|
Match
|
Document |
Document Title |
|
|
7615873 |
Solder flow stops for semiconductor die substrates
A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to...
|
|
|
7615866 |
Contact surrounded by passivation and polymide and method therefor
A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer...
|
|
|
7615851 |
Integrated circuit package system
An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical...
|
|
|
7612455 |
Layered structure for electron device including regions of different wettability, electron device and electron device array that uses such a layered structure
A layered structure comprises a variable wettability layer including a material that changes a critical surface tension in response to energy provided thereto, the wettability changing layer...
|
|
|
7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
|
|
|
7608930 |
Semiconductor device and method of manufacturing semiconductor device
This semiconductor device includes a semiconductor chip, and a lead arranged around the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, and...
|
|
|
7608929 |
Electrical connector structure of circuit board and method for fabricating the same
An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second...
|
|
|
7605481 |
Nickel alloy sputtering target and nickel alloy thin film
The present invention relates to a nickel alloy sputtering target comprising 1 to 30 at % of Cu; 2 to 25 at % of at least one element selected from among V, Cr, Al, Si, Ti and Mo; remnant Ni and...
|
|
|
7605479 |
Stacked chip assembly with encapsulant layer
A microelectronic subassembly 210 includes a substrate 215 having a top surface 216 and at least one peripheral region 219, a microelectronic element 201 mounted over the substrate 215, ...
|
|
|
7598600 |
Stackable power semiconductor package system
The present invention provides a method of making a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate...
|
|
|
7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a...
|
|
|
7592710 |
Bond pad structure for wire bonding
A bond pad structure of an integrated circuit is provided. The bond pad structure includes a conductive bond pad, a first dielectric layer underlying the bond pad, and an M top plate located in...
|
|
|
7592244 |
Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device includes the step of forming a first insulating section with a protruding section on a semiconductor substrate, the step of forming a first...
|
|
|
7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
Methods for creating redistribution layers for only selected dice, such as known good dice, to form relatively thin semiconductor component assemblies and packages, and the assemblies and packages...
|
|
|
7589388 |
Semiconductor device and method of manufacturing the same
The invention is directed to providing a package type semiconductor device with high reliability and smaller size and a method of manufacturing the same. A semiconductor substrate formed with a...
|
|
|
7582968 |
Wiring board with a protective film greater in heights than bumps
A wiring board according to the present invention includes: an insulating base 22 ; a plurality of first conductor wirings 23 a aligned in an inner region on the insulating base; bumps 24 ...
|
|
|
7582956 |
Flip chip in leaded molded package and method of manufacture thereof
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when...
|
|
|
7582552 |
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering
In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy...
|
|
|
7579695 |
Integration type semiconductor device and method for manufacturing the same
A semiconductor device includes: a plurality of power MOS cells on a semiconductor substrate; a plurality of lead wires connecting to a source and a drain of each power MOS cell through a contact...
|
|
|
7579681 |
Super high density module with integrated wafer level packages
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
|
|
|
7579680 |
Packaging system for semiconductor devices
A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that...
|
|
|
7576437 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving...
|
|
|
7569939 |
Self alignment features for an electronic assembly
Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the...
|
|
|
7569471 |
Method of providing mixed size solder bumps on a substrate using a solder delivery head
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a substrate...
|
|
|
7566649 |
Compressible films surrounding solder connectors
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a...
|
|
|
7564130 |
Power micro surface-mount device package
A semiconductor device is provided, which comprises: a die including an active surface; a multiplicity of bond pads formed on the active surface of the die, wherein a first one of the bond pads is...
|
|
|
7560802 |
Electrical connections in substrates
A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and...
|
|
|
7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
A conductive structure configured to connect a contact pad of a semiconductor device with a corresponding contact pad of a substrate. The conductive structure includes two interconnectable members,...
|
|
|
7554206 |
Microelectronic packages and methods therefor
A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the...
|
|
|
7554198 |
Flexible joint methodology to attach a die on an organic substrate
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic...
|
|
|
7550844 |
Semiconductor device and manufacturing method thereof
A semiconductor device and manufacturing method thereof improving moisture resistance of a FeRAM. After a probe test using a pad, a metal film is formed to cover the pad in an opening of a...
|
|
|
7545050 |
Design structure for final via designs for chip stress reduction
A design structure to provide a package for a semiconductor chip that minimizes the stresses and strains that arise from differential thermal expansion in chip to substrate or chip to card...
|
|
|
7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first and second areas formed with a high-frequency circuit element, and a third area...
|
|
|
7538440 |
Method for improved high current component interconnections
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is...
|
|
|
7538417 |
Semiconductor device with signal line having decreased characteristic impedance
A semiconductor device includes a semiconductor chip, electrodes pads, first and second insulating layers, first and second conductive patterns and external terminals. The electrode pads are formed...
|
|
|
7538021 |
Removing dry film resist residues using hydrolyzable membranes
A technique to remove dry film resist residues during solder bump formation. A resist assembly is formed on a metal pad on a substrate. The resist assembly includes a solder resist (SR) layer, a...
|
|
|
7531898 |
Non-Circular via holes for bumping pads and related structures
An integrated circuit device may include a substrate, a conductive pad on a surface of the substrate, and a conductive line on the surface of the substrate. Moreover, the conductive line may be...
|
|
|
7525181 |
Tape wiring substrate and tape package using the same
A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween....
|
|
|
7521800 |
Solder pad and method of making the same
A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through...
|
|
|
7514790 |
Semiconductor device and method of manufacturing a semiconductor device
A semiconductor device comprises: an insulation layer located on or above a semiconductor element; a conductive pad formed on the insulation film; and a first opening pattern formed on the...
|
|
|
7514351 |
Solder ball mounting method and solder ball mounting substrate manufacturing method
A solder resist having first opening portions on positions corresponding to electrodes and a second opening portion on a mask providing position is formed on the substrate. A flux mask whose...
|
|
|
7508082 |
Semiconductor device and method of manufacturing the same
There is provided a solution to the problem of the poor adhesion in the pad portion while inhibiting the dishing in the pad portion. An SiON film, which covers insulating areas and has an opening...
|
|
|
7495341 |
Methods and apparatus for packaging integrated circuit devices
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and...
|
|
|
7485970 |
Semiconductor package substrate having contact pad protective layer formed thereon
A semiconductor package substrate and a method for fabricating the same are proposed. An insulating layer has a plurality of blind vias to expose inner traces underneath the insulating layer. A...
|
|
|
7485948 |
Front-end processing of nickel plated bond pads
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing...
|
|
|
7485563 |
Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a...
|
|
|
7482699 |
Semiconductor device
The present invention can supply power for each circuit section by separating and connecting bus-bar ( 21 d ) for each circuit section inside the semiconductor chip ( 22 ), and, in addition, can...
|
|
|
7482698 |
Semiconducting device with folded interposer
Some embodiments of the present invention relate to a semiconducting device that includes an interposer having a fold which divides the interposer into a first section and a second section. A first...
|
|
|
7476978 |
Electronic component having a semiconductor power device
An electronic component adapted to be mounted on a substrate with landing pads having a landing pad layout has a power semiconductor device and outer contact surfaces with a component pad layout....
|
|
|
7476977 |
Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
A chip mounting substrate for bonding a semiconductor chip to a substrate, comprises a solder layer on the substrate, the solder layer being connectable to a semiconductor chip, wherein the solder...
|