Matches 401 - 450 out of 773 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >
Match Document Document Title
6541366 Method for improving a solder bump adhesion bond to a UBM contact layer  
A method for improving an adhesion bond between a solder material and an under bump metallization (UBM) layer including providing at least two UBM layers overlying a chip bonding pad including an...
6541867 Microelectronic connector with planar elastomer sockets  
A component for mounting semiconductor chips or other microelectronic units includes a compliant, sheet-like body with arrays of sheet-like conductive pads on upper and lower surfaces of the body....
6538898 Method and apparatus of die attachment for BOC and F/C surface mount  
A method and apparatus for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface, mounting comprise protrusions on the surface of...
6538312 Multilayered microelectronic device package with an integral window  
An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip,...
6531784 Semiconductor package with spacer strips  
A semiconductor package incorporates spacer strips enabling one or more semiconductor dies having central terminal pads to be stacked on top of one another within the package and reliably wire...
6531770 Electronic part unit attached to a circuit board and including a cover member covering the electronic part  
An electronic part unit comprises an electronic part body which has a semiconductor chip and a plurality of external connection electrodes electrically connected to the semiconductor chip and in...
6528891 Bumpless flip chip assembly with solder via  
A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes which serve as the connection between the semiconductor device and...
6528890 Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit  
The present invention includes circuits, methods of adhering an integrated circuit device to a substrate, and methods of forming a circuit. According to one aspect of the present invention, a...
6528875 Vacuum sealed package for semiconductor chip  
A vacuum sealed package for a semiconductor chip, such as a micro-electromechanical (MEM) chip, is disclosed, along with a method of making such a package. In an exemplary embodiment, the package...
6528881 Semiconductor device utilizing a side wall to prevent deterioration between electrode pad and barrier layer  
In a semiconductor device that includes a barrier film, an electrode pad on the barrier film, and a solder ball on the electrode pad, the electrode pad is prevented from exfoliating from the...
6528873 Ball grid assembly with solder columns  
A method of making a ball grid assembly and the assembly wherein a mask ( 1 ) is provided which is not wettable by solder and through which a pattern of parallel holes ( 3 ) is provided extending...
6521997 Chip carrier for accommodating passive component  
A chip carrier for accommodating a passive component is proposed, allowing at least a chip to be electrically connected to the chip carrier. At least a pair of spaced-apart solder pads are formed...
6518674 Temporary attach article and method for temporary attach of devices to a substrate  
A temporary attach article of a first component to a second component which includes a first component having a first volume of a fusible material; a second component having a second volume of...
6518665 Enhanced underfill adhesion  
A flip chip having a chip passivation layer disposed on a metalization layer. Terminal vias are formed in the passivation layer exposing a portion of the metalization layer and terminal...
6512304 Nickel-iron expansion contact for semiconductor die  
A contact clip for the aluminum contact of a semiconductor device has a central nickel-iron body, preferably Nilo alloy 42, which is coated on top and bottom by a soft, but high conductivity metal...
6509634 Chip mounting structure having adhesive conductor  
A chip mounting structure provides an adhesive conductor between a chip and a printed circuit board. The adhesive conductor includes an adhesive layer having viscoelasticity to cushion thermal...
6509646 Apparatus for reducing an electrical noise inside a ball grid array package  
An apparatus for reducing an electrical noise inside a ball grid array package is disclosed. The apparatus mainly comprises a substrate, a plurality of solder balls and a plurality of...
6509643 Tab tape with stiffener and semiconductor device using same  
A TAB tape with a stiffener is prepared by bonding a one-metal TAB tape 20 having a structure wherein a circuit pattern 21 is formed on either surface of a first tape base material, a part...
6507122 Pre-bond encapsulation of area array terminated chip and wafer scale packages  
An integrated circuit chip package wherein the chip is encapsulated prior to mechanical bonding to a packaging substrate. The package provides a continuous adhesive interface between the...
6506624 Method of manufacturing an optical semiconductor module  
A method of manufacturing an optical semiconductor module, comprising joining an electronic cooling element to a bottom plate of an optical semiconductor package and mounting an optical...
6501663 Three-dimensional interconnect system  
A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system...
6501164 Multi-chip semiconductor package with heat dissipating structure  
A multi-chip semiconductor package with a heat dissipating structure is proposed, in which a chip receiving cavity and an opening respectively formed in the heat dissipating structure and a chip...
6498308 Semiconductor module  
A semiconductor module includes a chip formed with an integrated circuit, a first external connecting terminal electrically connected to the integrated circuit, a printed wiring board having a...
6497943 Surface metal balancing to reduce chip carrier flexing  
A surface metal balancing structure for a chip carrier, and an associated method of fabrication, to reduce or eliminate thermally induced chip carrier flexing. A substrate, such as a chip carrier...
6495895 Bi-level multilayered microelectronic device package with an integral window  
A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS...
6492197 Trilayer/bilayer solder bumps and fabrication methods therefor  
Solder bumps are fabricated by plating a first solder layer on an underbump metallurgy, plating a second solder layer having higher melting point than the first solder layer on the first solder...
