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8183695 |
Semiconductor device and method of manufacturing the same
A semiconductor chip includes a semiconductor chip region provided with a plurality of internal circuits, and a plurality of electrode pads provided proximate to an outer edge of the semiconductor...
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8183697 |
Apparatus and methods of forming an interconnect between a workpiece and substrate
Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments...
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8178970 |
Strong interconnection post geometry
A flip-chip packaging assembly and integrated circuit device are disclosed. An exemplary flip-chip packaging assembly includes a first substrate; a second substrate; and joint structures disposed...
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8178980 |
Bond pad structure
A bonding pad structure is provided that includes two conductive layers and a connective layer interposing the two conductive layers. The connective layer includes a contiguous, conductive...
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8174120 |
Integrated circuit package system with leadframe substrate
An integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste...
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8174094 |
Bonded structures formed by plasma enhanced bonding
An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding...
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8168477 |
Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers
This invention discloses an electronic package for containing a vertical semiconductor chip that includes a laminated board having a via connector and conductive traces distributed on multiple...
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8159827 |
Circuit board and method of mounting electronic component on printed board
When U-shape formed electronic components having an axial lead shape are mounted upright on a printed board, two U-shape formed electronic components having an axial lead shape are arranged so as...
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8154122 |
Semiconductor package and methods of manufacturing the semiconductor package
A semiconductor package and a method of manufacturing the semiconductor package are provided. A semiconductor package according to the present general inventive concept may include a base substrate...
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8148813 |
Integrated circuit package architecture
A packaging architecture for an integrated circuit is provided. The architecture includes a printed circuit board and a package substrate disposed on the printed circuit board. A first integrated...
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8148258 |
Method for fabricating electrical bonding pads on a wafer
A method for fabricating electrical bonding pads on the electrical contact areas of a wafer includes producing first blocks made of a solder material, producing second blocks made of a solder...
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8138612 |
Semiconductor device
A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate and including a plurality of first portions and a second...
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8138019 |
Integrated (multilayer) circuits and process of producing the same
A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer...
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8124881 |
Printed board and portable electronic device which uses this printed board
A printed board comprising a packaging surface on which an electronic component is packaged, an adhesion prohibited portion which is provided at a region of the printed board different from a...
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8125090 |
Semiconductor power module
Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps...
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8124520 |
Integrated circuit mount system with solder mask pad
An integrated circuit mount system includes an integrated circuit, a solder mask for the integrated circuit, and a solder mask pad on the substrate with the solder mask.
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8120040 |
Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the...
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8115316 |
Packaging board, semiconductor module, and portable apparatus
A technology is provided for a packaging board adapted to mount a device capable of improving handleability and securing connection reliability. The packaging board includes: a pad electrode formed...
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8110752 |
Wiring substrate and method for manufacturing the same
A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead...
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8110930 |
Die backside metallization and surface activated bonding for stacked die packages
Methods and apparatus to provide die backside metallization and/or surface activated bonding for stacked die packages are described. In one embodiment, an active metal layer of a first die may be...
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8106516 |
Wafer-level chip scale package
A chip scale package implements solder bars to form a connection between a chip and a trace, formed in a substrate, such as another chip or PCB. Solder bars are formed by depositing one or more...
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8105881 |
Method of fabricating chip package structure
A method of fabricating a chip package structure includes the steps of providing a lead frame having a die pad, plural leads and at least one structure enhancement element. A chip is then disposed...
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8102668 |
Semiconductor device package with internal device protection
An integral impedence is formed on or within a lead frame pin of a semiconductor package and receives a connection from an electrode of a semiconductor die within the package to eliminate the need...
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8093728 |
Connection by fitting together two soldered inserts
A connection device between two components includes a hollow conductive insert, into which is fitted another conductive insert, the electrical connection between the two inserts being provided by...
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8088650 |
Method of fabricating chip package
A method of fabricating a chip package is provided. A thin metal plate having a first protrusion part, a second protrusion part and a plurality of third protrusion parts are provided. A chip is...
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8088684 |
Apparatus and method for semiconductor wafer bumping via injection molded solder
An improved apparatus and a method for semiconductor wafer bumping, that utilizes the injection molded solder process. The apparatus is designed for high volume manufacturing and includes equipment...
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8084298 |
Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor
A process for replacing a semiconductor chip of such a flip-chip module and a suitable flip-chip module and an apparatus for implementing the method are disclosed. The flip-chip module comprises at...
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8084869 |
Semiconductor device and method for manufacturing the same
A technique permitting the reduction in size of a semiconductor device is provided. In a BGA type semiconductor device with a semiconductor chip flip-chip-bonded onto a wiring substrate, bump...
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8076782 |
Substrate for mounting IC chip
An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided...
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8076786 |
Semiconductor package and method for packaging a semiconductor package
A wire bonding structure includes a chip and a bonding wire. The chip includes a base material, at least one first metallic pad, a re-distribution layer and at least one second metallic pad. The...
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8072059 |
Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die
A semiconductor device is made by forming a first conductive layer over a temporary carrier. A UBM layer is formed over the temporary carrier and fixed in position relative to the first conductive...
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8067827 |
Stacked microelectronic device assemblies
An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device...
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8062968 |
Interposer for redistributing signals
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
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8064221 |
Electronic devices for surface mount
Electronic devices are disclosed that allow for surface-mounting using solder while preventing solder from overflowing between external terminals of the electronic device, or between pads on a...
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8053907 |
Method and system for forming conductive bumping with copper interconnection
An integrated circuit system with one or more copper interconnects is provided. The one or more copper interconnects are in conductive contact with a substrate. The integrated circuit system...
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8050048 |
Lead frame with solder flow control
A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A...
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8048793 |
Flip chip for electrical function test and manufacturing method thereof
Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing...
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8049211 |
Laminate structure and its manufacturing method, including wettability variable layer of material of variable critical surface tension
A disclosed laminate structure is capable of having its surface free energy changed with a small amount of UV irradiation. The invention also discloses a method of manufacturing the laminate...
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8044523 |
Semiconductor device
The invention relates to a semiconductor device with a semiconductor chip, on which a terminal contact formed in one piece, a patterned metallization layer, contacting the terminal contact, and a...
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8044521 |
Semiconductor device
An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip...
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8044512 |
Electrical property altering, planar member with solder element in IC chip package
A structure includes a solder element for electrically coupling a substrate of an integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering,...
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8039973 |
Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module
The module is of the type comprising an electronic component provided with a conductive face that is electrically connected to a connection member of the component by means of a conductor that is...
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8039971 |
Electronic circuit arrangement
Electronic circuit arrangement, includes a chip and a chip carrier having a substrate and a chip contact location. At least the chip contact location is provided with a soldering layer. The chip...
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8039960 |
Solder bump with inner core pillar in semiconductor package
An electrical interconnect within a semiconductor device consists of a substrate with a plurality of active devices. A contact pad is formed on the substrate in electrical contact with the...
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8035206 |
Self-aligning structures and method for integrated circuits
A lead frame having a die thereon connects a high current conductive area on the die to a lead frame contact using a copper clip that includes a structure portion that is received with a...
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8033446 |
Manufacturing method of solid-state image pickup device
After a wiring substrate having, on its lower surface, an opening and terminals arranged therearound is provided, a sealing material is supplied to the lower surface of the wiring substrate, and a...
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8030768 |
Semiconductor package with under bump metallization aligned with open vias
A semiconductor package with a semiconductor chip having under bump metallizations (UBMs) on a first surface and a substrate having open vias. The substrate is attached to the semiconductor chip...
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8030769 |
Grooving bumped wafer pre-underfill system
A method of forming a semiconductor device includes providing a bumped wafer. A plurality of grooves is formed in an active surface of the bumped wafer. A pre-underfill layer is disposed over the...
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8030201 |
Semiconductor device and method of manufacturing the same
A first electronic circuit component and a second electronic circuit component are electrically connected to an electro-conductive member via a first solder and a second solder, respectively. The...
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8026566 |
Semiconductor device and method for manufacturing semiconductor device
A semiconductor device includes a first metal foil, an insulating sheet mounted on an upper surface of the first metal foil main, at least one second metal foil mounted on the insulating sheet, at...
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