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7615872 |
Semiconductor device
A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective...
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7615871 |
Method and apparatus for attaching microelectronic substrates and support members
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
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7611926 |
Thermosetting die bonding film
The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a...
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7605474 |
Structure of polymer-matrix conductive film and method for fabricating the same
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7598622 |
Encapsulation of a chip module
A chip module with a substrate having a top side, a chip mounted on the top side of the substrate, and an encapsulation includes an encapsulation material. The encapsulation is applied on the chip...
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7592708 |
Package board, semiconductor package, and fabricating method thereof
With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7582974 |
Semiconductor device and method of manufacturing same
A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted;...
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7579676 |
Leadless leadframe implemented in a leadframe-based BGA package
A leadless leadframe has a plurality of bottom leads and a plurality of top soldering pads formed in different layers. After encapsulation and before solder ball placement, a half-etching process...
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7579260 |
Method of dividing an adhesive film bonded to a wafer
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern...
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7573141 |
Semiconductor package with a chip on a support plate
A semiconductor package includes a support plate made of an electrically non-conducting material. Electrical connection vias are formed outside a chip fixing region provided on the front face of...
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7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit
A method according to the present invention for producing a semiconductor-chip-mounting circuit 1 includes mainly three steps. In a first step, contacts 2 each in the form of a conical helix...
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7564140 |
Semiconductor package and substrate structure thereof
A semiconductor package and a substrate structure thereof are provided. A solder mask layer applied on the substrate structure is formed with outwardly extended openings corresponding to corner...
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7564139 |
Semiconductor device and method for manufacturing the same
It is an object of the present invention to provide a technique for making a semiconductor device thinner without using a back-grinding method for a silicon wafer. According to the present...
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7563706 |
Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
A material for forming an insulating film with low dielectric constant of this invention is a solution including a fine particle principally composed of a silicon atom and an oxygen atom and having...
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7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
A semiconductor device, including a semiconductor chip having electrodes, a substrate having an interconnect pattern, and an adhesive, the adhesive having a first portion and a second portion, the...
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7554197 |
High frequency IC package and method for fabricating the same
A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to...
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7553701 |
Semiconductor packaging method
The present invention relates to a semiconductor packaging method. The method comprises (S 1 ) applying a die adhesive to an upper surface of a member through screen-printing; (S 2 ) B-stage curing...
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7550318 |
Interconnect for improved die to substrate electrical coupling
A method is provided for forming peripheral contacts between a die and a substrate. In accordance with the method, a die ( 305 ) is provided which has first and second opposing major surfaces,...
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7541667 |
Semiconductor device and method of manufacturing the same
A manufacturing method of a semiconductor device including preparing a lead frame having a die pad, leads arranged around the die pad and a silver plating layer formed over a first portion of each...
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7535111 |
Semiconductor component with semiconductor chip and adhesive film, and method for its production
A semiconductor component with a semiconductor chip and an adhesive film, and a method for its production is disclosed. In one embodiment, the semiconductor component has the adhesive film, which...
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7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure
The present invention relates to a substrate structure comprising at least two substrate layers extending in substantially parallel planes, which substrate layers are (Z-)interconnected in a...
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7521797 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device
A method of manufacturing a substrate joint body by mounting a TFT on a wiring substrate includes a step of arranging an electrode pad of the wiring substrate and an electrode pad of the TFT at a...
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7518237 |
Microfeature systems including adhered microfeature workpieces and support members
Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a...
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7514772 |
Method of manufacturing a semiconductor apparatus
A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive...
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7511382 |
Semiconductor chip arrangement and method
A semiconductor chip arrangement and method is disclosed. In one embodiment, the invention provides a method for providing a semiconductor chip arrangement including providing a semiconductor chip...
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7507604 |
Breakable interconnects and structures formed thereby
Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7498679 |
Package substrate and semiconductor package using the same
A package substrate may have an improved surface structure for controlling the flow of an adhesive. The package substrate may have an upper surface and a lower surface covered with a passivation...
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7495345 |
Semiconductor device-composing substrate and semiconductor device
A semiconductor device-composing substrate 10 has a support base 12 , an interconnect layer 14 including interconnects 13 , and an insulating resin layer 16 . The semiconductor...
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7495326 |
Stacked electronic structures including offset substrates
An electronic device may include first, second, and third substrates wherein the second electronic substrate is between the first and second electronic substrates. A first electrical and mechanical...
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7488532 |
Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
The present invention is to provide an adhesive resin composition for use in preparing an adhesive in the form of a film which is excellent in the adhesiveness at a low temperature and in the heat...
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7485496 |
Semiconductor device package with a heat sink and method for fabricating the same
A semiconductor package with a heat sink and a method for fabricating the same are proposed. A first adhesive of a low Young's modulus is disposed on a corner region of a heat sink mounting area of...
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7485494 |
Dicing die adhesive film for semiconductor
A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive...
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7479705 |
Semiconductor device
A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective...
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7479702 |
Composite conductive film and semiconductor package using such film
A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is...
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7476982 |
Fabricated adhesive microstructures for making an electrical connection
An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers...
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7476981 |
Electronic module with layer of adhesive and process for producing it
The present invention relates to an electronic module having a layer of adhesive between metallic surfaces of components of the module. The metallic surfaces are arranged facing one another. The...
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7476975 |
Semiconductor device and resin structure therefor
A semiconductor device comprises a wiring substrate including a wiring pattern; a semiconductor chip installed on the wiring substrate, including a plurality of pads formed on a surface of the...
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7476959 |
Encapsulated electronic device
In one embodiment, an electronic device package ( 1 ) includes a leadframe ( 2 ) with a flag ( 3 ). An electronic chip ( 8 ) is attached to the flag ( 3 ) with a die attach layer ( 9 ). A trench (...
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7476955 |
Die package having an adhesive flow restriction area
A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a...
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7470986 |
Mounting structure, electro-optical device, and electronic apparatus
A mounting structure is provided. The mounting structure includes: a substrate; a line formed on the substrate; an electronic component in which a terminal having a protrusion protruded to the...
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7462943 |
Semiconductor assembly for improved device warpage and solder ball coplanarity
A semiconductor device with a chip ( 505 ), its position defining a plane, and an insulating substrate ( 503 ) with first and second surfaces; the substrate is substantially coplanar with the chip,...
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7462942 |
Die pillar structures and a method of their formation
A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.
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7462931 |
Indented structure for encapsulated devices and method of manufacture
A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid...
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7456504 |
Electronic component assemblies with electrically conductive bonds
Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch...
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7449367 |
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device
An adhesive film for semiconductor use of the present invention is used in a method in which, after the adhesive film for semiconductor use is laminated to one side of a metal sheet, the metal...
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7446424 |
Interconnect structure for semiconductor package
A semiconductor device includes a semiconductor substrate having top and bottom surfaces, the top surface having at least one device region thereon. At least one trench opening is formed through...
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7446423 |
Semiconductor device and method for assembling the same
In a semiconductor device provided with a thinned semiconductor element, the present invention intends to inhibit damage of the semiconductor element in the neighborhood of its outer periphery so...
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7443027 |
Electronic device having coalesced metal nanoparticles
An apparatus composed of: (a) a substrate; and (b) a deposited composition comprising a liquid and a plurality of metal nanoparticles with a covalently bonded stabilizer.
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