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6916433 |
Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at...
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6914326 |
Solder ball landpad design to improve laminate performance
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary...
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6911736 |
Electrostatic discharge protection
A package substrate that is adapted to receive at least one subject integrated circuit having a subject contact pattern, where the subject integrated circuit is selected from a design set of...
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6911721 |
Semiconductor device, method for manufacturing semiconductor device and electronic equipment
A semiconductor device includes a base substrate provided with a base wiring. A first substrate includes a first wiring to be electrically connected to the base wiring and is provided above the...
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6909188 |
Semiconductor device and manufacturing method thereof
There is disclosed a semiconductor device comprising a first wire and a pad portion thereof provided in a portion from an upper surface to an inner portion of a first insulation film provided above...
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6909187 |
Conductive wiring layer structure
A conductive wiring layer structure, applied to the conductive wiring layer structure under bonding pads of a die. The die has a substrate and can be partitioned into a central core circuit and a...
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6906418 |
Semiconductor component having encapsulated, bonded, interconnect contacts
A semiconductor component includes a die having a pattern of die contacts, and interconnect contacts bonded to the die contacts and encapsulated in an insulating layer. The component also includes...
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6906409 |
Multichip semiconductor package
A multichip semiconductor package and method of making is provided that has a plurality of semiconductor chips fabricated in electrical isolation one from another integrally on a singular...
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6906425 |
Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
An assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface mounted electronic device facing the printed circuit...
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6906424 |
Semiconductor package and method producing same
A semiconductor device package and method of fabricating same. The package includes a lead frame having a die paddle and a plurality of lead fingers. A first semiconductor die exhibiting a first...
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6903448 |
High performance leadframe in electronic package
Systems and techniques to provide a high performance leadframe architecture in electronic packages. An electronic package includes an extended area for wire bonding to provide improved high-current...
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6900533 |
Apparatus for routing electrical signals
An apparatus for routing electrical signals is a layered structure having a signal trace connected to a via and to a conductive stub trace on a first side. A reference layer is on a second side of...
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6900551 |
Semiconductor device with alternate bonding wire arrangement
A semiconductor device comprising a plurality of wires for electrically connecting a plurality of electrode pads arranged on a main surface of a semiconductor chip along one side of the...
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6897555 |
Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die
A BGA package having a multiplicity of power segments configured for power connection to integrated circuit die is disclosed. The BGA package substrate includes an integrated circuit die and a...
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6897563 |
Current crowding reduction technique using selective current injection
A technique for reducing current crowding on a bump using selective current injection is provided. The technique allows a bump to more uniformly inject current around the bump from vias on a metal...
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6894399 |
Microelectronic device having signal distribution functionality on an interfacial layer thereof
A microelectronic device includes a microelectronic die having an interfacial metal layer deposited over an active surface thereof to perform a signal distribution function within the device. The...
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6894419 |
Current passing circuit board for rotary electric machine inserted in molded resin
One current passing circuit board is constituted by one metal plate in which a continuous current passing pattern that is to be separated in a plurality of current passing patterns is formed, and...
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6894398 |
Insulated bond wire assembly for integrated circuits
An insulated bond wire to connect integrated circuits to each other or to substrates. Insulated bond wires may allow bond wires connecting integrated circuits and substrates to cross without...
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6894386 |
Apparatus and method for packaging circuits
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the...
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6891274 |
Under-bump-metallurgy layer for improving adhesion
An under-bump-metallurgy layer is provided. The under-bump-metallurgy layer is formed over the contact pad of a chip and a welding lump is formed over the under-ball-metallurgy layer. The...
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6891272 |
Multi-path via interconnection structures and methods for manufacturing the same
A multilayered circuit component includes one or more substrates. A first surface of one of the substrates includes circuit paths and other current carrying elements. A second surface of the same...
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6891275 |
Method for accommodating small minimum die in wire bonded area array packages
An area array package comprising a die attach area for attaching a die to a substrate, a network of staggered bond fingers, and a network of bond islands for coupling bond wires between the bond...
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6885046 |
Semiconductor integrated circuit configured to supply sufficient internal current
A semiconductor integrated circuit includes pads, a first power supply I/O cell which is connected to an external pin through a corresponding one of the pads, and a second power supply I/O cell...
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6876085 |
Signal layer interconnect using tapered traces
An interconnection device has a substrate that includes a conductive trace having an exposed portion at an edge of the substrate. The exposed portion is tapered toward the edge of the substrate....
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6876087 |
Chip scale package with heat dissipating part
In a chip scale package, a chip is mounted in a cavity formed in a leadframe. The leadframe includes a plurality of leads that radiate from a heat dissipating part located in the cavity. Each lead...
