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6825571 |
Semiconductor device and its manufacturing method, a circuit board and an electronic device
A raised portion 12 is formed on a substrate 10 . The raised portion consists of a raised support pattern that preferably includes a wiring pattern. A sheet 30 is supported by the top surfaces...
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6822337 |
Window-type ball grid array semiconductor package
A window-type ball grid array (WBGA) semiconductor package is proposed. A substrate is formed with an opening and a tape attach area around the opening. A polyimide tape having an aperture is...
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6815835 |
Single sided adhesive tape for compound diversion on BOC substrates
An adhesive system and a method of adhesion for a ball grid array semi-conductor device package facilitate the encapsulation of a die attached to a circuit board. A material is added between a die...
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6815817 |
Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip
A method and apparatus are provided for attaching a semiconductor device to a substrate. One end of the substrate is elevated to position the substrate and the coupled semiconductor device on an...
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6815837 |
Electronic package with strengthened conductive pad
An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad and of a size sufficiently...
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6806581 |
Bonded anisotropic conductive film
A bonded anisotropic conductive film fabricated using a plastic material and a plurality of conductive particles inside the plastic material. The plastic material is a thermal set material...
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6803667 |
Semiconductor device having a protective film
A semiconductor device comprises a semiconductor element, a heat sink soldered to one surface of the semiconductor element, and a heat sink soldered to an opposite surface of the semiconductor...
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6803116 |
Method of bonding a conductive adhesive and an electrode, and a bonded electrode obtained thereby
The present invention relates to a method of bonding a conductive adhesive and an electrode together, which is capable of obtaining electrical bonding between a conductive electrode and an...
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6800521 |
Process for the formation of RuSixOy-containing barrier layers for high-k dielectrics
A method for use in the fabrication of integrated circuits includes providing a substrate assembly having a surface. A diffusion barrier layer is formed over at least a portion of the surface. The...
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6798048 |
2-Metal layer TAB tape and both-sided CSP•BGA tape
A 2-metal layer TAB and a both-sided CSP.BGA tape having an insulating substrate and a wiring layer provided on at least both sides of the substrate, the substrate having evenly spaced sprocket...
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6794727 |
Single receiving side contactless electronic module continuous manufacturing process
A process for continuous manufacture of electronic modules ( 6 ) including the steps of providing a microcircuit and antenna receiving side on a continuous strip ( 8 ) and module surface areas;...
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6791195 |
Semiconductor device and manufacturing method of the same
Semiconductor device 3 comprises semiconductor chip 11 , Au ball bumps 21 formed on pad electrodes 12 with a stud bump method, and thermoplastic adhesive layer 22 provided on the surface...
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6791189 |
Epoxy washer for retention of inverted SMT components
An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided...
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6791171 |
Systems for testing and packaging integrated circuits
Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and...
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6787929 |
Semiconductor device having a flat protective adhesive sheet
A semiconductor device has a semiconductor wafer having sensing portions exposed on a surface thereof and an adhesive sheet attached to the semiconductor wafer as a protective cap to cover the...
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6787925 |
Mounting method of semiconductor device
A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat...
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6784024 |
Die attach curing method for semiconductor device
A low temperature cure adhesive material for affixing a solder mask to a die is described. The adhesive material is at least partially cured at temperatures below about 100° C. The low temperature...
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6784555 |
Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using...
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6784538 |
Heat transfer structure for a semiconductor device utilizing a bismuth glass layer
The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said...
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6781248 |
Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged
A method for packaging semiconductor device assemblies. An assembly is formed which includes a semiconductor die, a tape positioned over the active surface of the die, and a substrate element...
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6777817 |
Reworkable and thermally conductive adhesive and use thereof
Reworkable thermally conductive adhesive composition including a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride...
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6774493 |
Semiconductor flip-chip package and method for the fabrication thereof
A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to...
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6774473 |
Semiconductor chip module
A semiconductor chip module includes a chip-mounting member having opposite first and second surfaces, a set of circuit traces, and a plurality of plated through holes that extend through the first...
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6774496 |
Semiconductor package with a thermoset bond
A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices...
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6774501 |
Resin-sealed semiconductor device, and die bonding material and sealing material for use therein
A resin-sealed semiconductor device which comprises a lead frame having a die bond pad and an inner lead, a semiconductor chip installed on the die bond pad via a die bonding material and a sealing...
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6774497 |
Flip-chip assembly with thin underfill and thick solder mask
The invention provides a method for attaching a flip chip to an electrical substrate such as a printed wiring board. A bumped flip chip is provided, the flip chip including an active surface and a...
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6770981 |
Composite interposer for BGA packages
An interposer in a BGA or similar package includes a polymide core and a filler of thermally conductive, electrically nonconductive filler. The interposer has a higher thermal conductivity as...
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6770959 |
Semiconductor package without substrate and method of manufacturing same
A semiconductor package without substrate and method of manufacturing the same includes providing an interim substrate which has a front surface covered with a solder mask at selected locations....
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6769469 |
Process for mounting semiconductor device and mounting apparatus
A process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other. A process...
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6768211 |
Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging
A novel five-layer tape is provided for applications such as bonding, interconnection and insulation of different parts of a semiconductor package at the same time. The five layer tape includes a...
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6768196 |
Packaged microchip with isolation
A packaged microchip has a stress sensitive microchip having a microchip coefficient of thermal expansion, a package having a package coefficient of thermal expansion, and an isolator having an...
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6768212 |
Semiconductor packages and methods for manufacturing such semiconductor packages
A semiconductor package according to the present invention includes a die attachment area for receiving a die attachment material and a stitch bond area for receiving a wire lead from a die. The...
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6768186 |
Semiconductor device and laminated leadframe package
An semiconductor device ( 100 ) comprising a first semiconductor die ( 120 ) and a leadframe ( 200 ). The leadframe includes a first laminate ( 210 ) having a bottom surface formed with a lead (...
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6765228 |
Bonding pad with separate bonding and probing areas
A new and improved bonding pad having separate areas for probe needle contact and wire bonding in semiconductor packaging technology. The bonding pad typically has a generally elongated,...
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6765278 |
Circuit structure with W, WC and/or W2C layer on AlN substrate
A high temperature hybrid-circuit structure includes a temperature sensitive device which comprises SiC, AlN and/or Al x Ga 1-x N(x>0.69) connected via electrodes to an electrically conductive...
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6765289 |
Reinforcement material for silicon wafer and process for producing IC chip using said material
Reinforcing material having Rockwell hardness of 60 or above and comprising base material and adhesive is formed, and then the reinforcing material is attached to one side of silicon wafer on which...
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6759752 |
Single unit automated assembly of flex enhanced ball grid array packages
A package is provided for the mounting of IC devices. The IC die is bonded to metal traces contained in a flexible tape, the IC die with the flexible tape is attached to a stiffener (heat...
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6756689 |
Power device having multi-chip package structure
A power device having a multi-chip package structure and a manufacturing method therefor are provided. In the power device, a transistor, which is a switching device, and a control integrated...
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6753208 |
Wafer scale method of packaging integrated circuit die
A chip scale package structure formed by adhering a glass sheet having a pattern of holes matching a pattern of bond pads on a semiconductor wafer so that the pattern of holes on the glass sheet...
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6750550 |
Adhesive and semiconductor devices
An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an...
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6747360 |
Conductive hardening resin for a semiconductor device and semiconductor device using the same
Conductive hardening resin for a semiconductor device of the present invention contains metal powder for providing electric conduction between electrodes positioned on the front of a semiconductor...
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6747346 |
Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device
A container for a semiconductor sensor includes a housing body and a cover. On the upper surface of the housing body outer than the pressure detection room, a groove is provided to trap the gel...
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6745462 |
Method and apparatus for reducing deformation of encapsulant in semiconductor device encapsulation by stencil printing
The invention is a method and apparatus for encapsulating semiconductor dies via stencil printing in which, after the dies have been stencil printed with encapsulant and prior to removal of the...
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6740982 |
Microelectronic package with an attachment layer including spacer elements
A microelectronic package includes a microelectronic component, such as a sensor component, attached to a substrate by an attachment layer of an adhesive, in which approximately spherical spacer...
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6737317 |
Method of manufacturing a capacitor having RuSixOy-containing adhesion layers
A method for use in the fabrication of integrated circuits includes providing a substrate assembly having a surface. An adhesion layer is formed over at least a portion of the surface. The adhesion...
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6734569 |
Die attachment with reduced adhesive bleed-out
An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire...
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6734532 |
Back side coating of semiconductor wafers
A semiconductor device comprising a semiconductor chip having an active and a passive surface; the active surface includes an integrated circuit and input/output pads suitable for metallurgical...
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6734566 |
Recyclable flip-chip semiconductor device
In a flip-chip type semiconductor device, a pad electrode and a passivation film are formed on a semiconductor substrate. An insulating resin layer is formed on the passivation film, and an opening...
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6734567 |
Flip-chip device strengthened by substrate metal ring
Electronic devices of improved reliability having a substrate of electrically insulating material, further an integrated circuit chip with a periphery and a surface. Using a layer of polymeric...
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6730991 |
Integrated circuit chip package
A package for an integrated circuit chip adapted to operate at microwave frequencies. The package includes an electrically conductive lead frame having electrical leads extending outwardly from an...
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