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Match Document Document Title
7626275 Semiconductor device  
A semiconductor device includes a semiconductor substrate, a first metal film on a back surface of the semiconductor substrate, a second metal film on the first metal film, and a third metal film...
7626264 Substrate for device bonding and method for manufacturing same  
A substrate for device bonding is provided, which enables bonding of a device with high bond strength to an Au electrode formed on a substrate such as aluminum nitride by soldering the device at a...
7626262 Electrically conductive connection, electronic component and method for their production  
A connection structure includes a semiconductor die having a first major surface and an electrically conductive substrate having a second major surface. At least part of the second major surface is...
7622807 Semiconductor device with a low dielectric constant film between lower interconnections  
A method for fabricating a semiconductor device includes the steps of: forming a plurality of lower interconnections at intervals in a first insulating film; removing a portion of the first...
7612456 Electronic device, semiconductor device using same, and method for manufacturing semiconductor device  
An inventive electronic device includes a substrate, a bump of a first metal material provided on a surface of the substrate, a bonding film of a second metal material provided on a top surface of...
7608929 Electrical connector structure of circuit board and method for fabricating the same  
An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second...
7605479 Stacked chip assembly with encapsulant layer  
A microelectronic subassembly 210 includes a substrate 215 having a top surface 216 and at least one peripheral region 219, a microelectronic element 201 mounted over the substrate 215, ...
7602070 Room temperature metal direct bonding  
A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to...
7598620 Copper bonding compatible bond pad structure and method  
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions...
7598612 Semiconductor device and manufacturing method thereof  
A semiconductor device including a semiconductor substrate containing a plurality of electrode pads and a passivation film with an opening that exposes a central area of each of the electrode pads,...
7595560 Semiconductor device  
An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device 100 includes a semiconductor...
7592710 Bond pad structure for wire bonding  
A bond pad structure of an integrated circuit is provided. The bond pad structure includes a conductive bond pad, a first dielectric layer underlying the bond pad, and an M top plate located in...
7592244 Semiconductor device and method of manufacturing the same  
A method of manufacturing a semiconductor device includes the step of forming a first insulating section with a protruding section on a semiconductor substrate, the step of forming a first...
7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET  
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
7582972 Semiconductor device and fabrication method thereof  
A semiconductor device includes a semiconductor substrate with circuit elements and electrode pads formed on one surface. This surface is covered by a dielectric layer with openings above the...
RE40887 Semiconductor chip with redistribution metal layer  
A new method is provided for the creation of Input/Output connection points to a semiconductor device package. An extension is applied to the conventional I/O connect points of a semiconductor...
7579681 Super high density module with integrated wafer level packages  
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
7579679 Chipcard with contact areas and method for producing contact areas  
A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another...
7576438 Printed circuit board and method thereof and a solder ball land and method thereof  
A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment...
7573139 Packed system of semiconductor chips having a semiconductor interposer  
A semiconductor system ( 200 ) of one or more semiconductor interposers ( 201 ) with a certain dimension ( 210 ), conductive vias ( 212 ) extending from the first to the second surface, with...
7569937 Technique for forming a copper-based contact layer without a terminal metal  
By directly forming an underbump metallization layer on a copper-based contact region, the formation of any other terminal metals, such as aluminum and corresponding adhesion/barrier layers may be...
7566977 Semiconductor device and method for manufacturing the same  
A method for manufacturing a semiconductor device, includes: mounting a semiconductor chip having an electrode on a wiring substrate having a base substrate and a wiring formed on the base...
7564062 Electrode for p-type SiC  
A p-type electrode containing a first electrode material exhibiting an eutectic reaction at a temperature of 600° C. or lower, and a second electrode material of aluminum (Al).
7557453 Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device  
A semiconductor device comprises a first electrode-lead having a first Au film, a first Ni film, a Cu film, a second Au film and a second Ni film stacked in order, a second electrode-lead having a...
7557452 Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same  
A conductive structure configured to connect a contact pad of a semiconductor device with a corresponding contact pad of a substrate. The conductive structure includes two interconnectable members,...
7554208 Wirebond pad for semiconductor chip or wafer  
In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps...
