Matches 201 - 250 out of 1477 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7391121 Semiconductor device with a number of bonding leads and method for producing the same  
A semiconductor device ( 7 ) has a number of bonding leads ( 1, 2, 3 ) with more than one individual bonding lead ( 1 ) being arranged on an individual contact area ( 4 ) of a semiconductor chip (...
7391114 Electrode pad section for external connection  
A pad section serving as an electrode for external connection of a semiconductor device includes a first pad metal ( 61 ) formed in the top layer, a second pad metal ( 62 ) formed under the first...
7385289 Semiconductor device using inorganic film between wiring layer and bonding pad  
It is an object of the present invention to provide a semiconductor device that offers a desirable adhesiveness among the bonding pad, the second insulating layer and the insulating film, and that...
7385298 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7385297 Under-bond pad structures for integrated circuit devices  
An under bond pad structure is described for integrated circuit dice are that have active circuits located below at least some of the bond pads. The metallization layers interconnection structures...
7385296 Sensor device having stopper for limitting displacement  
A sensor includes: a first chip; a second chip disposed on the first chip through an adhesive member; and a stopper. The second chip is connected to the first chip through a bonding wire. The...
7375426 Semiconductor package  
A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board...
7371676 Method for fabricating semiconductor components with through wire interconnects  
A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also...
7372168 Semiconductor chip capable of implementing wire bonding over active circuits  
A semiconductor chip capable of implementing wire bonding over active circuits (BOAC) is provided. The semiconductor chip includes a bonding pad structure which includes a bondable metal pad, a top...
7371612 Method of fabrication of stacked semiconductor devices  
A method for increasing integrated circuit density is disclosed comprising stacking an upper wafer and a lower wafer, each of which having fabricated circuitry in specific areas on their respective...
7372141 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides  
Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One...
7368821 BGA semiconductor chip package and mounting structure thereof  
In example embodiments of the present invention, a structure of a BGA semiconductor chip package includes a substrate having first and second surfaces, a semiconductor chip having a plurality of...
7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7365438 Semiconductor device with semiconductor components connected to one another  
The present invention relates to a semiconductor device which provides a shortest possible connection between two semiconductor components 10 a and 10 b arranged in a manner lying opposite on a...
7364946 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package  
A method is provided for making a semiconductor multi-package module, by providing a lower molded ball grid array package including a lower substrate and a die, affixing an upper molded package...
7365441 Semiconductor device fabricating apparatus and semiconductor device fabricating method  
A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50 , and a...
7365439 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof  
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The...
7365434 Semiconductor device and manufacturing method for the same  
To provide a semiconductor device with high performance and reliability, in which peeling off an interconnection layer caused due to peeling off of a resin film at a land part is suppressed and...
7365421 IC chip package with isolated vias  
An IC chip package includes a substrate ( 2 ), a chip ( 5 ), a plurality of bonding wires ( 52 ), and a cover ( 6 ). The substrate has a top surface, a receiving chamber ( 23 ) having an opening at...
7361977 Semiconductor assembly and packaging for high current and low inductance  
A device comprising a semiconductor chip ( 110 ) having a side edge ( 111 ) and a plurality of metal bond pads ( 120, 121 ) near the edge; the pads are aligned to form rows ( 130, 131 ) parallel to...
7358118 Mounting method of flexible printed circuit and manufacturing method of electric optical device  
Aspects of the current invention are directed to a method of mounting a flexible printed circuit and a manufacturing method of an electric optical device. Each of the methods form semiconductor...
7358617 Bond pad for ball grid array package  
A device ( 100 ) and a method ( 200 ) for controlling resin bleed, the device comprising a substrate ( 105 ) having a surface ( 107 ), an integrated circuit ( 115 ) having a plurality of leads (...
7358115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides  
A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire...
7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof  
A reciprocal design symmetry allows stacked wafers or die on wafer to use identical designs or designs that vary only by a few layers (e.g. metal interconnect layers). Flipping or rotating one die...
7355272 Semiconductor device with stacked semiconductor chips of the same type  
A semiconductor device includes a wiring board, a first semiconductor chip (e.g. DRAM) that is flip-chip connected on the wiring board, a second semiconductor chip (e.g. DRAM) that is of the same...
7348679 Electronic part having reinforcing member  
A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a...
7345358 Copper interconnect for semiconductor device  
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a...
7345368 Semiconductor device and the manufacturing method for the same  
A semiconductor device has a semiconductor substrate having first and second surface, a first resin film formed on the first surface of the semiconductor substrate and a second resin film formed on...
7345370 Wiring patterns formed by selective metal plating  
Conductive sidewall spacer structures are formed using a method that patterns structures (mandrels) and activates the sidewalls of the structures. Metal ions are attached to the sidewalls of the...
7342300 Integrated circuit incorporating wire bond inductance  
The invention relates to the field of electronics, more particularly to the wire bonds incorporated into an integrated circuit package such as a quad flat pack, a ball grid array or hybrid style...
7339265 Capacitance type semiconductor sensor  
In a capacitance type semiconductor dynamic quantity sensor, a sensor chip and a circuit are connected to each other through adhesive film having an elasticity of 200 MPa or less to reduce the...
7335533 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another  
A method for assembling semiconductor devices includes providing a first semiconductor device, applying a predetermined volume of adhesive material to at least a surface of the first semiconductor...
7332372 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween  
A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and...
7327043 Two layer substrate ball grid array design  
A routing pattern for high speed signals for a package substrate. Electrically conductive bond fingers are disposed on a first surface of the package substrate. The first surface is adapted to...
7327030 Apparatus and method incorporating discrete passive components in an electronic package  
An apparatus and method for incorporating discrete passive components into an integrated circuit package. A metal layer is formed over a surface of a substrate. A layer of photosensitive material...
7323766 Sensor module  
A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and...
7323788 Semiconductor device and manufacturing method of them  
A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding...
7323765 Die attach paddle for mounting integrated circuit die  
An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a...
7320902 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument  
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An...
7321160 Multi-part lead frame  
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame....
7319266 Encapsulated electronic device structure  
In one embodiment, an electronic device package ( 1 ) includes a leadframe ( 2 ) with a flag ( 3 ). An electronic chip ( 8 ) is attached to the flag ( 3 ) with a die attach layer ( 9 ). A trench (...
7314820 Carrier-free semiconductor package and fabrication method thereof  
A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts...
7312528 Semiconductor device having antenna connection electrodes  
A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of...
7312521 Semiconductor device with holding member  
Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which...
7309623 Method of fabricating a stacked die in die BGA package  
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
7306973 Method for making a semiconductor multipackage module including a processor and memory package assemblies  
A semiconductor multi-package module includes a processor and a plurality of memory packages mounted on a surface of the multipackage module substrate. In some embodiments the memory packages...
7307352 Semiconductor package having changed substrate design using special wire bonding  
A semiconductor package utilizing an existing substrate regardless of the change of the semiconductor chip design, and manufacturing method thereof are provided. The semiconductor package including...
7304394 Semiconductor device and method for manufacturing same  
A wiring pattern is provided on an insulating tape. Part of the wiring pattern is a connection section. An insulating resin is provided so that the connection section is coated with the insulating...
7304395 Semiconductor chip package  
A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes...
7304393 System and method for coupling internal circuitry of an integrated circuit to the integrated circuit's package pins  
A technique is provided for communicatively coupling internal circuitry (e.g., a resonant tank) of an integrated circuit (“IC”) with pins of the IC's package in a manner that minimizes the...
Matches 201 - 250 out of 1477 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >