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7575953 |
Stacked die with a recess in a die BGA package
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
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7576431 |
Semiconductor chip package and multichip package
The present invention provides a multichip package wherein a plurality of semiconductor chip packages ( 100 ) in each of which first electrode pads ( 16 a ) provided in a main surface of a...
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7576439 |
Electrically connecting substrate with electrical device
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same
A semiconductor device includes: a first semiconductor chip face-down mounted on a substrate; a second semiconductor chip face-up mounted on the first semiconductor chip; an electromagnetic...
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7569921 |
Semiconductor device and manufacturing method thereof
A semiconductor device has a plurality of bare chips stacked on at least one of first and second main surfaces oppositely arranged on a support substrate, spacers arranged between two bare chips...
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7569940 |
Method and device for connecting chips
The invention relates to an electronic device comprising:
a circuit, comprising a first and a second face, the first face being provided with electrical connection means, a transfer element,...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7566962 |
Semiconductor package structure and method for manufacturing the same
A semiconductor package structure and a method for manufacturing the same are disclosed. The semiconductor package structure includes a substrate, an interposer (such as a circuitry laminate), a...
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7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate
To miniaturize a semiconductor device, a package substrate is provided having terminals formed on the main surface, lands formed on the back surface, through holes formed by laser beam machining...
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7563650 |
Circuit board and the manufacturing method
A method for manufacturing a circuit board ( 7 ); in which, an electronic component is injected into a resin substrate at a low temperature, and then the resin substrate is improved in its heat...
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7564141 |
Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited
An integrated circuit containing multiple modules coupled to a pad via a multiplexer. The modules are selectively coupled to the pad by the multiplexer to provide integrated circuit function...
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7561434 |
Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for...
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7560804 |
Integrated circuit package and method of making the same
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
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7560809 |
Semiconductor device
The semiconductor device, including an electrode formed on the surface of a semiconductor element; and a metallic ribbon connected to the electrode. The metallic ribbon has a depressed portion on a...
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7560814 |
Semiconductor device that improves electrical connection reliability
A semiconductor device including: a semiconductor section in which an element is formed; an insulating layer formed on the semiconductor section; an electrode pad formed on the insulating layer; a...
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7557449 |
Flexible via design to improve reliability
An integrated circuit includes a metallization layer, a first metal line in the metallization layer, and a first via electrically connected to the first metal line. The first via has a first via...
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RE40819 |
Semiconductor device with improved bond pads
A semiconductor device with improved bond pads. The semiconductor device includes bond pads electrically connected to an active circuit in the device and openings formed in the bonding surface of...
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7557454 |
Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads
A semiconductor device includes two or more semiconductor devices with bond pads that are electrically connected to the same, single surface of a plurality of leads. The two or more devices may...
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7556984 |
Package structure of chip and the package method thereof
For a package structure of chip and the formation thereof, adhesive, conductive and metal layers are positioned on a substrate. The portions of the conductive and metal layers are removed to form...
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7554198 |
Flexible joint methodology to attach a die on an organic substrate
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic...
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7553701 |
Semiconductor packaging method
The present invention relates to a semiconductor packaging method. The method comprises (S 1 ) applying a die adhesive to an upper surface of a member through screen-printing; (S 2 ) B-stage curing...
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7554195 |
Engine with cable direct to outboard memory
A device includes a first semiconductor die having a first surface and a second surface, a cable coupled to the first semiconductor die, and at least one memory device coupled to the cable. The...
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7554185 |
Flip chip and wire bond semiconductor package
A semiconductor package and method of forming the package, including a substrate having an opening formed therein. Contact pads are formed about a periphery of the opening on a first side of the...
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7554209 |
Semiconductor device having a metal plate conductor
The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS•FET for a high side switch and a power MOS•FET for a low side switch are connected in...
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7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same
Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing...
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7554208 |
Wirebond pad for semiconductor chip or wafer
In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps...
