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7642660 |
Method and apparatus for reducing electrical interconnection fatigue
A method and apparatus is provided that pertains to resisting crack initiation and propagation in electrical interconnections between components and substrates in ball grid array microelectronic...
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7642639 |
COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
An IC package to enhance the bondibility of embedded bumps, primarily includes a substrate having a plurality of bump-accommodating holes, a bumped chip, an encapsulant, and a plurality of external...
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7638882 |
Flip-chip package and method of forming thereof
A flip-chip package is disclosed. The flip-chip package includes a substrate comprising at least one build-up layer. At least one longitudinal trench is formed in at least one build-up layer of the...
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7635077 |
Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby
A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having...
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7632710 |
Method for soldering electronic component and soldering structure of electronic component
In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode....
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7626274 |
Semiconductor device with an improved solder joint
A semiconductor device with an improved solder joint system is described. The solder system includes two copper contact pads connected by a body of solder and the solder is an alloy including tin,...
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7626275 |
Semiconductor device
A semiconductor device includes a semiconductor substrate, a first metal film on a back surface of the semiconductor substrate, a second metal film on the first metal film, and a third metal film...
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7626276 |
Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
A method provides an interconnect structure having enhanced structural support when underlying functional metal layers are insulated with a low modulus dielectric. A first metal layer having a...
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7626264 |
Substrate for device bonding and method for manufacturing same
A substrate for device bonding is provided, which enables bonding of a device with high bond strength to an Au electrode formed on a substrate such as aluminum nitride by soldering the device at a...
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7622329 |
Method for fabricating core substrate using paste bumps
A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps...
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7619305 |
Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking
A stacked semiconductor device primarily comprises semiconductor packages with a plurality of micro contacts and solder paste to soldering the micro contacts. Each semiconductor package comprises a...
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7615851 |
Integrated circuit package system
An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical...
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7615873 |
Solder flow stops for semiconductor die substrates
A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to...
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7615866 |
Contact surrounded by passivation and polymide and method therefor
A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer...
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7612455 |
Layered structure for electron device including regions of different wettability, electron device and electron device array that uses such a layered structure
A layered structure comprises a variable wettability layer including a material that changes a critical surface tension in response to energy provided thereto, the wettability changing layer...
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7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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7608929 |
Electrical connector structure of circuit board and method for fabricating the same
An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second...
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7608930 |
Semiconductor device and method of manufacturing semiconductor device
This semiconductor device includes a semiconductor chip, and a lead arranged around the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, and...
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7605479 |
Stacked chip assembly with encapsulant layer
A microelectronic subassembly 210 includes a substrate 215 having a top surface 216 and at least one peripheral region 219, a microelectronic element 201 mounted over the substrate 215, ...
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7605481 |
Nickel alloy sputtering target and nickel alloy thin film
The present invention relates to a nickel alloy sputtering target comprising 1 to 30 at % of Cu; 2 to 25 at % of at least one element selected from among V, Cr, Al, Si, Ti and Mo; remnant Ni and...
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7598600 |
Stackable power semiconductor package system
The present invention provides a method of making a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate...
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7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a...
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7592244 |
Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device includes the step of forming a first insulating section with a protruding section on a semiconductor substrate, the step of forming a first...
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7592710 |
Bond pad structure for wire bonding
A bond pad structure of an integrated circuit is provided. The bond pad structure includes a conductive bond pad, a first dielectric layer underlying the bond pad, and an M top plate located in...
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7589388 |
Semiconductor device and method of manufacturing the same
The invention is directed to providing a package type semiconductor device with high reliability and smaller size and a method of manufacturing the same. A semiconductor substrate formed with a...
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7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
Methods for creating redistribution layers for only selected dice, such as known good dice, to form relatively thin semiconductor component assemblies and packages, and the assemblies and packages...
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7582552 |
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering
In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy...
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7582968 |
Wiring board with a protective film greater in heights than bumps
A wiring board according to the present invention includes: an insulating base 22 ; a plurality of first conductor wirings 23 a aligned in an inner region on the insulating base; bumps 24 ...
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7582956 |
Flip chip in leaded molded package and method of manufacture thereof
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when...
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7579681 |
Super high density module with integrated wafer level packages
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
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7579680 |
Packaging system for semiconductor devices
A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that...
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7579695 |
Integration type semiconductor device and method for manufacturing the same
A semiconductor device includes: a plurality of power MOS cells on a semiconductor substrate; a plurality of lead wires connecting to a source and a drain of each power MOS cell through a contact...
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7576437 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving...
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7569939 |
Self alignment features for an electronic assembly
Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the...
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7569471 |
Method of providing mixed size solder bumps on a substrate using a solder delivery head
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a substrate...
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7566649 |
Compressible films surrounding solder connectors
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a...
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7564130 |
Power micro surface-mount device package
A semiconductor device is provided, which comprises: a die including an active surface; a multiplicity of bond pads formed on the active surface of the die, wherein a first one of the bond pads is...
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7560802 |
Electrical connections in substrates
A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and...
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7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
A conductive structure configured to connect a contact pad of a semiconductor device with a corresponding contact pad of a substrate. The conductive structure includes two interconnectable members,...
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7554198 |
Flexible joint methodology to attach a die on an organic substrate
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic...
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7554206 |
Microelectronic packages and methods therefor
A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the...
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7550844 |
Semiconductor device and manufacturing method thereof
A semiconductor device and manufacturing method thereof improving moisture resistance of a FeRAM. After a probe test using a pad, a metal film is formed to cover the pad in an opening of a...
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7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first and second areas formed with a high-frequency circuit element, and a third area...
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7545050 |
Design structure for final via designs for chip stress reduction
A design structure to provide a package for a semiconductor chip that minimizes the stresses and strains that arise from differential thermal expansion in chip to substrate or chip to card...
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7538417 |
Semiconductor device with signal line having decreased characteristic impedance
A semiconductor device includes a semiconductor chip, electrodes pads, first and second insulating layers, first and second conductive patterns and external terminals. The electrode pads are formed...
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7538021 |
Removing dry film resist residues using hydrolyzable membranes
A technique to remove dry film resist residues during solder bump formation. A resist assembly is formed on a metal pad on a substrate. The resist assembly includes a solder resist (SR) layer, a...
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7538440 |
Method for improved high current component interconnections
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is...
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7531898 |
Non-Circular via holes for bumping pads and related structures
An integrated circuit device may include a substrate, a conductive pad on a surface of the substrate, and a conductive line on the surface of the substrate. Moreover, the conductive line may be...
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7525181 |
Tape wiring substrate and tape package using the same
A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween....
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7521800 |
Solder pad and method of making the same
A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through...
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