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7615874 |
Electronic component module
An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular....
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7615873 |
Solder flow stops for semiconductor die substrates
A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to...
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7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar
The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing...
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7614147 |
Method of creating contour structures to highlight inspection region
An integrated circuit has a wiring layer below an insulator layer. A pad comprises a conductive material that is on the insulator layer. The pad has a wirebond connection region and a probe pad...
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7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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7608932 |
Deterministic generation of an integrated circuit identification number
The generation of an identification number of a chip supporting at least one integrated circuit, including the step of causing a cutting of at least one conductive section by cutting of the chip...
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7608931 |
Interconnect array formed at least in part with repeated application of an interconnect pattern
An interconnect array formed at least in part using repeated application of an interconnect pattern is described. The interconnect pattern has at least ten interconnect locations. One of the ten...
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7605459 |
Coreless substrate and manufacturing thereof
An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper...
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7602039 |
Programmable capacitor associated with an input/output pad
The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having...
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7598621 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths
A device package, such as a BGA, to be mounted on a printed wiring board (PWB) is disclosed. The bottom electrodes of the device package are arranged in an array such that intervals between the...
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7598620 |
Copper bonding compatible bond pad structure and method
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions...
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7598613 |
Flip chip bonding structure
A semiconductor device is provided with: a solid device having a connection surface formed with a connection electrode projected therefrom; a semiconductor chip which has a functional surface...
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7595562 |
Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device
A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically...
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7595561 |
Semiconductor device including multiple rows of peripheral circuit units
In a semiconductor device including an internal circuit, multiple rows of peripheral circuit units are electrically connected to the internal circuit and arranged on at least one peripheral edge of...
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7592710 |
Bond pad structure for wire bonding
A bond pad structure of an integrated circuit is provided. The bond pad structure includes a conductive bond pad, a first dielectric layer underlying the bond pad, and an M top plate located in...
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7592701 |
Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure
An electrode structure includes at least a contact button portion that has a portion of multilayer structure of two or more conductor layers stacked and enlarged in area. A part mounting structure...
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7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same
A semiconductor module includes: a plastic housing composition; at least one semiconductor chip with an active top side, a coplanar underside of the semiconductor module including the active top...
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7592244 |
Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device includes the step of forming a first insulating section with a protruding section on a semiconductor substrate, the step of forming a first...
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7589421 |
Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same
A semiconductor chip, a tape package of the chip and a tape wiring substrate of the chip may be configured so as to effectively radiate heat generated from the chip externally through certain...
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7589419 |
Side connectors for RFID chip
An RFID chip can have an RFID circuit having first and second initial bond pads and conductive paths on the RFID chip connecting the first and second bond pads to the different sides of the chip....
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7589411 |
Device for electrical connection of an integrated circuit chip
A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the...
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7589410 |
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
A stack package includes at least two stacked package units. Each package unit comprises semiconductor chips having bonding pads on upper surfaces thereof; a molding part formed to surround side...
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7589409 |
Stacked packages and microelectronic assemblies incorporating the same
A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and...
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7586201 |
Wiring modeling technique
In a semiconductor device having wirings, a wiring modeling technique according to the present invention comprises the steps of selecting an arbitrary region of the semiconductor device;...
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7586199 |
Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types
Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging...
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7582976 |
Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device
The present invention provides a semiconductor device tape carrier formed of an insulative tape 1 of a thin film, which becomes a semiconductor device by conducting a plurality of wire patterns ...
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7582974 |
Semiconductor device and method of manufacturing same
A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted;...
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7582972 |
Semiconductor device and fabrication method thereof
A semiconductor device includes a semiconductor substrate with circuit elements and electrode pads formed on one surface. This surface is covered by a dielectric layer with openings above the...
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7582968 |
Wiring board with a protective film greater in heights than bumps
A wiring board according to the present invention includes: an insulating base 22 ; a plurality of first conductor wirings 23 a aligned in an inner region on the insulating base; bumps 24 ...
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7579676 |
Leadless leadframe implemented in a leadframe-based BGA package
A leadless leadframe has a plurality of bottom leads and a plurality of top soldering pads formed in different layers. After encapsulation and before solder ball placement, a half-etching process...
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7576440 |
Semiconductor chip having bond pads and multi-chip package
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
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7576439 |
Electrically connecting substrate with electrical device
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion...
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7576437 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving...
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7576436 |
Structure of wafer level package with area bump
A package structure with an area bump has at least a chip (also known as a die), a redistribution layer, a plurality of first bumps (normal bumps) and at least a second bump (area bump). The...
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7576424 |
Semiconductor device
A semiconductor device including: a semiconductor substrate on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the semiconductor substrate, arranged along a...
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7576390 |
System for vertical DMOS with slots
A method for providing a high power, low resistance, high efficient vertical DMOS device is disclosed. The method comprises providing a semiconductor substrate with a source body structure thereon....
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7573138 |
Stress decoupling structures for flip-chip assembly
A stress decoupling structure provided underneath the under-ball-metallurgy (UBM) pads of a flip-chip bonding integrated circuit (IC) chip enhances the cyclic fatigue life of the solder joints...
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7569938 |
Interconnections for integrated circuits
An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described....
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7569936 |
Semiconductor device and method of manufacturing the same
A semiconductor device which is capable of avoiding an increase in pattern ratio and allowing wiring dummy patterns to improve global steps developed by CMP upon insertion of the dummy patterns...
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7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same
A semiconductor device includes: a first semiconductor chip face-down mounted on a substrate; a second semiconductor chip face-up mounted on the first semiconductor chip; an electromagnetic...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7566958 |
Multi-chip package for reducing parasitic load of pin
Multi-chip package includes first through Nth semiconductor chips, each of which includes an input/output pad, an input/output driver coupled to the input/output pad, and an internal circuit. Each...
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7564141 |
Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited
An integrated circuit containing multiple modules coupled to a pad via a multiplexer. The modules are selectively coupled to the pad by the multiplexer to provide integrated circuit function...
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7560810 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the...
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7557455 |
System and apparatus that reduce corrosion of an integrated circuit through its bond pads
A bond pad structure has a first conductive layer and an anti-reflective coating layer disposed on the first conductive layer. The first conductive layer includes first and second portions (which...
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7557453 |
Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device
A semiconductor device comprises a first electrode-lead having a first Au film, a first Ni film, a Cu film, a second Au film and a second Ni film stacked in order, a second electrode-lead having a...
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RE40819 |
Semiconductor device with improved bond pads
A semiconductor device with improved bond pads. The semiconductor device includes bond pads electrically connected to an active circuit in the device and openings formed in the bonding surface of...
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7554209 |
Semiconductor device having a metal plate conductor
The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS•FET for a high side switch and a power MOS•FET for a low side switch are connected in...
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7554169 |
Semiconductor device and method of manufacturing the same
It is provided a contacting method when a plurality of films to be peeled are laminating. Reduction of total layout area, miniaturization of a module, weight reduction, thinning, narrowing a frame...
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7547977 |
Semiconductor chip having bond pads
In one embodiment, a semiconductor chip has one or more peripheral bond pads. The semiconductor chip comprises a semiconductor substrate having a cell region and a peripheral circuit region...
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