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6873037 |
Vertical surface mount package utilizing a back-to-back semiconductor device module
A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. The bond pads of both semiconductor devices are disposed adjacent a...
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6870273 |
High speed I/O pad and pad/cell interconnection for flip chips
Gridded I/O pads for flip-chip packages in which a coaxial-like solder bump pad configuration is used in which the I/O pads closest to the signal or bump pad are power or ground pads. The ground...
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6870262 |
Wafer-bonding using solder and method of making the same
A method is provided for forming a wafer stack. This may include providing a first wafer having a first plurality of metalized trenches on a surface of the first wafer. A second wafer may be...
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6870256 |
Semiconductor device having a thin-film circuit element provided above an integrated circuit
In a semiconductor device, re-wiring is provided on a circuit element formation region of a semiconductor substrate. A columnar electrode for connection with a circuit board is provided on the...
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6870267 |
Off-center solder ball attach assembly
A connection component includes a dielectric element having a first surface and a second surface, and conductive pads on the first surface of the dielectric element, each conductive pad having a...
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6870243 |
Thin GaAs die with copper back-metal structure
A thin GaAs Substrate can be provided with a copper back-metal layer to allow the GaAs Substrate to be packaged using conventional plastic packaging technologies. By providing the GaAs Substrate...
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6870276 |
Apparatus for supporting microelectronic substrates
058804113 A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The...
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6870255 |
Integrated circuit wiring architectures to support independent designs
An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections,...
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6867500 |
Multi-chip module and methods
A substrate includes first and second regions over which first and second semiconductor devices are to be respectively positioned. The first region is located at least partially within the second...
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6861343 |
Buffer metal layer
An integrated circuit having a top passivation layer and bonding pads, where the improvement is a metal layer overlying all of the integrated circuit. The metal layer overlies the top passivation...
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6861748 |
Test structure
A test structure for an integrated circuit having a first underlying conductive layer. A first nonconductive layer is disposed over the first underlying conductive layer, and a first overlying...
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6861749 |
Semiconductor device with bump electrodes
A semiconductor device comprises a substrate having contact pads each covered by under bump metallurgy and a plurality of bump electrodes respectively provided on the under bump metallurgy covering...
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6858928 |
Multi-directional wiring on a single metal layer
An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections,...
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6858946 |
Semiconductor device
A semiconductor device for forming a coil with a high inductance and a high Q value on a semiconductor substrate. A semiconductor device 10 comprises a rectangular semiconductor substrate 12 ,...
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6858944 |
Bonding pad metal layer geometry design
A bonding pad suitable for use in wire bonding an integrated circuit includes an approximately rectangular metal pattern. The bonding pad has at least one slot or hole in it, located at or adjacent...
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6858943 |
Release resistant electrical interconnections for MEMS devices
A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device,...
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6853287 |
Coil for use on a substrate
There is provided a coil and a method for fabricating the same. One embodiment of the coil includes a plurality of traces in one area of a substrate. Each trace has a first end located at a first...
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6853087 |
Component and antennae assembly in radio frequency identification devices
Permanent physical and electrical attachment of electrically conductive contacts of a first component in a RFID device, such as a smart card or smart inlay, is made to the electrically conductive...
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6853092 |
Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device
The present invention provides a circuit board including a plurality of pads for mounting a semiconductor device with bumps and a plurality of wires drawn from the respective pads, a mounting...
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6853063 |
Semiconductor device and communication terminal using thereof
Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on...
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6853091 |
Printed circuit board and soldering structure for electronic parts thereto
A printed circuit board having circuit patterns printed thereon has a plurality of composite lands each including a first land having a terminal hole formed at its center for inserting the terminal...
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6853090 |
TAB tape for semiconductor package
A TAB tape for a semiconductor package is provided. The TAB tape provides number of test pad configuration for reducing the area of the test pad area on a TAB tape to increases the number of...
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6849929 |
IC chip and semiconductor device
An IC chip has externally and selectively cuttable members F 1 -F 3 , which can be cut, or cut open, at more than one cuttable points C 1 and C 2 . So long as at least one of the multiple cuttable...
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6849956 |
Semiconductor integrated circuit with shortened pad pitch
An semiconductor integrated circuit includes a plurality of first pads having first size, a plurality of second pads having second size smaller than the first size, a switch circuit which couples...
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6847117 |
Semiconductor device including a passivation film to cover directly an interface of a bump and an intermediated layer
There are included a semiconductor substrate provided with a desirable element region, an electrode pad formed to come in contact with a surface of the semiconductor substrate or a wiring layer...
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