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7618842 |
Method of applying encapsulant to wire bonds
A method of applying encapsulant to wire bonds between a die and conductors on a supporting substrate, by forming a bead of the encapsulant on a profiling surface, positioning the profiling surface...
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7617966 |
Semiconductor device
A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding...
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7615874 |
Electronic component module
An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular....
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7615871 |
Method and apparatus for attaching microelectronic substrates and support members
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
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7615866 |
Contact surrounded by passivation and polymide and method therefor
A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer...
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7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar
The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing...
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7612459 |
Multi-chip module and single-chip module for chips and proximity connectors
A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive...
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7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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7612437 |
Thermally enhanced single inline package (SIP)
In a method and system for fabricating a thermally enhanced semiconductor device ( 200, 300 ) is packaged as a through hole single inline package (SIP). A leadframe ( 210, 310, 410 ) having a die...
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7612436 |
Packaged microelectronic devices with a lead frame
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support...
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7608930 |
Semiconductor device and method of manufacturing semiconductor device
This semiconductor device includes a semiconductor chip, and a lead arranged around the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, and...
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7608925 |
Relay board with bonding pads connected by wirings
A relay board provided in a semiconductor package where a plurality of semiconductor chips are provided, the relay board relaying a wire for wiring the semiconductor chips or a wire for wiring a...
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7608921 |
Multi-layer semiconductor package
A semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base substrate and an interposer substrate mounted on top of the die. The bottom side of the...
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7605478 |
Semiconductor package and method of manufacturing the same
Provided are a semiconductor package and a method of manufacturing the semiconductor package, and more particularly, a semiconductor package with bonding wires and a method of manufacturing the...
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7605459 |
Coreless substrate and manufacturing thereof
An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper...
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7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module
A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting...
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7602070 |
Room temperature metal direct bonding
A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to...
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7598622 |
Encapsulation of a chip module
A chip module with a substrate having a top side, a chip mounted on the top side of the substrate, and an encapsulation includes an encapsulation material. The encapsulation is applied on the chip...
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7598620 |
Copper bonding compatible bond pad structure and method
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions...
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7598604 |
Low profile semiconductor package
A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor...
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7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
An electronic component has at least one semiconductor power switch with at least one anode and at least one control electrode positioned on a first surface and at least one cathode positioned on a...
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7595561 |
Semiconductor device including multiple rows of peripheral circuit units
In a semiconductor device including an internal circuit, multiple rows of peripheral circuit units are electrically connected to the internal circuit and arranged on at least one peripheral edge of...
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7595560 |
Semiconductor device
An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device 100 includes a semiconductor...
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7592710 |
Bond pad structure for wire bonding
A bond pad structure of an integrated circuit is provided. The bond pad structure includes a conductive bond pad, a first dielectric layer underlying the bond pad, and an M top plate located in...
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7592709 |
Board on chip package and method of manufacturing the same
A ball grid array type board on chip package may include an integrated circuit chip having an active surface that supports a plurality of contact pads. An interposer may be adhered to the active...
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7592700 |
Semiconductor chip and method of manufacturing semiconductor chip
A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an...
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7592681 |
Solid-state imaging apparatus
A solid-state imaging apparatus including: a solid-state imaging device chip having an electrode pad provided on its front face; and a flexible board having a connecting electrode formed on an end...
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7584881 |
Low loop height ball bonding method and apparatus
In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to...
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7582971 |
Semiconductor device and manufacturing method of the same
The invention is directed to a semiconductor device having a penetrating electrode and a manufacturing method thereof in which reliability and a yield of the semiconductor device are enhanced. A...
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7582909 |
Mounting and adhesive layer for semiconductor components
An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting...
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7582553 |
Method of bonding flying leads
The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps...
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7579697 |
Arrangement for high frequency application
A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on...
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7579696 |
Semiconductor device
A semiconductor device includes an effective wire formed above a substrate in a multilayer interconnection structure and having a first electrode pad in a top layer; a first reinforcing material...
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7579695 |
Integration type semiconductor device and method for manufacturing the same
A semiconductor device includes: a plurality of power MOS cells on a semiconductor substrate; a plurality of lead wires connecting to a source and a drain of each power MOS cell through a contact...
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7579676 |
Leadless leadframe implemented in a leadframe-based BGA package
A leadless leadframe has a plurality of bottom leads and a plurality of top soldering pads formed in different layers. After encapsulation and before solder ball placement, a half-etching process...
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7576439 |
Electrically connecting substrate with electrical device
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion...
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7576431 |
Semiconductor chip package and multichip package
The present invention provides a multichip package wherein a plurality of semiconductor chip packages ( 100 ) in each of which first electrode pads ( 16 a ) provided in a main surface of a...
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7575953 |
Stacked die with a recess in a die BGA package
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
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7569940 |
Method and device for connecting chips
The invention relates to an electronic device comprising:
a circuit, comprising a first and a second face, the first face being provided with electrical connection means, a transfer element,...
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7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same
A semiconductor device includes: a first semiconductor chip face-down mounted on a substrate; a second semiconductor chip face-up mounted on the first semiconductor chip; an electromagnetic...
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7569921 |
Semiconductor device and manufacturing method thereof
A semiconductor device has a plurality of bare chips stacked on at least one of first and second main surfaces oppositely arranged on a support substrate, spacers arranged between two bare chips...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate
To miniaturize a semiconductor device, a package substrate is provided having terminals formed on the main surface, lands formed on the back surface, through holes formed by laser beam machining...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7566962 |
Semiconductor package structure and method for manufacturing the same
A semiconductor package structure and a method for manufacturing the same are disclosed. The semiconductor package structure includes a substrate, an interposer (such as a circuitry laminate), a...
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7564141 |
Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited
An integrated circuit containing multiple modules coupled to a pad via a multiplexer. The modules are selectively coupled to the pad by the multiplexer to provide integrated circuit function...
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7563650 |
Circuit board and the manufacturing method
A method for manufacturing a circuit board ( 7 ); in which, an electronic component is injected into a resin substrate at a low temperature, and then the resin substrate is improved in its heat...
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7561434 |
Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for...
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7560814 |
Semiconductor device that improves electrical connection reliability
A semiconductor device including: a semiconductor section in which an element is formed; an insulating layer formed on the semiconductor section; an electrode pad formed on the insulating layer; a...
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7560809 |
Semiconductor device
The semiconductor device, including an electrode formed on the surface of a semiconductor element; and a metallic ribbon connected to the electrode. The metallic ribbon has a depressed portion on a...
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