Matches 101 - 150 out of 338 < 1 2 3 4 5 6 7 >


Match Document Document Title
6396155 Semiconductor device and method of producing the same  
A semiconductor device includes a semiconductor element on which a plurality of bumps are formed and a substrate having a first surface on which a plurality of protruding electrodes are...
6384486 Bonding over integrated circuits  
An architecture and method of fabrication for an integrated circuit 200 having a bond pad 208; at least one portion of said integrated circuit disposed under said contact pad and electrically...
6373141 Bondable compliant pads for packaging of a semiconductor chip and method therefor  
A microelectronic package comprising a microelectronic element, resilient element including one or more intermediary layers capable of being wetted and assembled with the microelectronic element,...
6320268 Power semiconductor module  
A power semiconductor module in which at least one semiconductor chip with which contact is made by pressure is electrically connected via a contact element to a main connection. The contact...
6297560 Semiconductor flip-chip assembly with pre-applied encapsulating layers  
A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to...
6249440 Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board  
The contact arrangement is a connector block for detachably fastening an electrical component, particularly an integrated circuit having a plurality of terminal contacts disposed in a ball grid...
6232654 Semiconductor module  
A semiconductor module includes a MOSFET chip and a package for accommodating the MOSFET chip. The drain area of the MOSFET chip is connected to a base substrate. A source and a gate electrode are...
6204564 Semiconductor device and method for making the same  
A semiconductor device comprising a film substrate and a semiconductor chip bonded to an upper surface of the film substrate is provided. The semiconductor chip has a main surface formed with a...
6201306 Push-up pin of a semiconductor element pushing-up device, and a method for separating  
A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet...
6191471 Tape carrier package with two regions having leds that connect upon folding  
A tape carrier package is provided with a first region which includes a plurality of input leads for transmitting an input signal between a liquid crystal driver IC chip and a section external to...
6179625 Removable interlockable first and second connectors having engaging flexible members and process of making same  
A removably interlockable connector assembly and process for making the assembly that include a first connector having a head on a mesa and a second connector having an opening that receives the...
6166445 Semiconductor device and method for producing same  
A void-collection section is provided on a GaAs FET chip at a location that avoids a heat-generating region of the chip. Pressure is applied to the rear surface of the substrate corresponding to...
6153938 Flip-chip connecting method, flip-chip connected structure and electronic device using the same  
A stable low-connecting resistance connection arrangement having a high yield rate without using any special material or process for a substrate. A flip-chip connecting structure in which the...
6144039 Low melting pads for instant electrical connections  
The present invention discloses a pad for establishing instant electrical connection (PIEC) for in-line ion measurement device. The PIEC pad employs low-melting-point conductive materials, such as...
6114221 Method and apparatus for interconnecting multiple circuit chips  
A method for fabricating an interconnected multiple circuit chip structure by etching a first substrate to form protrusions on its surface. Then the protrusions are preferentially etched to...
6084311 Method and apparatus for reducing resin bleed during the formation of a semiconductor device  
A semiconductor device assembly having a support such as a lead frame paddle comprises a coating thereon to reduce or eliminate the flow of die attach adhesive from under the die and over bond...
6081039 Pressure assembled motor cube  
A pressure assembled power module is provided with first and second die, the first and second die being stacked atop one another and sandwiched between first and second conductive sheets, where...
6046910 Microelectronic assembly having slidable contacts and method for manufacturing the assembly  
A microelectronic assembly and a method for manufacturing the assembly include an integrated circuit component attached to a substrate via polymeric bodies. The integrated circuit component has...
6040625 Sensor package arrangement  
A highly sensitive silicon micro-machined sensor package is provided for use in a micro-g environment that can also resist high shock in excess of 5000 g. The sensor is provided to measure...
6025618 Two-parts ferroelectric RAM  
A method of fabricating a complex IC in two parts and making the electrical connections between them afterwards is described. By this method, a ferroelectric RAM is fabricated in two parts, where...
5990501 Multichip press-contact type semiconductor device  
A multichip press-contact type semiconductor device including a plurality of semiconductor chips, a plurality of heat buffer plates, a conductive metal sheet, and first and second press-contact...
5977568 Power semiconductor component with a pressure-equalizing contact plate  
The present invention discloses a power semiconductor component 1 having a special pressure contact system which is suitable, for example, for circuit-breakers, rectifiers, or the like in...
5962924 Semi-conductor die interconnect  
An improved flip-chip bond connection and bonding method uses a "press fit" bond between a set of bond pad bumps or projections on a semiconductor chip and corresponding set of substrate bumps or...
5949137 Stiffener ring and heat spreader for use with flip chip packaging assemblies  
A stiffener device for use with a flip chip packaging assembly including a generally rectangular, plate-like member having a substantially uniform thickness. At each of the rectangular plate-like...
5933327 Wire bond attachment of a integrated circuit package to a heat sink  
A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that...
5892275 High performance power and ground edge connect IC package  
An integrated circuit package that receives power from a connector clipped to an edge of the package. The IC package has at least one pair of contact strips that extend along an edge of the...
