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6700204 |
Substrate for accommodating passive component
A substrate for accommodating a passive component is proposed, including a core layer defined with a chip attach area and a trace forming area surrounding the chip attach area, with a solder mask...
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6696763 |
Solder ball allocation on a chip and method of the same
A solder ball allocation on a chip, and a method of the same are provided. The chip has a substrate, first solder balls and second solder balls. The first solder balls are located on a periphery of...
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6691406 |
Methods of die attachment for BOC and F/C surface mount
Methods for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface mounting comprise protrusions on the surface of the substrate. The...
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6690090 |
Semiconductor device having reliable coupling with mounting substrate
A downsized semiconductor device comprises a plurality of bonding pads formed on a surface of a semiconductor chip. A plurality of conductive wires are coupled to the bonding pad and extends away...
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6689678 |
Process for fabricating ball grid array package for enhanced stress tolerance
The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow...
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6683387 |
Flip chip carrier package with adapted landing pads
A carrier member is provided that has a plurality of landing pads thereon where at least one of the landing pads has a depression therein to hold at least one solder terminal of a device to be...
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6674159 |
Bi-level microelectronic device package with an integral window
A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed...
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6670718 |
Wiring board utilizing a conductive member having a reduced thickness
In a wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is...
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6667559 |
Ball grid array module and method of manufacturing same
A ball grid array module is provided. In particular, the ball grid array module includes a substrate with two layers of insulation positioned thereon. At least one cavity having a side wall and a...
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6667192 |
Device and method for making devices comprising at least a chip fixed on a support
A method for mounting, on a support, at least a microcircuit in the form of a chip produced on a very thin semiconductor substrate. An interconnection point is provided at the chip in the form of a...
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6664643 |
Semiconductor device and method for manufacturing the same
In a stacked package in which semiconductor chips are stacked in layers, in order to mount the semiconductor chips without damaging the semiconductor chips even when an upper semiconductor chip has...
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6661084 |
Single level microelectronic device package with an integral window
A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed...
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6657296 |
Semicondctor package
A semiconductor package is proposed, in which at least one chip is mounted on a substrate, and at least one die-attach region is formed on the substrate. A plurality of thermal vias formed in the...
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6655022 |
Implementing micro BGA assembly techniques for small die
A method of implementing a micro BGA is introduced. More specifically, the method discloses packaging an integrated circuit into an integrated circuit assembly. The method first mounts polyimide...
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6653741 |
Thermal interface material and heat sink configuration
A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to...
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6653740 |
Vertical conduction flip-chip device with bump contacts on single surface
A flip-chip MOSFET structure has a vertical conduction semiconductor die in which the lower layer of the die is connected to a drain electrode on the top of the die by a diffusion sinker or...
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6650016 |
Selective C4 connection in IC packaging
In an integrated circuit package employing solder bump technology, a metal layer placed on the surface of a substrate below an array of bonding pads is split and displaced from its axis at selected...
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6650020 |
Resin-sealed semiconductor device
The resin-sealed semiconductor device includes a die pad portion, a semiconductor element mounted on the die pad portion and having electrodes, a plurality of lead portions arranged with their...
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6646333 |
Semiconductor module having interconnected semiconductor chips disposed one above the other
A semiconductor module has a plurality of semiconductor chips which are provide on chip carriers in a housing. At least some of the semiconductor chips are disposed one above the other and there...
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6647036 |
Integration and alignment of VCSEL's with MEMS using micromachining and flip-chip techniques
A micro-electromechanical system assembly is designed to integrate a laser. More particularly, laser is a vertical cavity surface-emitting laser. The MEMS assembly includes a...
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6642624 |
Ball grid array type semiconductor device
In a ball grid array type semiconductor device including an interposer substrate having first and second surfaces, a semiconductor chip mounted on the first surface of the interposer substrate, and...
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6628178 |
Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof
The surface acoustic wave elements and the other surface mounting elements are mounted on a ceramic multi-layer substrate. The surface acoustic wave elements may be flip chips face-down-bonded to...
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6621168 |
Interconnected circuit board assembly and system
An electrical assembly ( 200 , FIG. 2 ) is formed from two, interconnected circuit boards ( 202, 204 ). Conductive spacers ( 240 ) and a conductive material ( 260 ) are placed between...
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6621152 |
Thin, small-sized power semiconductor package
A power semiconductor package is provided. The power semiconductor package includes a chip, leads, conductive media, and a molding material. The leads have a groove in the shape of a hemisphere or...
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6617680 |
Chip carrier, semiconductor package and fabricating method thereof
A chip carrier, a semiconductor package and a fabricating method thereof are proposed, in which on one side of the chip carrier finally removed from an engaged surface of a mold in a de-molding...
