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6252777 |
IC card and its frame
An IC card, which can be mass-produced at low cost, is composed of a plane coil formed by means of punching or etching. The plane coil 10 in which a conductor line 11 is wound a plurality of times...
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6249046 |
Semiconductor device and method for manufacturing and mounting thereof, and circuit board mounted with the semiconductor device
A semiconductor device for surface-mounting that allows of easy mounting. It comprises a semiconductor element 16, an insulating film 12, a wiring pattern 20 formed on a first surface of the...
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6249049 |
Ceramic package type electronic part which is high in connection strength to electrode
A ceramic package type electronic part for accommodating an electronic device includes a ceramic package body, an electrode, and a conductive adhesive. The electrode is disposed for the ceramic...
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6249051 |
Composite bump flip chip bonding
A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's...
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6242815 |
Flexible substrate based ball grid array (BGA) package
A flexible substrate based BGA package mainly comprises a semiconductor chip securely attached onto a flexible film substrate through a nonconductive adhesive. The flexible film substrate is formed...
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6239487 |
Lead frame with heat spreader and semiconductor package therewith
A lead frame for a chip package includes a heat spreader and permits the mounting of various sized chips on the same sized lead frame. The lead frame includes a plurality of leads having outer...
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6239480 |
Modified lead frame for improved parallelism of a die to package
A structure and method are provided to allow a die to be packaged more uniformly and in parallel with a package by utilizing a lead frame having at least one cavity within the lead frame, thereby...
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6239482 |
Integrated circuit package including window frame
An integrated circuit package includes at least one integrated circuit element coupled to a polymer film; a window frame coupled to the polymer film and surrounding the at least one integrated...
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6238508 |
Bonding method using fast hardening UV adhesive and slower hardening adhesive
In the method of bonding two parts (1,2) together a positioning device (3) accurately positions the two parts (1,2) relative to each other and a comparatively slower hardening adhesive layer (4) is...
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6232661 |
Semiconductor device in BGA package and manufacturing method thereof
The purpose is to improve the assembly reliability of the BGA package. The present invention provides a type of BGA semiconductor device having plural conductor bumps arranged two-dimensionally on...
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6225683 |
Die size-increasing integrated circuit leads and thermally enhanced leadframe
A "paddle-under-lead" (PUL) leadframe has the inner portions of an I.C. package's leads extend along the top of a paddle, to which they are affixed. An I.C. die is affixed to the top of the inner...
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6225695 |
Grooved semiconductor die for flip-chip heat sink attachment
One aspect of the invention relates to a flip-chip semiconductor package. In one version of the invention, the flip-chip semiconductor package includes a package substrate having an upper surface,...
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6225701 |
Semiconductor device provided with heat-sink and method of manufacturing the same
Disclosed is a semiconductor device provided with a heat-sink. The semiconductor device comprises a laminated insulating film formed on the heat-sink, a lead-frame mounted on the laminated...
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6222281 |
IC chip, IC assembly, liquid crystal device, and electric apparatus
An IC chip includes a built-in semiconductor and a plurality of bumps exposed to the exterior and provided on a surface, the bumps being pressed and bonded to a substrate or the like using an ACF...
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6221691 |
Method and system for attaching semiconductor dice to substrates
A method for attaching bumped semiconductor dice to substrates, such as printed circuit boards and multi chip modules, is provided. The method includes the steps of: providing an instant curing...
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6218731 |
Tiny ball grid array package
A tiny ball grid array package based on a substrate. The substrate has at least an insulation layer and two copper foils laminated together. A hole is formed near the center of the substrate. A...
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6212768 |
Flip chip mounting method and apparatus therefor
A flip chip mounting method and the apparatus have high reliability in electrical connection between a semiconductor and a circuit board so as to avoid void in a via formed in a circuit board or in...
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6215194 |
Wafer sheet with adhesive on both sides and attached semiconductor wafer
Providing a method for die bonding semiconductor elements surely without causing damage thereto in a shorter time with less steps of operations, thereby improving the productivity. A semiconductor...
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6214642 |
Area array stud bump flip chip device and assembly process
An area array flip chip device produced using wire bonding technology. The design and process for producing such a flip chip involves stud bumps which are bonded on the substrate, to give good...
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6211573 |
Semiconductor device with an improved lead-chip adhesion structure and lead frame to be used therefor
There is provided an adhering structure between a semiconductor chip and two alignments of first side inner leads and second side inner leads extending in first and second sides of the...
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6204565 |
Semiconductor carrier and method for manufacturing the same
A semiconductor carrier is provided with a through hole bump. The bump is formed by coating a photosensitive adhesive consisting of an epoxy acrylate having a fluorene skeleton or polybenzoxazole...
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6201707 |
Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrate
A wiring substrate used for a resin-sealing type semiconductor device is provided with an insulating substrate in which a through hole used for connecting an external terminal is formed, a wiring...
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6201302 |
Semiconductor package having multi-dies
The package includes a substrate having an opening. A first die is mounted on the upper surface of the substrate. A second die is attached on the lower surface of the first die by epoxy. The first...
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6201299 |
Substrate structure of BGA semiconductor package
A substrate structure mainly comprises a plurality of substrate units and a plurality of dispensing holes thereon. A main hole is provided on the surface of the substrate unit, the two ends of...
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6201306 |
Push-up pin of a semiconductor element pushing-up device, and a method for separating
A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet...
