612445 |
Circuit apparatus and method of fabricating the apparatus
The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a...
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7608911 |
Semiconductor device package having a semiconductor element with a roughened surface
A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a...
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7608486 |
Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts...
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7605480 |
Flip chip interconnection pad layout
A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from...
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7602071 |
Apparatus for dividing an adhesive film mounted on a wafer
A method of dividing an adhesive film mounted on the back surface of a wafer having a plurality of streets formed on the front surface in a lattice pattern and function elements formed in a...
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7602055 |
Semiconductor device and method for fabricating the same
A semiconductor device with a WLP structure that enables the improvement of heat resistance. A dam layer which spreads over a PI film and an Si substrate for a chip is formed between the Si...
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7599064 |
Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method, substrate for use in the methods
An overlay marker for use with a scatterometer includes two overlying two-dimensional gratings. The two gratings have the same pitch but the upper grating has a lower duty ratio. Cross-talk between...
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7598622 |
Encapsulation of a chip module
A chip module with a substrate having a top side, a chip mounted on the top side of the substrate, and an encapsulation includes an encapsulation material. The encapsulation is applied on the chip...
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7598606 |
Integrated circuit package system with die and package combination
An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and...
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7592708 |
Package board, semiconductor package, and fabricating method thereof
With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board...
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7589408 |
Stackable semiconductor package
A stackable semiconductor package includes first and second substrates, a semiconductor device, first wires, a supporting element, and a first molding compound. The semiconductor device is disposed...
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7588965 |
Stencil and method for depositing material onto a substrate
A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.
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7586182 |
Packaged semiconductor die and manufacturing method thereof
Aspects of the subject matter described herein relate to a packaged semiconductor die which becomes a component of a finished multi-chip package. The packaged semiconductor die comprises a die...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7582974 |
Semiconductor device and method of manufacturing same
A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted;...
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7582968 |
Wiring board with a protective film greater in heights than bumps
A wiring board according to the present invention includes: an insulating base 22 ; a plurality of first conductor wirings 23 a aligned in an inner region on the insulating base; bumps 24 ...
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7582958 |
Semiconductor package
A semiconductor package which includes a plurality of leads embedded in a ceramic body, a semiconductor device electrically coupled to the leads, and a molded housing encapsulating at least the...
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7579680 |
Packaging system for semiconductor devices
A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that...
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7573141 |
Semiconductor package with a chip on a support plate
A semiconductor package includes a support plate made of an electrically non-conducting material. Electrical connection vias are formed outside a chip fixing region provided on the front face of...
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7573071 |
Light emitting diode package
A light emitting diode (LED) package including a carrier, an LED chip, a first transparent encapsulant, a transparent cap, and a second transparent encapsulant is provided. The carrier has a...
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7566966 |
Integrated circuit package-on-package system with anti-mold flash feature
An integrated circuit package-on-package system includes: mounting an integrated circuit package system having a mountable substrate over a package substrate; forming a package encapsulation having...
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7566957 |
Support device with discrete getter material microelectronic devices
The specification teaches a system for manufacturing microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and...
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7566836 |
Potting shell
A potting shell, for an electronic circuit on a circuit board, comprises a wall arrangement, which defines a shell volume at least in one spatial direction and in the directions perpendicular...
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7564142 |
Electronic device and method of manufacturing the same, circuit board, and electronic instrument
An electronic device includes: a substrate on which an interconnect pattern is formed; a chip component having a first surface on which an electrode is formed and a second surface opposite to the...
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7564140 |
Semiconductor package and substrate structure thereof
A semiconductor package and a substrate structure thereof are provided. A solder mask layer applied on the substrate structure is formed with outwardly extended openings corresponding to corner...
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7564122 |
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the...
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7564080 |
Method for producing a laser diode component, housing for a laser diode component, and laser diode component itself
A method for producing a laser diode component having an electrically insulating housing basic body and electrical connecting conductors, which are led out from the housing basic body and are...
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7563652 |
Method for encapsulating sensor chips
A method for encapsulating sensor chips is disclosed. A protective layer is formed on an active surface of a sensor chip, and at least covers a sensor region in the active surface. The active...
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7560821 |
Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
An area mount type semiconductor device having high reliability when a semiconductor element is mounted on a surface with the use of a lead-free solder, and a die bonding resin composition and...
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7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
A semiconductor device, including a semiconductor chip having electrodes, a substrate having an interconnect pattern, and an adhesive, the adhesive having a first portion and a second portion, the...
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7560804 |
Integrated circuit package and method of making the same
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
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7560743 |
Electro-optical device, method of manufacturing the same, and image forming apparatus
An electro-optical device in which a plurality of light-emitting elements including a first electrode layer, a second electrode layer, and a light-emitting functional layer emitting light in...
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7554197 |
High frequency IC package and method for fabricating the same
A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to...
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7554182 |
Semiconductor device and package, and method of manufacturer therefor
A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the...
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7553701 |
Semiconductor packaging method
The present invention relates to a semiconductor packaging method. The method comprises (S 1 ) applying a die adhesive to an upper surface of a member through screen-printing; (S 2 ) B-stage curing...
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7552532 |
Method for hermetically encapsulating a component
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises...
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