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7622810 |
Semiconductor device and manufacturing method thereof
Disconnection of wiring and deterioration of step coverage are prevented to offer a semiconductor device of high reliability. A pad electrode formed on a silicon die is connected with a...
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7619305 |
Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking
A stacked semiconductor device primarily comprises semiconductor packages with a plurality of micro contacts and solder paste to soldering the micro contacts. Each semiconductor package comprises a...
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7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
A panel and a semiconductor component including a composite board with semiconductor chips and plastic package molding compound and a method for the production thereof is disclosed. In one...
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7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
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7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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7608929 |
Electrical connector structure of circuit board and method for fabricating the same
An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second...
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7608922 |
Semiconductor device including amplifier and frequency converter
A miniaturized semiconductor device has a package substrate, a semiconductor chip mounted on the main surface of the package substrate and having plural LNAs each for amplifying a signal, an RF VCO...
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7605479 |
Stacked chip assembly with encapsulant layer
A microelectronic subassembly 210 includes a substrate 215 having a top surface 216 and at least one peripheral region 219, a microelectronic element 201 mounted over the substrate 215, ...
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7605478 |
Semiconductor package and method of manufacturing the same
Provided are a semiconductor package and a method of manufacturing the semiconductor package, and more particularly, a semiconductor package with bonding wires and a method of manufacturing the...
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7598621 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths
A device package, such as a BGA, to be mounted on a printed wiring board (PWB) is disclosed. The bottom electrodes of the device package are arranged in an array such that intervals between the...
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7598613 |
Flip chip bonding structure
A semiconductor device is provided with: a solid device having a connection surface formed with a connection electrode projected therefrom; a semiconductor chip which has a functional surface...
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7598610 |
Plate structure having chip embedded therein and the manufacturing method of the same
A plate structure having a chip embedded therein, comprises an aluminum plate having at least one aluminum oxide layer formed on its surface, and a cavity therein; a chip embedded in the cavity,...
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7592710 |
Bond pad structure for wire bonding
A bond pad structure of an integrated circuit is provided. The bond pad structure includes a conductive bond pad, a first dielectric layer underlying the bond pad, and an M top plate located in...
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7592244 |
Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device includes the step of forming a first insulating section with a protruding section on a semiconductor substrate, the step of forming a first...
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7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
Methods for creating redistribution layers for only selected dice, such as known good dice, to form relatively thin semiconductor component assemblies and packages, and the assemblies and packages...
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7586200 |
Light emitting diode chip with reflective layer thereon
A light emitting diode including a substrate, a semiconductor layer, multiple electrodes, a passivation layer, multiple under bump metallurgy (UBM) layers and a reflective layer is provided. The...
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7586182 |
Packaged semiconductor die and manufacturing method thereof
Aspects of the subject matter described herein relate to a packaged semiconductor die which becomes a component of a finished multi-chip package. The packaged semiconductor die comprises a die...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7582972 |
Semiconductor device and fabrication method thereof
A semiconductor device includes a semiconductor substrate with circuit elements and electrode pads formed on one surface. This surface is covered by a dielectric layer with openings above the...
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7582971 |
Semiconductor device and manufacturing method of the same
The invention is directed to a semiconductor device having a penetrating electrode and a manufacturing method thereof in which reliability and a yield of the semiconductor device are enhanced. A...
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7582956 |
Flip chip in leaded molded package and method of manufacture thereof
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when...
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7579695 |
Integration type semiconductor device and method for manufacturing the same
A semiconductor device includes: a plurality of power MOS cells on a semiconductor substrate; a plurality of lead wires connecting to a source and a drain of each power MOS cell through a contact...
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7579694 |
Electronic devices including offset conductive bumps
Bumping a substrate having a metal layer thereon may include forming a barrier layer on the substrate including the metal layer and forming a conductive bump on the barrier layer. Moreover, the...