7554207 Method of forming a lamination film pattern and improved lamination film pattern  
In a method of forming an electrically conductive lamination pattern, an insulating film is formed on a surface of a chromium-containing bottom layer, before an aluminum-containing top layer is...
7550858 Random sequence generation using alpha particle emission  
Generation of a random sequence using alpha particle emissions is described. A device includes memory cells, an alpha particle emitter, and read circuitry. The memory cells are sensitive to alpha...
7550846 Conductive bump with a plurality of contact elements  
A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one...
7550763 Semiconductor integrated circuit device and manufacture thereof  
In a semiconductor integrated circuit device, testing pads ( 209 b ) using a conductive layer, such as relocation wiring layers ( 205 ) are provided just above or in the neighborhood of terminals...
7547976 Electrode pad arrangement with open side for waste removal  
A pad structure 100 includes an electrode pad (a first electrically conducting film 104 and a second electrically conducting film 110 ) and an insulating film provided over a peripheral region...
7545037 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same  
Provided are embodiments of semiconductor chips having a redistributed metal interconnection directly connected to power/ground lines of an internal circuit are provided. Embodiments of the...
7541681 Interconnection structure, electronic component and method of manufacturing the same  
An interconnection structure includes an electrically conductive bump, wherein the electrically conductive bump has a metal body having a distal end. The metal body is free of solder. An outermost...
7538429 Method of enabling solder deposition on a substrate and electronic package formed thereby  
An electronic package includes a substrate ( 110, 310, 510 ) and a solder resist layer ( 120, 320, 520 ) over the substrate. The solder resist layer has a plurality of solder resist openings ( 121,...
7534651 Seedless wirebond pad plating  
An integrated circuit (IC) chip, semiconductor wafer with IC chips in a number of die locations and a method of making the IC chips on the wafer. The IC chips have plated chip interconnect pads....
7528487 Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board  
A semiconductor device including: a semiconductor chip including a substrate, an outer-connection electrode, and a bump, wherein the bump has a first conductive layer and a second conductive layer...
7525193 Semiconductor device and method of manufacturing the same  
A semiconductor device including: a semiconductor substrate having an electrode; a resin layer formed to avoid at least a part of the electrode; a land provided on the resin layer; an interconnect...
7525181 Tape wiring substrate and tape package using the same  
A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween....
7521811 Substrate for packaging semiconductor chip and method for manufacturing the same  
A substrate for packaging a semiconductor chip includes a dielectric layer, a plurality of conductive circuits and bonding pads formed on the dielectric layer, a metal thin deposition layer formed...
7521276 Compliant terminal mountings with vented spaces and methods  
A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and...
7518251 Stacked electronics for sensors  
A stacked electronics module comprises a first layer including a first substrate having a front side and a backside, a first electrical interconnect layer disposed on the first substrate and a...
7517732 Thin semiconductor device package  
A thin semiconductor device package, comprising a thin substrate, at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate, a mold material...
7514799 Connecting structure used in a chip module  
An improved chip module is described. The improved chip is comprised of a loading board for connecting with an external electronic component, a plurality of electrical conductors electrically...
7508082 Semiconductor device and method of manufacturing the same  
There is provided a solution to the problem of the poor adhesion in the pad portion while inhibiting the dishing in the pad portion. An SiON film, which covers insulating areas and has an opening...
7508072 Semiconductor device with pad electrode for testing and manufacturing method of the same  
The invention prevents a pad electrode for external connection of a semiconductor device from being damaged. An electronic circuit, a first pad electrode connected to the electronic circuit, and a...
7498680 Test structure  
A test structure to detect vertical leakage in a multi-layer flip chip pad stack or similar semiconductor device. The test structure is integrated into the semiconductor device when it is...
7489042 Stem for optical element and optical semiconductor device using the same  
A stem for an optical element includes a base-like portion located on a portion of a package side surface of an eyelet, higher than the package side surface. A block is located on a surface of the...
7485971 Electronic device package  
An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is...
7485948 Front-end processing of nickel plated bond pads  
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing...
7476968 Semiconductor device including an under electrode and a bump electrode  
Making the relative size of the surface area of a bump electrode at a portion in contact with an under electrode larger than the surface area of a base of a hole increases the contact surface area...
Matches 1 - 50 out of 555 1 2 3 4 5 6 7 8 9 10 11 12 >