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6617694 |
Semiconductor chip, semiconductor device, methods of fabricating thereof, circuit board and electronic device
The positions of first terminals of a first semiconductor chip have a plane symmetrical relationship with the positions of second terminals of a second semiconductor chip. First buffer circuits of...
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6611055 |
Leadless flip chip carrier design and structure
One disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die with a number of solder bumps on its active surface. The disclosed embodiment further comprises...
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6608382 |
Metal bump
A plurality of metal bumps connecting a nonconducting substrate and a chip, consisting of: at least a first metal bump having at least one curved face, at least a second metal bump having at least...
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6600233 |
Integrated circuit package with surface mounted pins on an organic substrate
An integrated circuit package fabricated by attaching a surface mount pin to a pin pad on a substrate using a Sn—Sb solder composition, where the quantity of Sb is in a range from 4 percent to 10...
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6586844 |
Flip chip die
A flip chip die, having a chip with an active surface, a passivation layer, at least one first bump pad and at least one second bump pad. The passivation layer, the first and second bump pads are...
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6583514 |
Semiconductor device with a binary alloy bonding layer
A semiconductor device includes a semiconductor chip. A substrate is arranged in opposition to the semiconductor chip. A first electrode is placed on the semiconductor chip while a second electrode...
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6583517 |
Method and structure for joining two substrates with a low melt solder joint
A method and structure to electrically and mechanically join a first a first electrically conductive pad on a first substrate to a second electrically conductive pad on a second substrate using a...
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6583513 |
Integrated circuit package with an IC chip and pads that dissipate heat away from the chip
An integrated circuit package comprising a substrate, and a chip die mounted on the substrate. The substrate includes electrically conductive traces, a set of primary interconnects arranged to...
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6583515 |
Ball grid array package for enhanced stress tolerance
The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow...
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6579734 |
Wire bonding method
A semiconductor device is provided which is obtained by wire bonding without any drop in wire bonding characteristics. A bonding pad is prepared on which a wire bonding region and a test region...
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6580107 |
Compound semiconductor device with depletion layer stop region
The conventional compound semiconductor switching device is prone to have a large chip size as the gate width needs to be large for achieving a low insertion loss and the separation between the...
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6576971 |
Chip type electronic part
The present invention is to provide a chip type electronic part without the risk of generating a tombstone at the time of soldering on a circuit substrate. External electrodes are formed at both...
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6573610 |
Substrate of semiconductor package for flip chip package
A semiconductor package structure for Flip Chip package includes at least an insulative core layer and a plurality of patterned circuit layers alternately stacking up each other. The patterned...
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6570396 |
Interface structure for contacting probe beams
Mass produced organic I.C. chip package designed to permanently package chips are used as MLO space transformers of a probe apparatus having buckling beam probes. The chip carriers have a solder...
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6570429 |
Method and apparatus for providing a clock signal to a semiconductor chip
A clock distribution tree for use with a semiconductor chip. The package for a semiconductor chip includes a clock distribution tree having a plurality of output terminals for connection to a...
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6570251 |
Under bump metalization pad and solder bump connections
The present invention relates to an improved method of forming and structure for under bump metallurgy (“UBM”) pads for a flip chip which reduces the number of metal layers and requires the use...
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6566762 |
Front side coating for bump devices
Flip chips with improved solder bump strength are provided. A solder mask layer is placed and patterned on a front side of a wafer of semiconductor chips with semiconductor devices and bond pads....
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6566752 |
Bonding pad and method for manufacturing it
A bonding pad that has low parasitic capacitance and that transmits little or no stress to the underlying metal layer during bonding, along with a process for manufacturing it, is described. A key...
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6566744 |
Integrated circuit packages assembled utilizing fluidic self-assembly
Assembly of integrated circuit packages, such as BGA packaged devices, using fluidic self-assembly. Functional components, such as integrated circuits, having a wired side are suspended in a fluid...
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6559527 |
Process for forming cone shaped solder for chip interconnection
A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the...
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6555920 |
Vertical electronic circuit package
An electronic circuit package includes a vertical package section ( 304 , FIG. 3 ) electrically connected to a horizontal package section ( 306 , FIG. 3 ). The vertical package section includes...
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6555052 |
Electron device and semiconductor device
An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor...
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6552275 |
Surface mount component
An apparatus including a substrate, and a surface mount component coupled with a top surface of the substrate, where the component includes side surfaces and a bottom surface, and the bottom...
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6552436 |
Semiconductor device having a ball grid array and method therefor
A semiconductor device ( 50 ) includes a semiconductor die ( 52 ) having electronic circuitry that is connected to a substrate ( 54 ). The substrate ( 54 ) is used to interface the semiconductor...
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6545355 |
Semiconductor device and method of fabricating the same
An adhesion layer made from Al film or Ti film is formed on Cu electrode pad portions as external connection terminals of a Cu interconnection layer of an LSI formed on the surface layer of a...
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