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7315085 |
Ball grid array package and method thereof
A ball grid array package includes a substrate, a chip, a plurality of pads, a solder mask, a plurality of partitioning walls, and a plurality of solder balls. The substrate has an upper surface...
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7312535 |
Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer
The objects of the present invention is to improve the impact resistance of the semiconductor device against the impact from the top surface direction, to improve the corrosion resistance of the...
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7309904 |
Semiconductor device, magnetic sensor, and magnetic sensor unit
A semiconductor device, comprising a semiconductor chip; a pad electrode; an electrode portion; a wiring portion. An insulating portion is formed from electrically insulating material, covering the...
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7307352 |
Semiconductor package having changed substrate design using special wire bonding
A semiconductor package utilizing an existing substrate regardless of the change of the semiconductor chip design, and manufacturing method thereof are provided. The semiconductor package including...
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7307293 |
Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths
A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors...
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7304389 |
Semiconductor device and supporting plate
A semiconductor device includes a semiconductor element, a resin substrate where the semiconductor element is mounted, and a supporting plate configured to support the resin substrate. A first gas...
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7294928 |
Components, methods and assemblies for stacked packages
A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both...
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7294853 |
Substrate for mounting a semiconductor
A substrate ( 1 ) is formed from a non-electrically conducting material and is for mounting a semiconductor chip ( 10 ). The substrate has a semiconductor chip mounting portion ( 6 ). A number of...
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7291930 |
Input and output circuit of an integrated circuit chip
An input and output circuit of an integrated circuit chip for exchanging signals between logic circuits of the integrated circuit chip and a system. The input and output circuit includes a...
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7291928 |
Electric power semiconductor device
Semiconductor chips are connected to electrode terminals ( 6 a , 6 b ) by wire bonding, and connecting conductors connect extending portions ( 60 b , 60 c ) extending from a part of the electrode...
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7288837 |
Semiconductor device and its writing method
A semiconductor device mounted on a mother board has a circuit board to be positioned on the mother board and a semiconductor chip positioned on the circuit board. The circuit board has a...
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7288845 |
Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits
A wire connection structure for an integrated circuit (IC) die includes a semiconductor wafer with an active device and/or a passive device. One or more dielectric layers are arranged adjacent to...
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7286386 |
Semiconductor device
A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second...
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7282805 |
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that...
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7279787 |
Microelectronic complex having clustered conductive members
A microelectronic complex including a body of semi-conductor material containing an integrated circuit, and a plurality of contact pads on the body for receiving signal conducting members for...
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7279366 |
Method for assembling semiconductor die packages with standard ball grid array footprint
Apparatus and methods for forming semiconductor assemblies. An interposer includes a perimeter wall surrounding at least a portion of an upper surface thereof to form a recess. An array of...
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7276399 |
Method of designing a module-based flip chip substrate design
Methods and apparatus are provided for designing the electrical interconnects of a substrate. Modules are used to design sections of the electrical interconnects. Multiple modules may be...
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7276803 |
Semiconductor component and method for fabricating
Semiconductor components having a semiconductor body which includes a semiconductor base surface have to be sealed with a molding compound in order to protect against moisture or heat. Mechanical...
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7276797 |
Structure and method for fabricating a bond pad structure
A structure and method for an improved a bond pad structure. A top wiring layer and a top dielectric (IMD) layer over a semiconductor structure are provided. The buffer dielectric layer is formed...
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7276791 |
Board having alternating rows of processors and memories
An electronic device is provided on which semiconductor packages can be mounted efficiently. The electronic device includes a board that can receive a plurality of first semiconductor packages each...
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7274098 |
Chip packaging structure without leadframe
A chip packaging structure without leadframe includes a bare chip having one surface provided with a plurality of contacts, and an adhesive and a fixing layer sequentially attached to the surface...
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7274109 |
Modular bonding pad structure and method
A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at...
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7271484 |
Substrate for producing a soldering connection
A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that...
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7271485 |
Systems and methods for distributing I/O in a semiconductor device
Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a...
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7268303 |
Circuit board, mounting structure of ball grid array, electro-optic device and electronic device
In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board...
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7268422 |
Method of making a semiconductor device adapted to remove noise from a signal
What is invented is a semiconductor device ( 10 ) comprising a pellet ( 12 ) having a ground electrode ( 18 ), an outside signal terminal ( 15 ) connected to the pellet ( 12 ), so as to receive...
