Matches 151 - 200 out of 338 < 1 2 3 4 5 6 7 >


Match Document Document Title
RE35119 Textured metallic compression bonding  
Integrated circuit chip-to-chip interconnections are made via gold pads on each chip that are bonded to corresponding gold pads on a silicon wafer chip carrier. The pads on the chips and/or the...
5457344 Test fixtures for C4 solder-bump technology  
A two-level metal connector having only one via level accommodates motion due to thermal expansion and manufacturing tolerances by decoupling vertical and lateral freedom of motions. The lateral...
5451816 Integrated circuit package receptacle  
An IC package receptacle is disclosed in which, as an actuator is pushed down, a pushing surface thereof pushes down pressure bearing portions of a plurality of contacts against an elastic force...
5434452 Z-axis compliant mechanical IC wiring substrate and method for making the same  
A compliant integrated circuit (IC) wiring substrate (10) has an insulative carrier film (14) and a plurality of micro-beam conductors (12) in the carrier film. Each of the plurality of micro-beam...
5420461 Integrated circuit having a two-dimensional lead grid array  
An integrated circuit device having an array of flexible leads attached to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality...
5331513 Method of mounting electronic part on circuit substrate and circuit substrate including electronic parts mounted thereon  
In order to electrically connect the projecting electrodes of an LSI with a given wiring pattern on a circuit substrate, at least a portion of the electronic part is covered with a heat-shrinkable...
5304847 Direct thermocompression bonding for thin electronic power chips  
Annealed copper foil (12) is coated with chromium film (16), followed by coating with an appropriate thickness of gold film (14) and is thermocompression bonded to an aluminum metallized substrate...
5283468 Electric circuit apparatus  
An electric circuit apparatus comprises an electrically connecting member including a holding body made of an electrically insulating material and a plurality of electrically conductive members...
5237203 Multilayer overlay interconnect for high-density packaging of circuit elements  
A multilayer overlay interconnect for packaging various circuit elements such as integrated-circuit (IC) chips in high-density configurations. The overlay interconnect allows multiple IC chips to...
5229647 High density data storage using stacked wafers  
A solid-state memory unit is constructed using stacked wafers containing a large number of memory units in each wafer. Vertical connections between wafers are created using bumps at the contact...
5089880 Pressurized interconnection system for semiconductor chips  
A multilayer pressure stack (microstack) has a plurality of layers formed of a material that may have a high time-dependent deformation factor and a plurality of segments formed in each layer....
5061984 Substrate and device comprising interconnection structures  
For face-down bonding by means of (pressure) contacts interconnection structures (bumps) 3 are provided in rows or line arrangements (11) on a substrate 2. This leads to a better distribution of...
5057901 Lead frame for semi-conductor device  
A lead frame for orienting and then mounting a plurality of clip leads on a semi-conductor device or substrate and method.
5047836 Temperature compensating contact to avoid misregistration  
According to the present invention, one surface of a temperature compensator is arranged to face the surface of a first electrode which is formed on one surface of a semiconductor element while...
5040051 Hydrostatic clamp and method for compression type power semiconductors  
Hydrostatic clamping devices (20, 40) are provided to exert uniform pressure across the faces of components such as wafers (22) to constitute an integrated electronics package or power bar. The...
4987476 Brazed glass pre-passivated chip rectifier  
A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at...
4985752 Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements  
A harmetically sealed circuit assembly (10) containing a plurality of circuit elements (74, 76 and 80) which are to be compression bonded upon application of a force through opposed first and...
4982267 Integrated semiconductor package  
An integrated semiconductor package comprising a semiconductor body having a first surface and a plurality of pins, each pin having first and second ends. Also disclosed is an apparatus for...
4972580 Method for connecting electronic components with dummy patterns  
To electrically connect a plurality of connecting terminals of an electronic component, e.g., a liquid crystal display device (LCD) to a printed circuit board, a plurality of wiring patterns are...
4965658 System for mounting and cooling power semiconductor devices  
Semiconductor apparatus for mounting and cooling disc type semiconductor devices. The apparatus includes two disc type semiconductor devices each having a pole face thereof in contact with a first...
4956696 Compression loaded semiconductor device  
A compression loaded semiconductor device package (40) in accordance with the invention includes a cylindrical semiconductor device (54) having a first region (66) on a first face, a control...
4953003 Power semiconductor device  
In a pressure-contacted power semiconductor device, a series of metallization layers provide a pressure-contacting electrode comprising a titanium layer upon a semiconductor body, and a copper...
4949148 Self-aligning integrated circuit assembly  
A multi-chip integrated circuit package includes a high-precision self-aligning assembly including a wafer with alignment apertures, a die with alignment slots and pin blocks for mating with both...
4922376 Spring grid array interconnection for active microelectronic elements  
A mechanical and electrical interconnection of an active integrated circuit to a passive substrate. The interconnection includes a contact retainer having resilient elements disposed in apertures...