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7550855 |
Vertically spaced plural microsprings
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
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7550857 |
Stacked redistribution layer (RDL) die assembly package
A stacked redistribution layer (RDL) die assembly package includes a substrate, a first level RDL die assembly mounted to the substrate and a second level RDL die assembly mounted to the first...
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7550832 |
Stackable semiconductor package
A stackable semiconductor package includes a top package, a bottom package, an adhesive layer, a plurality of wires and a molding compound. A part of a surface of a chip of the bottom package is...
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7549568 |
Method of forming identification code for wire-bonding machines
A method of forming an identification code for wire bonders is revealed. Firstly, a chip with a plurality of bonding pads is provided and is disposed on a chip carrier with a plurality of bonding...
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7547962 |
Chip package with a ring having a buffer groove that surrounds the active region of a chip
A chip package including a package substrate, a chip, several bonding wires, a flash-resisting ring and a molding compound. The package substrate includes a carrying surface and several contacts...
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7547977 |
Semiconductor chip having bond pads
In one embodiment, a semiconductor chip has one or more peripheral bond pads. The semiconductor chip comprises a semiconductor substrate having a cell region and a peripheral circuit region...
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7547961 |
IC card with bonding wire connections of different lengths
An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip...
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7541668 |
Package frame and semiconductor package using the same
Provided are a lead frame and a semiconductor package which allows reliable attachment of a small-sized semiconductor chip requiring a large number of leads to a board while providing high heat...
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7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor
A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A...
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7541672 |
Semiconductor device
A semiconductor device includes a header, a semiconductor chip fixed to the header constituting a MOSFET, and a sealing body of insulating resin which covers the semiconductor chip, the header and...
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7541669 |
Semiconductor device package with base features to reduce leakage
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
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7538441 |
Chip with power and signal pads connected to power and signal lines on substrate
A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding...
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7538417 |
Semiconductor device with signal line having decreased characteristic impedance
A semiconductor device includes a semiconductor chip, electrodes pads, first and second insulating layers, first and second conductive patterns and external terminals. The electrode pads are formed...
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7538437 |
Infrared receiver chip
An infrared receiver chip is provided for installation in a standardized lead frame of an infrared receiver module having multiple contact areas for connection of associated function points of the...
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7538442 |
Semiconductor chip and semiconductor device
In the peripheral part of a semiconductor chip, third electrode pads for wire bonding and plate wiring and first electrode pads dedicated to wire bonding are provided. On the other hand, second...
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7535087 |
Semiconductor device with lead frames
By disposing a rear surface of a first island 12 and a top surface of a second island 13 so as to at least partially overlap each other, a first semiconductor chip on the first island and a...
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7535111 |
Semiconductor component with semiconductor chip and adhesive film, and method for its production
A semiconductor component with a semiconductor chip and an adhesive film, and a method for its production is disclosed. In one embodiment, the semiconductor component has the adhesive film, which...
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7535108 |
Electronic component including reinforcing member
A method for manufacturing an electronic component includes: cutting a wiring substrate along a line intersecting with an outline of a reinforcing member, the wiring substrate including a base...
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7535112 |
Semiconductor constructions comprising multi-level patterns of radiation-imageable material
The invention includes a semiconductor construction having a wire bonding region associated with a metal-containing layer, and having radiation-imageable material over the metal-containing layer....
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7535080 |
Reducing parasitic mutual capacitances
A method to reduce parasitic mutual capacitances in embedded passives. A first capacitor is formed by first and second electrodes embedding a dielectric layer. A second capacitor is formed by third...
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7531844 |
Light emitting element
A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light...
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7531893 |
Power semiconductor devices having integrated inductor
An electronic device ( 100 ) with one or more semiconductor chips ( 102 ) has an inductor ( 101 ) assembled on or under the chips. The inductor includes a ferromagnetic body ( 111 ) and a wire (...
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7528478 |
Semiconductor devices having post passivation interconnections and a buffer layer
An integrated circuit having post passivation interconnections with a second connection pattern is disclosed. A passivation layer (preferably made of a non-oxide material) is formed over the...
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