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7160796 |
Method for manufacturing wiring board and semiconductor device
Pads to be used for flip chip bonding and wire bonding are pattern-formed on a surface of a substrate. The pads to be used for flip chip bonding are shielded. Plating is applied to each of the pads...
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7161249 |
Multi-chip package (MCP) with spacer
A multi-chip package includes a substrate having first bonding pads and second bonding pads, a first chip having chip pads on an active surface, spacers attached to the substrate between the first...
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7157800 |
Bonded structure using conductive adhesives, and a manufacturing method thereof
A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and...
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7148560 |
IC chip package structure and underfill process
A novel integrated circuit (IC) chip package structure and underfill process which reduces stress applied to corners of a flip chip in an IC package structure during the application of an adhesive...
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7148081 |
Method of manufacturing a semiconductor device
In a semiconductor device in which a plurality of semiconductor chips are stacked on a mounting substrate, an adhesive material formed of resin mainly having a thermosetting property is applied to...
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7138724 |
Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask
A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier...
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7135754 |
Chip type solid electrolytic capacitor having a small size and a simple structure
In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent...
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7135780 |
Semiconductor substrate for build-up packages
The present invention provides techniques to fabricate build-up single or multichip modules. In one embodiment, this is accomplished by dispensing die-attach material in one or more pre-etched...
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7135763 |
Technique for attaching die to leads
A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an...
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7132736 |
Devices having compliant wafer-level packages with pillars and methods of fabrication
Devices and methods of fabrication thereof are disclosed. A representative device includes a complaint wafer-level package having one or more lead packages. A representative lead package includes a...
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7132755 |
Adhesive film for manufacturing semiconductor device
An adhesive film for manufacturing a semiconductor device comprising a thermosetting adhesive layer and a heat-resistant backing layer, wherein the adhesive film is applied to a method for...
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7126228 |
Apparatus for processing semiconductor devices in a singulated form
Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch...
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7125748 |
Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier...
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7123107 |
Piezoelectric oscillator, manufacturing method thereof, and electronic device
To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection...
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7122908 |
Electronic device package
An electronic device package comprises a substrate, a die, and a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for...
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7122834 |
Semiconductor apparatus having adhesion layer and semiconductor thin film
A semiconductor apparatus includes a substrate; an adhesion layer disposed on the substrate, the adhesion layer mainly consisting of semiconductor material; and at least one semiconductor thin film...
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7116000 |
Underfilled, encapsulated semiconductor die assemblies and methods of fabrication
An apparatus and method for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The...
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7115976 |
Method and apparatus for epoxy LOC die attachment
A plurality of lead frames is supplied in a lead frame-by-lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an...
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7116002 |
Overhang support for a stacked semiconductor device, and method of forming thereof
A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such...
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7115989 |
Adhesive sheet for producing a semiconductor device
An adhesive sheet for producing a semiconductor device, which includes a base layer and an adhesive layer and is used in the process for producing the semiconductor device including the step of...
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7109061 |
Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier...
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7109588 |
Method and apparatus for attaching microelectronic substrates and support members
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
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7109592 |
SMT passive device noflow underfill methodology and structure
An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing...
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7105931 |
Electronic package and method
An electronic package substrate for an electronic package that includes an adhesive bonding member having two planar surfaces and an orifice there through for receiving a chip and a circuitized...
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7105919 |
Semiconductor package having ultra-thin thickness and method of manufacturing the same
A semiconductor package having an ultra thin thickness and a method of manufacturing the same are provided. The ultra thin semiconductor package comprises a circuit board in which a through hole is...
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7102218 |
Semiconductor package with chip supporting structure
A semiconductor package with a chip supporting structure is provided, including a lead frame having a die pad and a plurality of leads, and a plurality of chip supporting members mounted on the die...
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7102217 |
Interposer substrates with reinforced interconnect slots, and semiconductor die packages including same
A board-on-chip (BOC) semiconductor package includes a multisegmented, longitudinally slotted interposer substrate through which an elongate row of die bond pads is accessed for electrical...
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7101620 |
Thermal release wafer mount tape with B-stage adhesive
In one aspect, an improved wafer mount tape is provided. The wafer mount tape includes a base layer, a release layer that expands when activated and a B-stageable adhesive layer that is positioned...
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7091623 |
Multi-chip semiconductor package and fabrication method thereof
A multi-chip semiconductor package and a fabrication method thereof are provided. A substrate having an upper surface and a lower surface is prepared. At least a first chip is mounted on the upper...
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7088004 |
Flip-chip device having conductive connectors
Semiconductor devices having a passivation layer formed over their major electrodes and individual electrical connectors connected to the electrodes by conductive attach material through openings...
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7088006 |
Integrated circuit arrangement
Integrated circuit arrangement, in which bearing areas of mutually opposing sides of a carrier and of a substrate layer, which carries circuit structures, are bonded by means of an adhesive layer....
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7088005 |
Wafer stacking with anisotropic conductive adhesive
The present invention includes a method that provides a first wafer; forms a first raised contact from a first plug on the first wafer; provides a second wafer; forms a second raised contact from a...
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7084492 |
Underfill and mold compounds including siloxane-based aromatic diamines
An apparatus including a first substrate comprising a first set of contact points; a second substrate including a second set of contact points coupled to the first substrate through...
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7084516 |
Surface protection film
A surface protection film which comprises a substrate layer and an adhesive layer, and of which the electrostatic charge by peeling from an adherend is from +0.01 to −0.01 nC/mm 2 .
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7084011 |
Forming a chip package having a no-flow underfill
A method of forming an underfilled chip package is provided. No-flow underfill material is deposited over a surface of a package substrate to form an underfill region. A die having a plurality of...
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7084351 |
Electrical device allowing for increased device densities
A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be...
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7084517 |
Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
A semiconductor device connecting structure is provided for connecting a semiconductor IC to a substrate. A bonding layer is placed between the substrate and the semiconductor IC to accomplish...
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7081675 |
Multilayered anisotropic conductive adhesive for fine pitch
Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive...
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7078820 |
Semiconductor apparatus and process of production thereof
A process of production of a semiconductor apparatus which can suppress a rise in the electrical resistance and a decline in the joint strength at the bump connection interfaces and improve the...
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7075173 |
Interposer including adhesive tape
Two dice may be provided within a single package so that one pin and associated leadfinger may be coupled to bond pads on different dice. This may mean that two different bond pads on different...
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7075177 |
Semiconductor chip package
A semiconductor chip package is formed by a first semiconductor chip and a second semiconductor chip, which have electrodes for wiring at surfaces thereof, being integrated and mounted in a state...
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7071572 |
Pre-back-grind and underfill layer for bumped wafers and dies
Multi-purpose planarizing/back-grind/pre-under-fill arrangements for bumped wafers and dies, in which a planarizing coating provides improved and continued surface protection to the circuit surface...
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7071488 |
Active matrix display device and thin film transistor display device
The invention provides an active matrix display device in which active elements are formed on a first substrate, wiring lines are formed on a second substrate, an element chip having at least one...
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7071577 |
Semiconductor device and resin binder for assembling semiconductor device
In a semiconductor device of a structure comprising a thin semiconductor element bonded to a reinforcing plate via a bonding layer of a predetermined thickness, resin binder used for forming the...
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7071568 |
Stacked-die extension support structure and method thereof
A structure includes a substrate having a first surface, a first semiconductor die, a spacer and a second semiconductor die. The first semiconductor die has an active surface with opposite first...
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7064446 |
Under bump metallization layer to enable use of high tin content solder bumps
Apparatus and methods of fabricating an under bump metallization structure including an adhesion layer abutting a conductive pad, a molybdenum-containing barrier layer abutting the adhesion layer,...
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7063756 |
Enhanced design and process for a conductive adhesive
The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card...
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7061121 |
Stacked microelectronic assemblies with central contacts
A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at...
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7061107 |
Semiconductor device and manufacturing method of the same
The invention realizes excellent electrical and mechanical connection between electrodes in a packaging structure where a plurality of semiconductor chips having electrodes are connected with each...
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7061119 |
Tape attachment chip-on-board assemblies
An apparatus and method for preventing damage to tape attachment semiconductor assemblies due to encapsulation filler particles causing damage to a semiconductor die active surface and/or to a...
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