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5721451 |
Integrated circuit assembly adhesive and method thereof
An integrated circuit assembly (16) embodied as flip-chip is encased in a plastic card (12) to form a smart card assembly (10). The flip-chip assembly has a substrate (20) with plated pads, and a...
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5705852 |
Non-contact IC card and process for its production
In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of...
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5705855 |
Integrated circuit for directly attaching to a glass substrate and method for manufacturing the same
An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed...
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5703407 |
Resin-sealed type semiconductor device
In the resin-sealed type semiconductor device of the present invention, the inner lead is adhered onto the semiconductor element via the insulating tape, and electrically connected to the...
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5691567 |
Structure for attaching a lead frame to a heat spreader/heat slug structure
A method and structure for attaching a lead frame to a heat sink are provided. In one embodiment, a layer of thermally conductive, electrically insulating epoxy is formed on a heat sink and the...
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5684328 |
Semiconductor chip package using improved tape mounting
An LOC type semiconductor package and a fabricating method thereof comprises first and second through holes formed at inner leads and bus bars of the LOC-type lead frame, and third through holes...
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5682066 |
Microelectronic assembly including a transparent encapsulant
A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) and spaced apart by a gap (30). Solder bump interconnections (32) extend across the gap (30)...
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5681757 |
Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
The present invention relates to the process of die bonding semiconductor integrated circuit microchips with adhesive deposited from microjets in a precise pattern. Print-head technology equivalent...
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5677575 |
Semiconductor package having semiconductor chip mounted on board in face-down relation
The semiconductor package comprises a board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in...
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5644168 |
Mechanical interlocking of fillers and epoxy/resin
A semiconductor package which comprises a lead frame, a semiconductor chip secured to the lead frame and a mold composition encasing the lead frame and the semiconductor chip has a filler of...
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5641996 |
Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
An improved semiconductor unit package is disclosed. This package is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed...
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5641995 |
Attachment of ceramic chip carriers to printed circuit boards
A leadless chip carrier is attached to a printed circuit board by soldering its input-output connections to the printed circuit board and also by providing an adhesive between a central portion of...
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5637913 |
Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two
In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible...
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5614766 |
Semiconductor device with stacked alternate-facing chips
The present invention relates to a structure of semiconductor chip joint for mounting a plurality of semiconductor chips onto a single package. The joint comprises two or more semiconductor chips,...
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5612574 |
Semiconductor structures using high-dielectric-constant materials and an adhesion layer
A semiconductor device (10) is illustrated, which is formed on an active region (14) of a semiconductor substrate (12). Device (10) comprises a conductive plug (20) and a barrier layer (22) formed...
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5600183 |
Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate
An integrated circuit chip bonding system comprising a multi-layer film adhesive for mounting an integrated circuit chip to a printed circuit substrate having a metallized grounding pad disposed...
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5585671 |
Reliable low thermal resistance package for high power flip clip ICs
A flip-chip IC package (10) provides a thermally-conductive lid (20) attached to a backside of the chip (12) by a die attach layer (18) of a predetermined thickness range. A rim (22), preferably...
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5550408 |
Semiconductor device
The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which...
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5536970 |
Resin-encapsulated semiconductor device
A resin-encapsulated semiconductor device having a semiconductor chip mounted on a die pad with a die bonding portion interposed, a lead arranged in a periphery of the die pad and electrically...
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5512783 |
Semiconductor chip packages
A semiconductor chip package comprising at least one semiconductor chip disposed in a package and a plurality of first and second pins extending from the package, which first pins are electrically...
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5504374 |
Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material
An ASIC type microcircuit package assembly has a die of at least about 20 millimeters square in size and utilizes as a die attach a polymeric adhesive incorporating a conductive filler. Such...
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5483106 |
Semiconductor device for sensing strain on a substrate
In fixing a sensor element for sensing stress on a substrate by using an adhesive for semiconductors, the present invention aims to solve both the problems of stress applied from the substrate side...
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5471088 |
Semiconductor package and method for manufacturing the same
A semiconductor package having lead bars provided with upper and lower surfaces outwardly exposed, thereby enabling a stacked mounting, a memory extension and a reduction in mounting area. The...
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5463246 |
Large scale high density semiconductor apparatus
A large scale semiconductor apparatus is provided which includes at least one semiconductor chip having electrodes. The semiconductor chip is bonded on an electrically insulating circuit substrate...
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5460318 |
Diebonding geometry for packaging optoelectronics
A solder geometry for epi-down diebonding an optoelectronic component to a heat sink platform includes a solder deposition pattern having exposure windows to create gaps or diebond bridges in the...
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5407864 |
Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip
A process of manufacturing a semiconductor chip that has a connecting pad and is connected to a front side of a circuit board that has a conductive trace connected to a through-hole. An insulating...
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5406096 |
Device and method for high performance high voltage operation
A high voltage device (10) having MOS input characteristics. A low voltage MOS transistor (12) is provided which has a source (18), a drain (22), and a gate (25). A high voltage transistor (14) is...