4918514 Press-contact type semiconductor device  
A soft metal plate having substantially equal hardness as emitter electrodes formed of soft metal is disposed between the emitter electrodes and a heat buffer metal plate formed of hard metal, and...
4908935 Method for fabricating electronic devices  
In a hybrid integrated circuit encapsulation process, each lead array (14) is encompassed by an elongated C-shaped barrier member (17) which clamps onto the portions of the lead array adjacent the...
4882612 Power semiconductor device  
In a power semiconductor device according to the present invention, a sheet, formed of a soft metal such as Ag, is provided on that portion of a pressing control electrode which is brought into...
4879589 Hermetic leadless semiconductor device package  
An hermetic leadless package for a planar p-n, Schottky or other diode has a planar base and cover made of electrically conductive metal in order to serve as the contacts of the diode necessary to...
4803180 Method for manufacturing pressure contact semiconductor devices  
A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support...
4792844 Pressure contact semiconductor device  
A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support...
4775916 Pressure contact semiconductor device  
A pressure contact semiconductor device has a semiconductor substrate disposed on a metal post electrode through metal electrode plate, an insulating ring engaged with the periphery of the metal...
4734755 Alternating load stable switchable semiconductor device  
A semiconductor device element, switchable and stable against alternating loads, is provided as an intermediate product which can be stored, can be applied universally, has a semiconductor wafer...
4720742 Semiconductor device carrier  
A semiconductor device carrier includes a carrier substrate having an open section in which a semiconductor device is accommodated, and a retaining member slidably coupled to the carrier substrate...
4694322 Press-packed semiconductor device  
A common insulation plate is provided on a heat-discharging support member, and a plurality of press-packed semiconductor elements is provided on the common insulation plate. These semiconductor...
4675719 Thyristor device  
A thyristor device where the thyristor and protection device are formed flat with two surfaces thereof operating as a electrodes, and the conductive plate which electrically connects these...
4647959 Integrated circuit package, and method of forming an integrated circuit package  
An integrated circuit package comprises an integrated circuit chip and a flexible sheet-form interconnect member that comprises dielectric material and conductor runs supported by the dielectric...
4646131 Rectifier device  
A rectifier device which includes a first radiating fin, a flat type semiconductor element which is disposed in contact with one surface of said first radiating fin, a substantially cylindrical...
4614964 Coaxial semiconductor package  
A semiconductor package including a first electrically conductive bus and a second electrically conductive bus spaced from and generally surrounding the first bus in approximately concentric...
4609937 Power semiconductor device with O-ring seal  
A power semiconductor device dispensed with soldering and useful for fork lifts and etc., wherein at least one O-ring is provided between the inner wall of case housing at least one semiconductor...
4607275 Semiconductor element with disk-shaped housing  
A disk-shaped housing for a semiconductor element comprising a cup (1) of insulating material with an opening (2) at the bottom. Through this opening (2) passes a contact surface (4) of one of two...
4603344 Rotating rectifier assembly  
A rotatable rectifier assembly for use in a brushless generator. A housing 40 receives a stack of heat sinks 56-68 which are both thermally and electrically conductive and which sandwich diode...
4601526 Integrated circuit chip carrier  
An integrated circuit chip carrier having miniaturized electrical input/output interconnectors, such that the area of the chip carrier may be matched or minimized with respect to the area of the...
4556898 Semiconductor device  
A semiconductor device includes a semiconductor element (21) having a cathode (21d) divided into a plurality of islands, each of the cathode islands (21d) being electrically connected through a...
4541000 Varactor or mixer diode with surrounding substrate metal contact and top surface isolation  
A varactor or mixer diode comprises a mesa shaped semiconductor element having a p-n junction barrier layer or retifying junction on its upper face and a substrate contact on its opposite face,...
4504850 Disc-type semiconductor mounting arrangement with force distribution spacer  
A disc-type semiconductor mounting arrangement is provided with force distribution spacers. One side of each spacer contains a counterbore which prevents contact between the center of the spacer...
4500904 Semiconductor device  
A solder joint between a semiconductor substrate and an electrode is disclosed in which that principal surface of the semiconductor substrate where an n-type semiconductor layer is exposed is...
4500907 Pressure-applied type semiconductor device  
A pressure-applied type semiconductor device, in which a metal stamp for urging a semiconductor body is formed with a peripheral annular groove. When pressure is applied, the groove is elastically...
4492975 Gate turn-off thyristor stack  
A GTO thyristor stack comprises a pair of GTO thyristors in parallel connection and a pair of diodes in anti-parallel connection therewith. The elements in one of the GTO thyristor pair and the...
4477826 Arrangement for aligning and attaching a shim to a semiconductor element  
A contact shim for insertion between an electrode internal contact member and a contact surface of a semiconductor element in a semiconductor device assembly. The shim has a generally continuous...
4446478 Assembly in a single case of a main power-switching semiconductor component and a destorage diode  
In the pressure association of a main component such as a Darlington transistor or an amplifying gate thyristor and a storage diode, a specific destorage diode comprising an annular junction....

Matches 151 - 200 out of 338 < 1 2 3 4 5 6 7 >