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7579693 |
Mounting structure of ball grid array
A ball grid array is mounted on a wiring board in a rectangular shape provided with screw insertion holes and fixed with screws to a mounting member at four points. Solder banks are formed around...
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7579681 |
Super high density module with integrated wafer level packages
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
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7579679 |
Chipcard with contact areas and method for producing contact areas
A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another...
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7579212 |
Semiconductor device having tin-based solder layer and method for manufacturing the same
A semiconductor device includes: a semiconductor substrate; a base member; a tin-based solder layer; a first metal layer; and a first alloy layer. The semiconductor substrate is bonded to the base...
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7576440 |
Semiconductor chip having bond pads and multi-chip package
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
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7576438 |
Printed circuit board and method thereof and a solder ball land and method thereof
A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment...
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7576436 |
Structure of wafer level package with area bump
A package structure with an area bump has at least a chip (also known as a die), a redistribution layer, a plurality of first bumps (normal bumps) and at least a second bump (area bump). The...
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7573140 |
Semiconductor device and method for manufacturing the same
A semiconductor device includes: a semiconductor substrate that has an integrated circuit; a plurality of electrodes that is formed on the semiconductor substrate, the plurality of the electrodes...
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7573131 |
Die-up integrated circuit package with grounded stiffener
A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate...
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7569939 |
Self alignment features for an electronic assembly
Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the...
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7569934 |
Copper interconnect
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a...
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7566649 |
Compressible films surrounding solder connectors
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a...
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7564130 |
Power micro surface-mount device package
A semiconductor device is provided, which comprises: a die including an active surface; a multiplicity of bond pads formed on the active surface of the die, wherein a first one of the bond pads is...
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7560802 |
Electrical connections in substrates
A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and...
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7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
A conductive structure configured to connect a contact pad of a semiconductor device with a corresponding contact pad of a substrate. The conductive structure includes two interconnectable members,...
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7554208 |
Wirebond pad for semiconductor chip or wafer
In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps...
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7554206 |
Microelectronic packages and methods therefor
A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the...
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7554198 |
Flexible joint methodology to attach a die on an organic substrate
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic...
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7550845 |
Ball grid array package with separated stiffener layer
In a ball grid array (BGA) package, a first stiffener is attached to a surface of a substrate. A second stiffener is attached to the surface of the substrate to be co-planar with the first...
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7550836 |
Structure of package on package and method for fabricating the same
A structure of a package on package and a method for fabricating the same are provided. The structure of the package on package includes a first package, a second package and a plurality of pins....
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7550835 |
Chip stack package utilizing a dummy pattern die between stacked chips for reducing package size
The chip stack package includes at least a printed circuit board having a bond finger and a ball land, and at least two semiconductor chips stacked on the printed circuit board while being spaced...
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7545028 |
Solder ball assembly for a semiconductor device and method of fabricating same
Solder ball assembly for a semiconductor device and method of fabricating the same is described. In one example, a solder mask is formed on a substrate having an aperture exposing at least a...
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7541681 |
Interconnection structure, electronic component and method of manufacturing the same
An interconnection structure includes an electrically conductive bump, wherein the electrically conductive bump has a metal body having a distal end. The metal body is free of solder. An outermost...
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7541674 |
Integrated circuit die for wire bonding and flip-chip mounting
An integrated circuit die carries conductive pads and thereon, the larger pads being suitable for flip-chip assembly and the smaller pads being suitable for wire bond assembly. The pitch between...
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7538442 |
Semiconductor chip and semiconductor device
In the peripheral part of a semiconductor chip, third electrode pads for wire bonding and plate wiring and first electrode pads dedicated to wire bonding are provided. On the other hand, second...
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7538440 |
Method for improved high current component interconnections
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is...
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7538429 |
Method of enabling solder deposition on a substrate and electronic package formed thereby
An electronic package includes a substrate ( 110, 310, 510 ) and a solder resist layer ( 120, 320, 520 ) over the substrate. The solder resist layer has a plurality of solder resist openings ( 121,...
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