Matches 1 - 50 out of 1908 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >


Match Document Document Title
8178982 Dual molded multi-chip package system  
A dual molded multi-chip package system is provided including forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die...
8174111 Vertical mount package for MEMS sensors  
A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in...
8174109 Electronic device and method of manufacturing same  
An electronic device includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first electronic component, a first sealing resin, and a...
8174101 Microelectronic devices and microelectronic support devices, and associated assemblies and methods  
Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes...
8173488 Electronic device and method of manufacturing same  
This application relates to a method of manufacturing a semiconductor device comprising: providing multiple chips each comprising contact elements on a first main face of each of the multiple...
8169090 Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same  
An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mmφ and at ...
8169073 Semiconductor device and electronic apparatus of multi-chip packaging  
External connection terminals 27 which are electrically connected to semiconductor chips 11-1, 11-2, 12-1, 12-2 and also protrude beyond the semiconductor chips 11-1, 11-2, 12-1, 12-2 are disposed...
8169089 Semiconductor device including semiconductor chip and sealing material  
A semiconductor device includes at least bonding wires between electrode pads on a main surface of a semiconductor chip and connection pads on a wiring board. The wires form loop shapes from the...
8159047 Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors  
A semiconductor device includes conductive pillars disposed vertically over a seed layer, a conformal insulating layer formed over the conductive pillars, and a conformal conductive layer formed...
8153478 Method for manufacturing integrated circuit package system with under paddle leadfingers  
A method for manufacturing an integrated circuit package system includes: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle...
8153480 Air cavity package for flip-chip  
According to an example embodiment, there is method (100) for manufacturing a semiconductor device in an air-cavity package. For a device die having an active surface, a lead frame is provided (5),...
8153467 Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture and method for manufacturing same  
A method for manufacturing a semiconductor device, includes the steps of: forming a resin layer on an upper surface of a substrate including a photodiode such that the resin layer does not cover a...
8148208 Integrated circuit package system with leaded package and method for manufacturing thereof  
A method for manufacturing an integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side...
8148828 Semiconductor packaging device  
A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around...
8148804 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device  
A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a...
8148792 Pressure sensor and method for manufacturing the pressure sensor  
A pressure sensor of the present invention includes a lower substrate which has an insulating layer having a through-hole penetrating from one side to the other side, and an active layer formed to...
8143110 Methods and apparatuses to stiffen integrated circuit package  
A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as...
8143727 Adhesive on wire stacked semiconductor package  
A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second...
8143097 Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP  
A semiconductor device is made by mounting a semiconductor wafer to a temporary carrier. A plurality of TSV is formed through the wafer. A cavity is formed partially through the wafer. A first...
8134242 Integrated circuit package system with concave terminal  
An integrated circuit package system includes: connecting a concave terminal and an integrated circuit; and forming an encapsulation, having a bottom side, over the integrated circuit and the...
8134227 Stacked integrated circuit package system with conductive spacer  
A stacked integrated circuit package system is provided including providing a first device and a second device with the first device, the second device, or a combination thereof having an...
8129849 Method of making semiconductor package with adhering portion  
Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing...
8129827 Integrated circuit package system with package encapsulation having recess  
An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a...
8129741 Light emitting diode package  
The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second...
8129624 Pressure sensor  
A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring...
8130507 Component built-in wiring board  
A component built-in wiring board is provided. The component built-in wiring board 10 includes a core substrate 11, a first component 61, a first built-up layer 31 and a capacitor 101. The core...
8125092 Semiconductor device packages and assemblies  
A semiconductor device package includes a carrier, one or more semiconductor devices on the carrier, and a redistribution element above the uppermost of the one or more semiconductor devices. The...
8126026 Two-beam semiconductor laser device  
A two-beam semiconductor laser device 10 includes: a two-beam semiconductor element LDC having a first and a second semiconductor laser elements LD1 and LD2 that can be driven independently and...
8124459 Bump chip carrier semiconductor package system  
A bump chip carrier semiconductor package system is provided including providing a lead frame, forming circuit sockets in the lead frame, mounting a semiconductor die on the lead frame, wherein the...
8119447 Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a...
8120167 System with semiconductor components having encapsulated through wire interconnects (TWI)  
A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate...
8115290 Storage medium and semiconductor package  
A semiconductor package includes a semiconductor chip formed with a non-volatile semiconductor memory, a resin encapsulation that encapsulates the semiconductor chip, electrodes in a lattice...
8116094 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Printed circuit board and mounting structure for surface mounted device  
The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a...
8110908 Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate cavity; mounting a bottom flip chip die below the substrate; mounting an...
8110933 Semiconductor device mounted structure and semiconductor device mounted method  
A recess portion is formed on a board surface at a position facing a peripheral end portion of a semiconductor device so as to place a sealing-bonding resin partially inside the recess portion....
8110912 Semiconductor device  
A method of manufacturing a semiconductor device includes providing a foil formed of an insulating material, where the foil includes at least one electrically conducting element, providing a chip...
8105883 Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method  
Provided is a method for manufacturing a semiconductor device in which movement of an island in resin sealing is prevented. A molding die includes an upper die and a lower die. The upper and lower...
8106493 Semiconductor device package having features formed by stamping  
Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are...
8105881 Method of fabricating chip package structure  
A method of fabricating a chip package structure includes the steps of providing a lead frame having a die pad, plural leads and at least one structure enhancement element. A chip is then disposed...
8104172 Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer  
Embodiments of buffer coatings for semiconductor and integrated circuit manufacturing are presented herein.
8102040 Integrated circuit package system with die and package combination  
An integrated package system with die and package combination includes forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and...
8097945 Bi-directional, reverse blocking battery switch  
Embodiments of the present invention relate to an improved die layout for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side,...
8097477 Method for forming a light-emitting case and related light-emitting module  
A method for manufacturing a light-emitting case includes forming a PLED (Polymer Light Emitting Diode) device, disposing the PLED device into a mold, and utilizing the mold to sheathe the PLED...
8097965 Semiconductor device and method of manufacturing the same  
In the manufacture of semiconductor devices, cracking of a resin member caused during cutting and defects in the external appearance are prevented.
8093616 Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device  
An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end...
8093691 System and method for RF shielding of a semiconductor package  
A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for...
8093730 Underfilled semiconductor die assemblies and methods of forming the same  
An apparatus and method may be used for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective...
8093692 Semiconductor device packaging including a power semiconductor element  
A portion of a frame body is fixed on a surface of a heat-radiating plate, and on frame body, a semiconductor chip is die-bonded. Next, a prescribed electrode of semiconductor chip and...
8089164 Substrate having optional circuits and structure of flip chip bonding  
The present invention relates to a substrate having optional circuits and a structure of flip chip bonding. The substrate includes a substrate body, at least one substrate pad, a first conductive...
8089141 Semiconductor package having leadframe with exposed anchor pads  
A semiconductor package including a leadframe which has one or more anchor pads formed on and/or defined by the die pad thereof. Such anchor pad(s) may be provided in any one of a multiplicity of...
Matches 1 - 50 out of 1908 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >