Matches 201 - 250 out of 338 < 1 2 3 4 5 6 7 >


Match Document Document Title
4429453 Process for anodizing surface of gate contact of controlled rectifier having interdigitated gate and emitter contacts  
Coplanar interdigitated gate and emitter contacts are accessible at the surface of a large area wafer forming a high power, high speed controlled rectifier. A pressure contact is made to the...
4404582 Mounting arrangement for disc mounted semiconductor devices  
An assembly of disc mounted, compression bonded-encapsulated, semiconductor devices is provided with positioning elements from the sheet metal serving as a heat sink and electrical bus adjacent...
4390891 Semiconductor component with a plurality of semiconductor elements  
Semiconductor component having a plurality of semiconductor elements disposed in a case, including a bottom of the case, and case terminals, including conductor bars electrically connecting the...
4389662 Light-activated semiconductor device  
A light activated semiconductor device comprising a semiconductor element activated by an optical signal; at least two main electrodes, mutually insulated, for passing current from the activated...
4381131 Levered system connector for an integrated circuit package  
The disclosed system connector is comprised of a frame that is adapted to receive an integrated circuit package such that electrical conductors in the frame align with corresponding electrical...
4381518 Semiconductor component with several semiconductor elements  
Semiconductor component with a plurality of semiconductor elements disposed in a case having a metallic bottom being in heat-conducting contact with the semiconductor elements, electrical leads,...
4370671 Semiconductor device  
A semiconductor device comprises a semiconductor wafer arranged between metallic connecting members for supplying electric current to, and leading it from, the wafer, each connecting member having...
4358785 Compression type semiconductor device  
A compression type semiconductor device includes a semiconductor element; at least one metal plate having substantially upright edge surfaces, a planar contacting surface engaging a first surface...
4348687 Clamping assembly for thyristor column  
A stack or column of thyristors and cooling capsules has two end pieces and a clamping frame of plastic surrounding the stack and the end pieces. The frame consists of two end-to-end half-shells...
4333101 Semiconductor heat sink mounting assembly  
A field replaceable silicon controlled rectifier (SCR) heat sink with reliable thermal and electrical connection to the SCR or other electronic device for an electronic circuit forming part of a...
4313128 Compression bonded electronic device comprising a plurality of discrete semiconductor devices  
An electronic device is provided comprising two or more discrete semiconductor devices in an electrical circuit relationship, hermetically sealed within a single case member. Electrical and...
4305087 Stud-mounted pressure assembled semiconductor device  
A semiconductor wafer having one or more junctions is mounted on the pedestal of a threaded stud. The stud has a hexagonal outer surface and an upstanding hollow cylindrical member which forms an...
4263607 Snap fit support housing for a semiconductor power wafer  
A support housing for a semiconductor wafer which is centered therein between the anode block and the cathode block. It includes two polygonal insulating plates which bear against each of the...
4249196 Integrated circuit module with integral capacitor  
The disclosure is of an integrated circuit assembly comprising a base which carries an integrated circuit chip and a cover which protects the chip. The cover has embedded therein a capacitor which...
4218695 Semiconductor rectifier housing assembly  
Semiconductor component includes a closed housing having a base and a cover and being formed with a plurality of recesses therewithin, a plurality of semiconductor elements received in the...
4203646 Clip for electrically connecting planar elements, such as solar cells, and the like, in series  
A clip is disclosed for interconnecting planar elements, such as solar cells, and the like, in series. The cells are connected by the clip to electrically interconnect a top circuit of one element...
4196442 Semiconductor device  
A semiconductor device comprises a semiconductor substrate and at least one supporting electrode soldered to one surface of the semiconductor substrate. The supporting electrode is constituted by...
4150394 Flat package semiconductor device having high explosion preventing capacity  
A semiconductor element is disposed within a hollow cylindrical, electrically insulating member. The member has each of opposite open ends closed with a respective electrode of the element and a...
4104676 Semiconductor device with pressure electrical contacts having irregular surfaces  
The present invention is directed to a semiconductor device comprising a body of semiconductor material having at least one p-n junction therein. The body of semiconductor material has opposed,...
4099201 Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc  
A semiconductor rectifier assembly comprises first and second electroconductive posts having portions between which a semiconductor body is sandwiched under pressure. A sealed housing for the...
4097887 Low resistance, durable gate contact pad for thyristors  
The specification discloses a power thyristor of the P-gate type wherein the outer cathode layer of N type conductivity overlies the P layer in the gate region. A gate pad is formed as a metallic...
4079409 Thyristor with pressure contacting  
An improved thyristor with pressure contacting in which at least a portion of the control base zone in addition to the cathode zone extends on a single major surface of a wafer-shaped thyristor...
4041523 A controllable semiconductor component having massive heat dissipating conically shaped metal bodies  
A controllable semiconductor component element has a housing of two massive metal bodies, each of which has a flange which is axially and radially embraced by an insulating ring. A semiconductor...
4035831 Radial emitter pressure contact type semiconductor devices  
The pressure contact type semiconductor device comprises a transistor including a semiconductor substrate, an emitter region having portions protruding from the surface of the substrate and...
4021839 Diode package  
A diode package comprising a compressible dielectric member having an aperture extending through its two major opposite surfaces. An electrically conductive lid is attached on one of the major...
4008487 Semiconductor component with pressure contact  
The present invention is directed to a semiconductor device incorporating a semiconductor element which is provided with a housing having at least a base member, a top member and an insulator...
4000509 High density air cooled wafer package having improved thermal dissipation  
A high density low profile air cooled wafer package including flip chip and embedded logic or memory islands upon a wafer package mounted within a heat dissipating cover having improved thermal...
3992717 Housing for a compression bonded encapsulation of a semiconductor device  
An assembly comprising a metal-semiconductor-metal element, an insulating sleeve member disposed about the metal-semiconductor-metal element and a metal pole piece contact. The three elements...
3991461 Encapsulated semiconductor devices  
An improved method of constructing a semiconductor device of the encapsulated type wherein a stack of members including a semiconductor element is encapsulated along with spring means ensuring...
3962669 Electrical contact structure for semiconductor body  
An improved semiconductor device is described which utilizes stable, slow diffusing resilient contacts that also serve as a suspension support for a semiconductor body.
3950778 Semiconductor device and case member  
An improved case member for a power semiconductor device is comprised of compacted powdered iron infiltrated with copper to provide good electrical and thermal contact for the semiconductor...
3947868 Air-cooled converter assembly, having heat sinks shaped as isosceles triangles  
An air cooled converter assembly employing disc thyristors in which the disc thyristors are clamped between conducting heat sinks, arranged in pairs side-by-side transversely to their common axis,...
3943426 Thyristor column  
The invention concerns a thyristor column with disc thyristors which are stacked on top of each other and are mounted resiliently. A heat sink, which serves simultaneously as a conductor of...
3941928 Corona-free high voltage connector  
A pair of television receiver high voltage connectors, connecting the receiver high voltage rectifier to the cathode ray tube anode lead and the high voltage transformer, each include a resilient...
3940787 Mounting for locking disc shaped semiconductor element in a housing  
An assembly composed of a disc-shaped semiconductor component mounted on a support disc and disposed in an annular ceramic housing, with the support disc resting on a first contacting disc, a...
3940786 Device for connecting leadless integrated circuit package to a printed circuit board  
This invention relates to a device which electrically connects a leadless integrated circuit package to a printed circuit board. More particularly, the device includes a square frame having a...
3916433 Semiconductor arrangement and method of production  
A semiconductor arrangement having semiconductor rectifier wafers arranged in a plane and contacted between portions of associated conductors forming a clamp-type mounting. All of the conductor...
3916435 Heat sink assembly for button diode rectifiers  
A heat sink assembly for a power semiconductor button-type diode which is easily assembled without requiring any soldered connections. An extruded heat sink has at least two spaced parallel...
3886586 Thyristor housing assembly  
A disk-shaped gas tight thyristor housing assembly is provided which consists of a housing formed of an insulating ring shaped wall and two metal cover plates with a thyristor mounted therein. The...
3885243 Semiconductor device  
Two or more semiconductor device connected in series opposition and contacted by pressure contacts are enclosed in a common housing to form a surge diverter. The two diodes connected in series...
3877061 SEMICONDUCTOR COMPONENT WITH MIXED ALUMINUM SILVER ELECTRODE  
This invention provides a semiconductor component which includes a semiconductor element comprising a silicon semiconductor member having several zones of alternating conductivity with at least...
3842189 CONTACT ARRAY AND METHOD OF MAKING THE SAME  
A contact array for electrically connecting two electrical devices, such as a radiation detector and a miniaturized electrical circuit, but with a minimum of heat conduction between the devices....
3801882 THERMO-ELECTRIC MOUNTING METHOD FOR RF SILICON POWER TRANSISTORS  
A thermo-electric transistor mounting fixture is provided, using a mounting ixture/heat sink, a beryllium oxide washer, brass spacer, emitter ground pin socket and nylon hold down screws. The...
3757277 ELECTRICAL CONNECTOR  
An electrical connector comprising electrical contacts and an insulator body for supporting the electrical contacts, a shank of each of electrical contacts which is supported in the supporting...
3753052 RECTIFIER BRIDGE ASSEMBLY COMPRISING STACK OF HIGH-CURRENT PN SEMICONDUCTOR WAFERS IN A SEALED HOUSING WHOSE END CAPS COMPRISE AC TERMINALS OF THE BRIDGE  
An integrally housed bridge circuit including a plurality of high power semiconductor rectifiers. The rectifiers are disposed within a hermetically sealed insulative housing and are electrically...
3747044 MICROWAVE INTEGRATED CIRCUIT (MIC) GROUND PLANE CONNECTOR  
Electrical connector formed of a beryllium copper spring metal and situated to make electrical connection between the ground planes of separate MIC substrates. The connector is resiliently seated...
3743893 FLUID COOLED COMPRESSION BONDED SEMICONDUCTOR DEVICE STRUCTURE  
This disclosure relates to a semiconductor device structure in which a plurality of semiconductor devices are held in a compressive relationship by resilient plates.
3717797 ONE PIECE ALUMINUM ELECTRICAL CONTACT MEMBER FOR SEMICONDUCTOR DEVICES  
A solid one piece electrical contact member is resiliently held in direct physical, electrical, and thermal conductive contact with an electrode affixed to a surface of a body of semiconductor...
3652903 FLUID COOLED PRESSURE ASSEMBLY  
Disclosed is a cooled pressure assembly for applying clamping pressure to a plurality of semiconductor rectifiers and for electrically connecting them in parallel. The pressure is applied via a...
3649890 HIGH BURNOUT RESISTANCE SCHOTTKY BARRIER DIODE  
A semiconductor rectifier device particularly suited for mixing and/or detecting electric wave signals in the microwave frequency range and having a high resistance to RF burnout is disclosed. A...

Matches 201 - 250 out of 338 < 1 2 3 4 5 6 7 >