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Match Document Document Title
8994184 Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP  
A semiconductor device has a substrate with a plurality of conductive vias and conductive layer formed over the substrate. A semiconductor die is mounted over a carrier. The substrate is mounted...
8959760 Printed wiring board and method for manufacturing same  
A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming...
8963315 Semiconductor device with surface electrodes  
A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a...
8952529 Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids  
A semiconductor device has a semiconductor die with a plurality of bumps formed over a surface of the semiconductor die. A first conductive layer having first and second segments is formed over a...
8907486 Ruthenium for a dielectric containing a lanthanide  
A gate containing ruthenium for a dielectric having an oxide containing a lanthanide and a method of fabricating such a combination gate and dielectric produce a reliable structure for use in a...
8786107 Semiconductor module  
A semiconductor module includes a semiconductor having a semiconductor substrate, a first electrode formed on one surface of the semiconductor substrate, and a second electrode formed on an...
8674520 Semiconductor device, method for manufacturing the same, and power supply unit  
A method for manufacturing a semiconductor device includes placing a sheet containing a fibrous material having at least one outer surface having a metal on a semiconductor chip-mounting region of...
8643188 Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector  
A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side...
8633592 Hybrid interconnect technology  
In one embodiment, an interconnect structure between an integrated circuit (IC) chip and a substrate comprises a plurality of materials.
8633601 Interconnect assemblies and methods of making and using same  
The various embodiments of the present invention provide fine pitch, chip-to-substrate interconnect assemblies, as well as methods of making and using the assemblies. The assemblies generally...
8633593 Semiconductor device  
A semiconductor device includes a semiconductor substrate; and a through electrode that penetrates the semiconductor substrate. The semiconductor substrate has a groove structure that is...
8581422 Semiconductor module  
A semiconductor module includes a semiconductor device, a first conductive member, a second conductive member, a cylinder, and a cover. The first conductive member is in contact with a first...
8546956 Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding  
At least one metal adhesion layer is formed on at least a Cu surface of a first device wafer. A second device wafer having another Cu surface is positioned atop the Cu surface of the first device...
8531027 Press-pack module with power overlay interconnection  
Systems and methods for utilizing power overlay (POL) technology and semiconductor press-pack technology to produce semiconductor packages with higher reliability and power density are provided. A...
8531042 Technique for fabricating microsprings on non-planar surfaces  
A processing technique facilitating the fabrication of the integrated circuit with microsprings at different vertical positions relative to a surface of a substrate is described. During the...
8471377 Semiconductor device and semiconductor circuit substrate  
A semiconductor circuit substrate includes a transistor-forming substrate and a circuit-forming substrate. The transistor-forming substrate is a GaN substrate and has a Bipolar Junction Transistor...
8466544 Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP  
A semiconductor device has a substrate with a plurality of conductive vias and conductive layer formed over the substrate. A semiconductor die is mounted over a carrier. The substrate is mounted...
8415791 Semiconductor device and fabrication method therefor  
A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a...
8350345 Three-dimensional input control device  
Some embodiments provide force input control devices for sensing vector forces comprising: a sensor die comprising: a rigid island, an elastic element coupled to the rigid island, die frame...
8338946 Semiconductor module, method of manufacturing semiconductor module, and mobile device  
An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a...
8314444 Piezoresistive pressure sensor  
A piezoresistive pressure sensor is provided, which can prevent the occurrence of ESD breakdown due to the nearness of interconnection layers of a resistive element according to miniaturization...
8294263 Light-emitting diode packaging structure and module and assembling method thereof  
A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first...
8278753 Semiconductor device and production method thereof  
The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the...
8143719 Vented die and package  
A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The...
8125085 Semiconductor device having wiring with oxide layer of impurity from the wiring  
A semiconductor device includes an interlayer film formed over a semiconductor substrate. A groove is formed in the interlayer film. A wiring formed in the groove is a copper alloy including...
8030782 Metal-metal bonding of compliant interconnect  
Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component...
8026603 Interconnect structure of an integrated circuit and manufacturing method thereof  
An interconnect structure of an integrated circuit and manufacturing method therefore are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes...
7982308 Light-emitting diode packaging structure and light-emitting diode module  
A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode,...
7948007 Power semiconductor module with flush terminal elements  
A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being...
7884489 Press-fit integrated circuit package involving compressed spring contact beams  
An insulative substrate includes a plurality of flexible retaining clips and a plurality of alignment and retaining pins. A metal leadframe includes a plurality of leads. Each lead terminates in a...
7855452 Semiconductor module, method of manufacturing semiconductor module, and mobile device  
An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a...
7755206 Pad structure to provide improved stress relief  
A semiconductor interconnection comprises a semiconductor device, a substrate adjacent the semiconductor device, and a plurality of spring contacts on the semiconductor device or the substrate. A...
7750487 Metal-metal bonding of compliant interconnect  
Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component...
7745943 Microelectonic packages and methods therefor  
A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first...
7692280 Portable object connectable package  
A portable object connectable package for an electronic device comprises: semiconductor die package, having a top surface and an opposite bottom surface, and a connector body mechanically...
7692293 Semiconductor switching module  
A semiconductor switching module includes a power semiconductor element that is embodied in planar technology. In at least one embodiment, the power semiconductor element is provided with a base...
7687900 Semiconductor integrated circuit device and fabrication method for the same  
The semiconductor integrated circuit device includes: an active element, an interlayer insulting film, first and second metal patterns made of a first metal layer formed right above the active...
7683494 Press-fit integrated circuit package involving compressed spring contact beams  
An insulative substrate includes a plurality of flexible retaining clips and a plurality of alignment and retaining pins. A metal leadframe includes a plurality of leads. Each lead terminates in a...
7656017 Integrated circuit package system with thermo-mechanical interlocking substrates  
An integrated circuit package system includes providing a plurality of substrates; inserting a receptor in one of the substrates, the receptor held in and not extending through the one of the...
7592698 Power semiconductor modules having a cooling component and method for producing them  
An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal...
7592710 Bond pad structure for wire bonding  
A bond pad structure of an integrated circuit is provided. The bond pad structure includes a conductive bond pad, a first dielectric layer underlying the bond pad, and an Mtop plate located in the...
7589418 Pressure contact power semiconductor module  
A power semiconductor module in a pressure contact embodiment, for disposition on a cooling component, in which load terminals are formed as metal molded bodies, each with at least one flat...
7582975 Nanowire device and method of making the same  
A nanowire device includes a nanowire formed between two surfaces, and a gap formed at a predetermined location in the nanowire.
7518251 Stacked electronics for sensors  
A stacked electronics module comprises a first layer including a first substrate having a front side and a backside, a first electrical interconnect layer disposed on the first substrate and a...
7459795 Method to build a wirebond probe card in a many at a time fashion  
Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact...
7459376 Dissociated fabrication of packages and chips of integrated circuits  
A method of fabricating a semiconductor component includes providing a prefabricated frame that includes metal traces and lead-through contacts. A semiconductor chip is mounted into the...
7408119 Electrical interconnection for high-frequency devices  
Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One...
7400041 Compliant multi-composition interconnects  
A compliant interconnect with two or more layers of metal of two or more compositions with internal stresses is described herein.
7394163 Method of mounting semiconductor chip  
A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the...
7358118 Mounting method of flexible printed circuit and manufacturing method of electric optical device  
Aspects of the current invention are directed to a method of mounting a flexible printed circuit and a manufacturing method of an electric optical device. Each of the methods form semiconductor...

Matches 1 - 50 out of 338 1 2 3 4 5 6 7 >