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5406124 |
Insulating adhesive tape, and lead frame and semiconductor device employing the tape
An insulating adhesive tape which comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer...
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5397921 |
Tab grid array
A TAB Grid Array (TGA) pack package for an integrated circuit. A TGA package provides an efficient structure and method to connect a semiconductor die encapsulated in the TGA package to an external...
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5381047 |
Semiconductor integrated circuit having multiple silicon chips
A semiconductor integrated circuit of the laminated type having a large circuit capacity includes an upper silicon tip and a lower silicon tip as essential components and a layer of electrical...
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5369304 |
Conductive diffusion barrier of titanium nitride in ohmic contact with a plurality of doped layers therefor
A plurality of doped areas (12, 13, 14) are formed on a surface of a semiconductor wafer. A titanium nitride layer (17) is used for covering the plurality of doped areas (12, 13, 14) and for...
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5363277 |
Structure and method for mounting semiconductor device
The structure and method for mounting a semiconductor device, in which a wiring pattern 2 on a circuit substrate 1 and projection electrodes 5 of an integrated circuit 4 are made to be in...
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5360942 |
Multi-chip electronic package module utilizing an adhesive sheet
There is provided a module for supporting a plurality of semiconductor devices within an electronic package. The module has a support substrate and an apertured substrate laminated together with a...
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5352629 |
Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules
A method for attaching a chip to a substrate includes providing the substrate with an outer layer of an electrical conductor which is not wettable by solder and which has a window exposing an inner...
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5323060 |
Multichip module having a stacked chip arrangement
A multichip module includes: a) a multichip module substrate; b) a first chip, the first chip having opposed base and bonding faces, the base face being adhered to the multichip module substrate,...
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5319241 |
Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
A conductive tape for a packaged semiconductor device is disclosed. The tape contains a first adhesive layer, a base film on top of the first adhesive layer, a conductive layer on top of the base...
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5317191 |
Low-melting-point junction material having high-melting-point particles uniformly dispersed therein
A semiconductor device includes a semiconductor element attached to a support member by a junction material that includes a parent phase of a low-melting-point junction material and fine particles...
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5310701 |
Method for fixing semiconductor bodies on a substrate using wires
A method for mounting semiconductor bodies on a substrate includes bonding ires to a substrate being formed of metal at least in given locations. Semiconductor bodies are laterally fixed to the...
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5264730 |
Resin mold package structure of integrated circuit
A hybrid integrated circuit is provided having a substrate with at least one active and passive element disposed thereon. A lead frame has a plurality of leads and a support plate. The support...
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5262674 |
Chip carrier for an integrated circuit assembly
Epoxy bonding between an IC chip and a chip carrier is strengthened by creating substantially rougher oxidized surfaces within substantially smooth gold surfaces of a die paddle portion of the chip...
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5258649 |
Semiconductor device and electronic apparatus using semiconductor device
A silicon chip is mounted on a portion a heat dissipation body, and a carrier film is inserted into a resin composition material. Each of input/output electrode portions of the silicon chip is...
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5256903 |
Plastic encapsulated semiconductor device
A plastic encapsulated semiconductor device containing one or more of insulating films. Uneven surfaces, such as recesses and roughened surfaces, are strategically provided on peripheral side...
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5252855 |
Lead frame having an anodic oxide film coating
Lead frames, in which at least one part of the surface of a metal member which is a part of the lead frame is provided with an anodic oxide film of copper or a copper alloy, and in which a member...
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5252850 |
Apparatus for contouring a semiconductor, light responsive array with a prescribed physical profile
Large area semiconductor wafers such as CCDs typically have a non-flat profile. A vacuum chuck is used to generate a vacuum under the chip to reduce the curvature to conform to the flat profile of...
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5233220 |
Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer
A lead frame (10) is connected over an integrated circuit (40) by adhesives (42) and (44). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to...
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5229646 |
Semiconductor device with a copper wires ball bonded to aluminum electrodes
A semiconductor device formed by a semiconductor chip bonded to a lead frame die pad. The bonding material, such as a silicone resin, has an elasticity modulus ranging from 1 Kg/cm 2 to 100 Kg/cm...
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5214307 |
Lead frame for semiconductor devices having improved adhesive bond line control
Described is a lead frame design which allows for greater control of adhesive thickness which bonds the die with the die paddle on the lead frame. A number of bumps on the surface of the lead frame...
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5182628 |
Semiconductor device having particular solder interconnection arrangement
A semiconductor device which is resistant to cracking during a heat cycle is provided which uses a lead-tin alloy solder having a weight ratio in a range of 45/55 to 55/45 to bond an insulation...
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5175610 |
Resin molded type semiconductor device having a metallic plate support
A semiconductor chip is attached to the upper surface of a bed formed of a metallic plate. Lead terminals are connected to terminal portions of the semiconductor chip by bonding wires. A plurality...
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5173765 |
Conductive adhesive and article made therewith
A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains≤500 ppm of low-molecular-weight...
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