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6862189 |
Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device
An electronic component including an element main body section for performing an electrical function and a terminal section for electrically connecting the element main body section to a conductive...
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6858946 |
Semiconductor device
A semiconductor device for forming a coil with a high inductance and a high Q value on a semiconductor substrate. A semiconductor device 10 comprises a rectangular semiconductor substrate 12 ,...
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6858944 |
Bonding pad metal layer geometry design
A bonding pad suitable for use in wire bonding an integrated circuit includes an approximately rectangular metal pattern. The bonding pad has at least one slot or hole in it, located at or adjacent...
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6858943 |
Release resistant electrical interconnections for MEMS devices
A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device,...
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6854637 |
Wirebonding insulated wire
An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing...
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6856026 |
Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device
A semiconductor chip which does not increase the thickness or the board area of a semiconductor device wherein semiconductor chips are layered and does not increase the wire length between the...
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6856028 |
Semiconductor device having an improved mounting structure
In a semiconductor device, a semiconductor element is bonded to an insulating circuit board. A resin layer for bonding the semiconductor element to the insulating circuit board is extended so as to...
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6856022 |
Semiconductor device
According to the invention, in input/output circuit portions positioned around a semiconductor chip, electrode pads are arranged above each of a plurality of input/output cells arranged in a line....
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6853058 |
Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
A semiconductor package assembly is disclosed having a semiconductor die receiving member configured to accept a semiconductor die in either the flip-chip or the wirebond orientations. First...
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6853287 |
Coil for use on a substrate
There is provided a coil and a method for fabricating the same. One embodiment of the coil includes a plurality of traces in one area of a substrate. Each trace has a first end located at a first...
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6853087 |
Component and antennae assembly in radio frequency identification devices
Permanent physical and electrical attachment of electrically conductive contacts of a first component in a RFID device, such as a smart card or smart inlay, is made to the electrically conductive...
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6853056 |
Semiconductor device having a base metal lead frame
Disclosed is a semiconductor device which has a semiconductor chip; a base metal lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a...
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6853074 |
Electronic part, an electronic part mounting element and a process for manufacturing such the articles
A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in...
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6853063 |
Semiconductor device and communication terminal using thereof
Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on...
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6853084 |
Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same
The present invention discloses a substrate within a Ni/Au structure electroplated on electrical contact pads and a method for fabricating the same. The method comprises: providing a substrate with...
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6853089 |
Semiconductor device and method of manufacturing the same
In the manufacture of a semiconductor device by adopting a block molding method wherein a semiconductor chip is fixed onto a wiring substrate through an adhesive, the occurrence of a defect caused...
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6853090 |
TAB tape for semiconductor package
A TAB tape for a semiconductor package is provided. The TAB tape provides number of test pad configuration for reducing the area of the test pad area on a TAB tape to increases the number of...
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6849954 |
IC package substrate with over voltage protection function
The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate...
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6849930 |
Semiconductor device with uneven metal plate to improve adhesion to molding compound
The present invention provides a semiconductor device whose reliability is improved by improving the adhesion strength of a metal plate or connecting chip, said plurality of electrodes and a lead...
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6847104 |
Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same
A window-type ball grid array (WBGA) semiconductor package with a lead frame as a chip carrier and a method for fabricating the same are provided. The lead frame has a plurality of leads...
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6847116 |
Chip-type semiconductor light-emitting device
A chip-type semiconductor light-emitting device includes a semiconductor light-emitting chip connected to a pair of electrodes formed on a substrate. The semiconductor light-emitting chip is...
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6847101 |
Microelectronic package having a compliant layer with bumped protrusions
A microelectronic assembly includes a microelectronic element having a first surface with a plurality of contacts accessible at the first surface, and a compliant layer over the first surface of...
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6847122 |
System and method for preventing and alleviating short circuiting in a semiconductor device
A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device,...
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6847105 |
Bumping technology in stacked die configurations
A stacked semiconductor package including a plurality of stacked semiconductor devices on a substrate, and a method of forming the same. The semiconductor devices are stacked in an active...
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6841881 |
Semiconductor device and a method of manufacturing the same
With respect to two types of chips to be mounted on a main surface of a package substrate, the ratio of chip area to the number of terminals of one chip and that of the other chip are compared with...
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6841855 |
Electronic package having a flexible substrate with ends connected to one another
An electronic package is provided, having a flexible substrate, a first plurality of conductors, and a second plurality of conductors. The flexible substrate has first and second portions with a...
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6841858 |
Leadframe for die stacking applications and related die stacking concepts
A leadframe design (and method of forming the leadframe design), comprising: an inner die pad structure lying in a first plane; and an outer die pad structure supported by outer tie bars and...