5877555 Direct contact die attach  
A semiconductor die is attached to a transistor package by a plurality of resilient clamping members, which are bonded at one end to a top surface of the semiconductor die and at another end to a...
5874750 Pressure-contact type semiconductor device  
A pressure-contact type semiconductor device such as an insulated gate bipolar transistor. The device includes semiconductor chip, a gate electrode on a first surface of the semiconductor chip, an...
5861666 Stacked chip assembly  
An assembly of semiconductor chips has the chips vertically stacked above one another. Interposers extending between adjacent chips have compliant layers to accommodate thermal expansion of the...
5822190 Card type memory device and a method for manufacturing the same  
A card type memory device comprises a semiconductor chip having a nonvolatile semiconductor memory formed with external connection terminals and a metal frame comprising bed sections and external...
5783860 Heat sink bonded to a die paddle having at least one aperture  
A method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture...
5770891 Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer  
A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or...
5760467 Semiconductor device lead frame having sunk die pad portions  
A lead frame includes a die pad having a plurality of die pads including a main die pad and an auxiliary die pad respectively supported by a main die pad supporting lead and an auxiliary die pad...
5739556 Pressure contact housing for semiconductor components  
In a pressure contact housing for semiconductor components, the gate electrode contact ring 4 is provided with spiral recesses 5. The latter can absorb axial movements produced during the assembly...
5734176 Impedance controlled test fixture for multi-lead surface mounted integrated circuits  
A test fixture for testing an integrated circuit having leads. The test fixture includes a substrate with top and bottom surfaces and holes extending from the top to the bottom surface. The...
5705853 Power semiconductor module  
A power semiconductor module is specified in which at least one semiconductor chip, which is fitted on a baseplate, is made contact with by a respective contact plunger. The position of the...
5677576 Chip sized semiconductor device  
A chip sized semiconductor device includes a semiconductor chip having upper and lower surfaces. The chip has electrodes formed on the upper surface thereof. An electrically insulating passivation...
5661315 Controllable power semiconductor component  
In the case of a controllable power semiconductor component, which comprises at least one planar, essentially rectangular power semiconductor chip (13), which power semiconductor chip (13) has on...
5652467 Semiconductor device and package structure therefore and power inverter having semiconductor device  
An auxiliary cathode lead is contacted to a cathode buffer electrode which contacts to an unit GTO arranged at the most remote region from a gate pressure contacting portion of a GTO pellet and...
5641976 Pressure contact type semiconductor device with axial bias and radial restraint between a distortion buffer plate and a semiconductor body  
An alloy-free pressure contact type semiconductor device maintains a high reliability during transportation even without a pressure contact tool such as a simplified stack and therefore does not...
5633536 Press contact type semiconductor device  
Provided is a press contact type semiconductor device which improves the shape of an insulator formed along an outer peripheral edge and a major surface of a semiconductor substrate, simplifies...
5629565 Micromechanical electrostatic relay with geometric discontinuity  
A micromechanical electrostatic relay has, on the one hand, a base substrate with a base electrode and a base contact piece and, on the other hand, an armature substrate with an armature spring...
5610436 Surface mount device with compensation for thermal expansion effects  
A surface mount electronic device, attachable to a circuit board, comprises an insulating substrate having a top surface and a bottom surface; a plurality of metallized terminal pads on the bottom...
5600180 Sealing structure for bumps on a semiconductor integrated circuit chip  
A sealing structure for bumps on a semiconductor integrated circuit chip to be bonded through the bumps onto a circuit board is provided wherein a plurality of pads are formed on the semiconductor...
5591993 Structure for connecting flat type semiconductor switches in parallel  
A connection structure for connecting a plurality of semiconductor switches in parallel includes a pressed contact for a semiconductor switch. The pressed contact includes a layered structure...
5563450 Spring grounding clip for computer peripheral card  
A peripheral card includes a two-part metal cover mounting a printed wiring board on a U-shaped plastic frame. The wiring board is spaced from inside surfaces of the cover preferably by a pair...
5539232 MOS composite type semiconductor device  
A plurality of segments of small-sized IGBT devices are arranged concentrically in a plurality of rows in a pellet substrate. Each segment has an independent polysilicon gate electrode layer. A...
5539220 Pressure contact semiconductor device in a flat package  
A module-type semiconductor device in which a plurality of IGBTs are incorporated in a package in such a way so as to provide a highly reliable pressure contact type semiconductor device having...
5506452 Power semiconductor component with pressure contact  
A power semiconductor component includes a semiconductor body having anode and cathode sides and a given thermal coefficient of expansion. Contact electrodes are each disposed on a respective one...
5498903 Surface mountable integrated circuit package with integrated battery mount  
An integrated circuit package of the surface-mountable type within which a battery is mounted is disclosed. Battery leads extend from the side of the package body opposite that which is adjacent...

Matches 101 - 150 out of 338 < 1 2 3 4 5 6 7 >