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6191490 |
Semiconductor package having a separated die pad
This invention relates to a semiconductor package having a separated die pad, which is comprised of an integrated circuit chip having a plurality or bonding pads mounted on its surface; a die pad...
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6184577 |
Electronic component parts device
In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit...
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6177731 |
Semiconductor package
An organic resin film 27 having an opening on an electrode pad is formed on a main surface of an IC chip 10, and a protruding electrode 12 formed on the electrode pad is formed of a low melting...
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6169316 |
Semiconductor pressure sensor including sensor chip fixed to package by adhesive
In a semiconductor pressure sensor, adhesive having a Young's modulus of equal to or less than 1×10 4 Pa such as silicone system gel is disposed between a bottom wall of a casing and a bottom...
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6166433 |
Resin molded semiconductor device and method of manufacturing semiconductor package
The semiconductor device includes a semiconductor chip, an FPC tape for mounting the semiconductor chip thereto, a mold resin for protecting the semiconductor chip, and metal balls provided on the...
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6166446 |
Semiconductor device and fabrication process thereof
A semiconductor device in which defective resin filling can be prevented. One embodiment has a metal heat-releasing plate (103) with good thermal conductivity, which is sealed within a resin...
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6166445 |
Semiconductor device and method for producing same
A void-collection section is provided on a GaAs FET chip at a location that avoids a heat-generating region of the chip. Pressure is applied to the rear surface of the substrate corresponding to...
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6157085 |
Semiconductor device for preventing exfoliation from occurring between a semiconductor chip and a resin substrate
A PBGA-type semiconductor device is comprised such that a semiconductor chip is fixedly attached to the front surface of a resin substrate thereof with the use of an adhesive composed mainly of a...
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6150730 |
Chip-scale semiconductor package
A chip-scale semiconductor package mainly includes a semiconductor chip, a substrate and a package body. Said chip is attached onto said substrate by an adhesive layer. Said chip has a plurality of...
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6146749 |
Low dielectric composition, insulating material, sealing material, and circuit board
A low dielectric constant composition with a dielectric constant of 4 or less is disclosed. The composition comprises a matrix resin and crosslinked resin particles having an average particle...
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6144102 |
Semiconductor device package
The objective of the invention is to reduce the thickness, to improve the heat-releasing property, and to increase the number of terminals that can be assembled, in particular, for the CSP-type...
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6144108 |
Semiconductor device and method of fabricating the same
The present invention is characterized, in a semiconductor device with a semiconductor element sealed by resin, in that a metallic foil is bonded through adhesive to the bottom of a lead frame with...
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6144104 |
High-operating-temperature electronic component
A product for attaching an electronic component, such as a semiconductor die, to a substrate includes a relatively low-melting-temperature solder preform applied to the substrate; and a bead of a...
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6144558 |
Parts installation structure having electronic part connected to flexible sheet with conductive and non-conductive adhesives
A present invention is to provide a thin parts installation structure and their manufacturing method. There is provided a circuit on a wiring substrate, an adhesive is painted to a selected part...
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6144107 |
Solid state pickup device excellent in heat-resistance and method of manufacturing the device
A solid state pickup device to which the present invention is applicable comprises a base member (1a) and a solid state pickup chip (3) having a bottom surface, a receiving surface for receiving...
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6140703 |
Semiconductor metallization structure
A high temperature metallization system for use with a semiconductor device (23). The semiconductor device (23) has a multi-layer metallization system (36). An adhesion layer (37) of the...
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6137174 |
Hybrid ASIC/memory module package
A package for multiple IC chip module. The IC chip is attached to electric wires on ceramic substrate which has good heat dissipating capability. The bonding pads along the periphery of the ceramic...
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6137183 |
Flip chip mounting method and semiconductor apparatus manufactured by the method
An improved flip chip mounting method is provided for mounting an IC chip on a substrate. The IC chip has one surface and electrodes formed on the one surface, and the IC chip is positioned so that...
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6137185 |
Electrode structure of a wiring substrate of semiconductor device having expanded pitch
An electrode structure as well as the fabrication method thereof is disclosed which may enable successful pad layout conversion of interconnection electrode pads on the periphery of an associated...
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6134118 |
Conductive epoxy flip-chip package and method
A method and apparatus for producing a multichip package comprising semiconductor chip and a substrate. The semiconductor chip includes conventional inner bond pads that are rerouted to other areas...
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6121680 |
Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
An embodiment of the invention includes an integrated circuit package having a substrate, an integrated circuit mounted to the substrate, a thermal element, and a heat pipe disposed between the...
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6118183 |
Semiconductor device, manufacturing method thereof, and insulating substrate for same
To provide a type of semiconductor device with high resistance to cracks and having fewer manufacturing steps. Semiconductor device 1 has a substrate having insulating base material 2 mainly made...
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6114013 |
Sealing label for sealing semiconductor element
A sealing label for sealing semiconductor element comprises a metal foil substrate or a heat-resisting organic film substrate having formed thereon a sealing material component layer for sealing a...
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6111311 |
Semiconductor device and method of forming the same
The present invention provides a semiconductor package comprising: an electrically conductive base plate having a first surface comprising first, second and third regions; a semiconductor chip...
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6101101 |
Universal leadframe for semiconductor devices
A leadframe for semiconductor devices is characterized in that the edge of the paddle has the shape of inclined plane which facilitate the silver epoxy to fill up the gap near the edge of the...
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