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7268437 |
Semiconductor package with encapsulated passive component
A semiconductor package with an encapsulated passive component mainly includes at least a substrate having a surface, a passive component and a molding compound. A plurality of SMD pads (Solder...
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7268433 |
Semiconductor device
A wiring layer is provided on a semiconductor substrate and extends in a predetermined direction. An external connection electrode terminal is provided on the wiring layer through a plurality of...
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7269028 |
Trace-pad interface for improved signal quality
A method of routing or laying out signal traces on printed wire or circuit board in order to improve signal transmission quality. The method includes routing a given signal trace such that it is...
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7262513 |
Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
A method and apparatus for making pad structures suitable for wirebonding and, optionally, also for solder-ball connections. Some embodiments include an electronics chip having a substrate with...
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7262512 |
Surface mount chip package
A surface mount chip package comprises a package housing made of a prescribed resin, which is formed to cover a semiconductor chip while avoiding a plurality of conductors extending from the...
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7259453 |
Hexagonal array structure for ball grid array packages
Solder balls may be arranged in hexagonal array on an integrated circuit package. The hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the...
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7259467 |
Semiconductor integrated circuit device
A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding...
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7259468 |
Structure of package
The present invention discloses a structure of wafer level packaging. The structure comprises a first patterned isolation layer, a conductive layer and a second patterned isolation layer. The first...
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7256488 |
Semiconductor package with crossing conductor assembly and method of manufacture
A semiconductor package uses various forms of conductive traces that connect to die bond pads via bond wires. In one form, adjacent bond wires are intentionally crossed around midpoints thereof to...
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7256504 |
Circuit support for a semiconductor chip and component
A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can...
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7253531 |
Semiconductor bonding pad structure
The invention provides a bonding pad structure. At least one lower circuit layer is disposed overlying the substrate, wherein the lower circuit layer is a layout of circuit under pad. A top circuit...
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7251010 |
Semiconductor chip and display device using the same
To realize an area reduction of a semiconductor chip without adding a process, and to provide a semiconductor chip structure having an excellent pressure balance when mounted. In the structure of...
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7247934 |
Multi-chip semiconductor package
A multi-chip semiconductor package and a fabrication method thereof are provided. At least one first chip is mounted on and electrically connected to an upper surface of a substrate via solder...
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7247948 |
Semiconductor device and method for fabricating the semiconductor device
A semiconductor device has a semiconductor substrate, at least a first and second rewiring device on a first surface of the semiconductor substrate for the provision of an electrical...
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7247951 |
Chip carrier with oxidation protection layer
A chip carrier comprising a laminated layer and an oxidation protection layer is provided. The oxidation protection layer is a non-electrolytic metallic coating or an organic oxidation protection...
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7246431 |
Methods of making microelectronic packages including folded substrates
A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion...
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7245016 |
Circuit layout structure
A circuit layout structure for a chip is provided. The chip has a bonding pad area, a nearby device area, and a substrate. The circuit layout structure essentially comprises a plurality of circuit...
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7245028 |
Split control pad for multiple signal
A control pad is split into two sections for output one of three signals selected from the group consisted of 00, 01, and 11 on an integrated circuit. Each section is internally connected to...
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7242099 |
Chip package with multiple chips connected by bumps
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the...
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7242102 |
Bond pad structure for copper metallization having increased reliability and method for fabricating same
According to one exemplary embodiment, a structure in a semiconductor die comprises a metal pad situated in an interconnect metal layer, where the metal pad comprises copper. The structure further...
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7239027 |
Bonding structure of device packaging
A bonding structure of device packaging includes a first substrate and a second substrate. The surfaces of the first substrate have metal pads and a first bonding layer connected to the second...
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7233075 |
Bonding pad structure
A substrate has a bonding region and a sensing region. A first dielectric layer is formed overlying the substrate and has a dielectric island surrounded by a ring-shaped trench. A first conductive...
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7234124 |
Method and apparatus for performing power routing on a voltage island within an integrated circuit chip
A method for performing power routing on a voltage island within an integrated circuit chip is disclosed. A first power grid is generated for a voltage island on metal levels 1 to N−1. Then, a...
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7230339 |
Copper ring solder mask defined ball grid array pad
A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second...
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