|
Match
|
Document |
Document Title |
|
|
5949137 |
Stiffener ring and heat spreader for use with flip chip packaging assemblies
A stiffener device for use with a flip chip packaging assembly including a generally rectangular, plate-like member having a substantially uniform thickness. At each of the rectangular plate-like...
|
|
|
5949138 |
Heat spreader
A heat spreader (10) is provided for dissipating heat from a semiconductor die (32). The heat spreader (10) comprises a thermally conductive sheet (12) having an aperture (14) formed therein. At...
|
|
|
5949142 |
Chip size package and method of manufacturing the same
A chip size package is constituted by a chip on which an integrated circuit is formed, and plated bumps are formed at terminal portions of the integrated circuit, a flexible two-layered...
|
|
|
5936309 |
Mounted structure of printed circuit board in semiconductor package
A mounted structure of printed circuit board in semiconductor package, the mounted structure comprising a solder resist formed with at least more than one tunnel connecting outsides with respective...
|
|
|
5920458 |
Enhanced cooling of a heat dissipating circuit element
An arrangement for cooling a heat dissipating circuit element mounted to a first side of a printed circuit board. A heat dissipation member is mounted to the other side of the circuit board and a...
|
|
|
5920123 |
Multichip module assembly having via contacts and method of making the same
A multichip module includes a printed circuit printed circuit board onto which traces of electrically conductive material are formed and into which groups of plated vias are formed. Each group of...
|
|
|
5917245 |
Semiconductor device with brazing mount
A mount 2 is secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with an electrode 4 on the circuit board 1 to form at...
|
|
|
5917235 |
Semiconductor device having LOC structure, a semiconductor device lead frame, TAB leads, and an insulating TAB tape
A semiconductor device with a LOC structure having a semiconductor device lead frame, TAB leads, and an insulating TAB tape, wherein the semiconductor device lead frame has a plurality of leads and...
|
|
|
5915169 |
Semiconductor chip scale package and method of producing such
A semiconductor chip scale package and method of producing the package are disclosed. The package has a semiconductor chip having signal leading bumps. A PCB is electrically connected to the chip,...
|
|
|
5912510 |
Bonding structure for an electronic device
A bonding structure (10) is formed between a first component (12) and a second component (11) to form a semiconductor device. The bonding structure (10) comprises a bump (24) that has a pedestal...
|
|
|
5895971 |
Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound
An adhesive compound layer bonds the reverse surface of a semiconductor chip to a major surface of a substrate, and a restoring compound layer is formed on a top surface of the semiconductor chip;...
|
|
|
5892289 |
Bare chip mounting structure and manufacturing method therefor
A mounting structure is provided which improves the reliability of the connection between the bumps at the four corners of a flip-chip mounted semiconductor chip which is subject to stress...
|
|
|
5889333 |
Semiconductor device and method for manufacturing such
A semiconductor device includes a device body including at least an LSI chip, and a lead structure having a base which is flexible and a plurality of pins which project from both sides of the base....
|
|
|
5886413 |
Reusable, selectively conductive, z-axis elastomeric composite substrate
The invention relates to an open cell, porous, selectively conductive member containing an elastomer that is reusable in use and preparation. The scaffold for the elastomer has conductive areas...
|
|
|
5880530 |
Multiregion solder interconnection structure
An apparatus and method for forming solder interconnection structures that reduce thermo-mechanical stresses at the solder joints of a semiconductor device and its supporting substrate. In one...
|
|
|
5880522 |
Stamped lead frame with adhesive layer for fixing to semiconductor device
A lead frame for LOC is provided which, even when an adhesive is applied to a lead prepared by stamping, can ensure insulation of a semiconductor element mounted from the lead. In applying an...
|
|
|
5874782 |
Wafer with elevated contact structures
Disclosed is a semiconductor wafer, and the method of making the same, the wafer being formed to have a multiplicity of raised contact pads on its surface. The contact pads are formed with...
|
|
|
5872400 |
High melting point solder ball coated with a low melting point solder
A solder ball structure having a first object and least one solder ball, each solder ball having an outer surface, top and a bottom and comprising a non-eutectic admixture of solder. The solder...
|
|
|
5866951 |
Hybrid circuit with an electrically conductive adhesive
The composite hybrid semiconductor structure contains a support plate substrate (11) with a number of at least two support connector spots (13) and a semiconductor chip or semiconductor wafer...
|
|
|
5866950 |
Semiconductor package and fabrication method
A semiconductor package comprises a circuit board having a wiring circuit including at least a connecting portion, the wiring circuit being formed on a first main surface of the circuit board, a...
|
|
|
5861677 |
Low RC interconnection
A low RC delay interconnection pattern is formed with a low resistivity metal, such as copper, and a low dielectric constant material, such as organic polymers. An intermediate bonding layer is...
|
|
|
5861661 |
Composite bump tape automated bonded structure
This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses...
|
|
|
5856699 |
Photoelectric conversion apparatus with level photoreceiving surface
In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the...
|
|
|
5855993 |
Electronic devices having metallurgies containing copper-semiconductor compounds
Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material...
|
|
|
5856913 |
Multilayer semiconductor device having high packing density
A semiconductor power module has semiconductor components mounted on a substrate. The semiconductor components are in electrical contact with the substrate. Internal circuit wiring is achieved by...
|
|
|
5844319 |
Microelectronic assembly with collar surrounding integrated circuit component on a substrate
A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar...
|
|
|
5844320 |
Semiconductor unit with semiconductor device mounted with conductive adhesive
A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two...
|
|
|
5844168 |
Multi-layer interconnect sutructure for ball grid arrays
A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape...
|
|
|
5838061 |
Semiconductor package including a semiconductor chip adhesively bonded thereto
A semiconductor package of the present invention is light, thin, simple and small, and can have more than 500 pins. The package includes a substrate having a cavity and a plurality of internal...
|
|
|
5837368 |
Insulating film with improved punching characteristics and lead frame using the same
The occurrence of burrs and chips in punching an insulating film is suppressed by adjusting an edge tearing resistance of the insulating film. The edge tearing resistance is preferably 50 to 70...
|
|
|
5834850 |
Encapsulated semiconductor device having metal foil covering, and metal foil
A metal foil material for covering a semiconductor device, a semiconductor device covered with the metal foil material, and a process for producing the metal foil-covered semiconductor device are...
|
|
|
5825093 |
Attachment system and method therefor
An attachment system (10,30) for electronic devices utilizes an interconnect substrate (11) and an attachment area (12,32) formed thereon. A non-wettable material (16,36) on a surface (13) of the...
|
|
|
5821628 |
Semiconductor device and two-layer lead frame for it
By employing the structure that in a two-layer lead frame comprising a lamination layer of lead portions and a metal layer, the thickness of an adhesive layer for fixing the a semiconductor element...
|
|
|
5818113 |
Semiconductor device
A semiconductor device wherein a sealing resin is filled in a space between an interconnecting wiring board and a semiconductor chip after the semiconductor chip is flip chip-mounted on the wiring...
|
|
|
5815372 |
Packaging multiple dies on a ball grid array substrate
An electrical arrangement including a circuitized substrate, the circuitized substrate having (i) a first substrate surface including a set of substrate contacts disposed thereon, and (ii) a second...
|
|
|
5808873 |
Electronic component assembly having an encapsulation material and method of forming the same
An electronic component assembly (10) is formed by mounting an electronic component (31) to a substrate (11). An encapsulating material (33) is used to protect the electronic component (31) from...
|
|
|
5804631 |
Curable organosiloxane compositions and semiconductor devices
A curable organosiloxane composition useable as a silicone die attach adhesive, an electrically conductive silicone rubber composition each comprising a composition that cures through both addition...
|
|
|
5804882 |
Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements...
|
|
|
5786628 |
Method and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packaging
A fabrication method and resultant monolithic electronic module having a separately formed thin-film layer attached to a side surface. The fabrication method includes providing an electronic module...
|
|
|
5783867 |
Repairable flip-chip undercoating assembly and method and material for same
In a method for reversible assembly of a semiconductor electronic flip-chip device to an electrical interconnecting substrate, a filled thermoplastic adhesive is interposed between an active face...
|
|
|
5780931 |
Surface mounting semiconductor device and semiconductor mounting component
A surface mounting semiconductor device or a mounting component includes a metallic carbonate coating on a mounting surface which may be a plated layer of a metal easy to solder on which an outer...
|
|
|
5777385 |
Ceramic ball grid array (CBGA) package structure having a heat spreader for integrated-circuit chips
An improved package structure for integrated-circuit chips is disclosed. In accordance with a preferred embodiment of the present invention, the integrated-circuit packaged structure comprises a...
|
|
|
5773898 |
Hybrid integrated circuit with a spacer between the radiator plate and loading portion of the IC
A hybrid integrated circuit is provided with a radiator plate having a power device fixed at the surface through a spacer. As the spacer for preventing heat transfer from the radiator plate to the...
|
|
|
5764497 |
Circuit board connection method and connection structure
The circuit board connecting method and a connection structure. A first flexible board is adhered to a first surface of the circuit board at a first temperature, and then a second flexible board is...
|
|
|
5753970 |
System having semiconductor die mounted in die-receiving area having different shape than die
Electronic systems utilizing a plurality of integrated circuit packages having at least some large gaps between edges of a semiconductor die and the inner ends of package conductors defining a...
|
|
|
5747874 |
Semiconductor device, base member for semiconductor device and semiconductor device unit
A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection...
|
|
|
5742096 |
Lead on chip package
A lead on chip package comprising a semiconductor chip having a plurality of bonding pads and a plurality of minute protrusions formed at both side portions of the upper surface thereof, an...
|
|
|
5739582 |
Method of packaging a high voltage device array in a multi-chip module
A method in which several high voltage chips may be packaged within a single, typically low voltage plastic package. The high voltage chips are packaged to remain electrically isolated from each...
|
|
|
5736792 |
Method of protecting bond wires during molding and handling
A method of making a semiconductor device and the device wherein a chip is provided having plural bond pads thereon. A plurality of adjacent wires is provided, each wire having one end thereof...
|
|
|
5737191 |
Structure and process for mounting semiconductor chip
A semiconductor chip mount structure includes a substrate having a base surface on which base side connectors are formed; a semiconductor chip mounted on the base surface, the semiconductor chip...
|