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6841863 |
Ball grid array package with stacked center pad chips and method for manufacturing the same
Disclosed is a ball grid array package with stacked center pad chips, which realizes a BGA package with stacked chips using center pad type semiconductor chips, and a method for manufacturing the...
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6841421 |
Method of manufacturing wiring structure of a power semiconductor device
A semiconductor device includes a power supply semiconductor chip that has a plurality of current passing electrodes. Conductive plates are disposed on the current electrodes, and conductive wires...
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6841853 |
Semiconductor device having grooves to relieve stress between external electrodes and conductive patterns
A semiconductor device including a semiconductor chip having an electric circuit on a surface thereof, and an electrode pad formed on the surface of the semiconductor chip and which is electrically...
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6838767 |
Semiconductor device
Provided is a technique which permits production of a semiconductor device having, integrated therein, a semiconductor chip smaller in external size than an ordinary semiconductor chip without...
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6838755 |
Leadframe for integrated circuit chips having low resistance connections
A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for...
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6836023 |
Structure of integrated trace of chip package
A semiconductor die package is disclosed. The die package includes a semiconductor die having a first side and a second side, a vertical transistor, and a bond pad at the first side. A passivation...
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6835602 |
Coils integrated in IC-package
Method for providing at least one inductance associated with a chip attached to a support, in which said inductances are provided by means of at least a first bondwire having first and second ends....
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6836006 |
Semiconductor module
In an IGBT module which contains an IGBT device and a diode device connected to each other and accommodated in a case and which radiates heat generated in operation through a radiation board, an...
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6836002 |
Semiconductor device
A re-wiring layer is provided on a circuit-formed surface of an IC chip, in an area other than where external lead electrodes. In the process for forming a circuit of the IC chip, the re-wiring...
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6833620 |
Apparatus having reduced input output area and method thereof
An input output ring for a semiconductor device is disclosed that uses power buffers having widths that vary from the widths of the input and output buffers. In one embodiment, the pitches between...
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6833611 |
Semiconductor device
A semiconductor device mainly comprises a chip disposed on the upper surface of a substrate. The upper surface of the substrate is provided with a ground ring, a power ring, and a plurality of...
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6833608 |
Semiconductor device and packaging system therefore
Two different switches with two different signal input schemes are fabricated by mounting the same semiconductor chip on the same lead pattern. Two of the leads of the lead pattern provides space...
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6831371 |
Integrated circuit substrate having embedded wire conductors and method therefor
An integrated circuit substrate having embedded wire conductors provides high-density interconnect structure for integrated circuits. Wires are shaped to form a conductive pattern and placed atop a...
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6828686 |
Chip size stack package and method of fabricating the same
A chip size stack package includes two semiconductor chips arranged such that their bond pads-forming surfaces are opposed and insulating layers are applied thereto. Via-holes for exposing bond...
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6825569 |
BGA package having substrate with patterned solder mask defining open die attach area
A BGA package and a method of fabricating the BGA package is provided. The package includes a substrate having a first surface with a pattern of conductors thereon, and an opposing second surface...
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6825548 |
Semiconductor device
It is to be made possible to eliminate unevenness of the inductances of bonding wires and to reduce the size of semiconductor devices. Over the surface of a semiconductor device in whose MISFET...
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6822338 |
Wiring structure of semiconductor device
A semiconductor device includes a power supply semiconductor chip that has a current passing electrode. A conductive plate is disposed on the current electrode, and a conductive wire that is used...
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6818998 |
Stacked chip package having upper chip provided with trenches and method of manufacturing the same
A stacked chip package includes a substrate having an upper surface and a lower surface, a first semiconductor chip having an upper surface and a lower surface, wherein the lower surface of the...
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6818976 |
Bumped chip carrier package using lead frame
An improved bumped chip carrier (BCC) package according to the present invention includes a resin-molded lead frame encapsulating an attached semiconductor integrated circuit (IC) and a plurality...
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6815837 |
Electronic package with strengthened conductive pad
An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad and of a size sufficiently...
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6812565 |
Semiconductor device and a method of manufacturing the same
There is provided a multi-chip module which can vary functions of a memory chip at the time of loading or after loading, to the wiring board, the memory chip having formed an external connecting...
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6812575 |
Semiconductor device
In a semiconductor device with a plurality of semiconductor chips stacked on a substrate, a wiring layer disposed so as to be sandwiched between the semiconductor chips, and a plurality of bonding...
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6812581 |
Chip size package with stress relieving internal terminal
A semiconductor integrated device that resists breakage of an internal wire. An epoxy resin covers a lower surface and side surface of a semiconductor chip. An internal pad connecting an external...
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