6485814 High density thin film circuit board and method of production thereof  
To provide electrical conduction between front and back surfaces of a thin film multi-layered circuit board, such as an MCM, at low cost without using a simultaneous firing process for ceramic. The...
6485843 Apparatus and method for mounting BGA devices  
A surface-mount device attach method for attaching solder ball-grid array or solder column-grid array surface-mount devices to a printed circuit board where the conventional solder mask structure...
6486001 Fabricating method of semiconductor device  
According to a fabricating method of the present invention, a cap shaped cover plate having a concaved portion on the inner surface is mounted on the rear surface of a semiconductor chip. After...
6476505 Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners  
A semiconductor pullet 1 includes an integrated circuit formed in the central area of the pellet 1 , first electric pads 2 arranged in a line in the peripheral area and second electric pads 3...
6472749 Semiconductor device having a shortened wiring length to reduce the size of a chip  
Provided is a technique which permits production of a semiconductor device having, integrated therein, a semiconductor chip smaller in external size than an ordinary semiconductor chip without...
6472759 Ball grid array type semiconductor device  
A BGA type semiconductor device having a high reliability when mounted on a printed circuit board by preventing cracks and breakage of weld balls of the BGA type semiconductor device. The...
6472763 Semiconductor device with bumps for pads  
A conductive electrode pad is formed on a partial area of an insulating surface. An insulating film covers the electrode pad. The insulating film has an opening exposing at least a partial upper...
6469393 Semiconductor package and mount board  
The package-side land 3 a of a semiconductor package P 1 is wholly exposed into the opening 5 a of a solder resist layer 5 . The board-side land 12 a of the mount board B 1 is also wholly...
6465886 Semiconductor device having circuit pattern and lands thereon  
Interconnection wiring lines connecting electrode terminals with external connection terminals are easily provided for semiconductor chips having increased number or density of external connection...
6465747 Microelectronic assemblies having solder-wettable pads and conductive elements  
A microelectronic assembly includes a component having one or more conductive pads, with each conductive pad having a plurality of solder-wettable strips extending outwardly away from a center, the...
6465885 Positioning of soldering pads in semiconductor diode package  
The soldering pads on metal contacts for connection to the electrodes of a semiconductor diode chip are surrounded with a coating of insulating material to prevent the spreading of the molten...
6462414 Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad  
An integrated circuit package is provided with a ball landing area having a conductive structure for interlocking a conductive ball to the ball pad. The conductive structure improves the attachment...
6462412 Foldable, flexible laminate type semiconductor apparatus with reinforcing and heat-radiating plates  
A laminate-type semiconductor apparatus utilizing a flexible substrate being mounted with a plurality of semiconductor devices, in which the laminate-type semiconductor apparatus is free from...
6462424 Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure  
A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the...
6459152 Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface  
A plurality of chips are mounted on a substrate, coupling portions between the chips and the substrate are sealed, the chips have rear surfaces thereof collectively polished, and the substrate with...
6459150 Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer  
A single-step bumping/bonding method for forming a semiconductor package of two electronic substrates electrically connected together by solder bumps. In the method, a first electronic substrate is...
6459160 Package with low stress hermetic seal  
A sealed electronic circuit module includes a ceramic chip carrier with a top surface, a cover having a mating surface and a seal at the periphery of the carrier between the carrier and the cover....
6455941 Chip scale package  
A chip scale package comprises a film substrate attached to the active surface of a semiconductor chip by an adhesive layer. The adhesive layer has a plurality of apertures formed corresponding to...
6452280 Flip chip semiconductor apparatus with projecting electrodes and method for producing same  
A semiconductor apparatus in which the height of the projected electrode ( 4 ) formed on the semiconductor element ( 1 ) is deformed plastically so as to unify the distance of the protruding...
6452262 Layout of Vdd and Vss balls in a four layer PBGA  
A BGA package wherein power is provided to the die through power (Vdd) balls which are located in an inner most row of solder balls. By arranging the power balls in an inner most row, it is...
6452270 Semiconductor device having bump electrode  
A semiconductor device having bump electrodes mainly comprises a specialized under bump metallurgy (UBM) applied to a chip with copper contact pads. Typically, the chip comprises a substrate and at...
6444563 Method and apparatus for extending fatigue life of solder joints in a semiconductor device  
A ball grid array (BGA) or chips scale package (CSP) integrated circuit (IC) ( 20 ) is manufactured by first identifying the most unreliable solder ball joints in the IC. These worst case joints,...
6441488 Fan-out translator for a semiconductor package  
A translator for connecting package terminals of a semiconductor chip package to connection pads on a substrate is disclosed. The package terminals are arranged in an array on the semiconductor...
6437989 Circuit board with an electronic component and a method for producing a connection between the circuit board and the component  
This circuit board contains electronic components having electrical contacts. At least one of the electrical contacts is initially glued to the circuit board using a conductive adhesive and at...
Matches 401 - 450 out of 773 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >