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6940177 |
Semiconductor package and method of preparing same
A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at...
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6940168 |
Enhanced pad design for substrate
A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of...
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6940167 |
Variable cross-section plated mushroom with stud for bumping
An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the...
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6936923 |
Method to form very a fine pitch solder bump using methods of electroplating
A new method and processing sequence is provided for the creation of interconnect bumps. A layer of passivation is deposited over a contact pad and patterned, creating an opening in the layer of...
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6927492 |
Solder pads and method of making a solder pad
A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and...
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6927425 |
Luminescent diode chip that is flip-chip mounted on a carrier, and method for production thereof
A luminescent diode chip for flip-chip mounting on a carrier, having a conductive substrate ( 12 ), a semiconductor body ( 14 ) that contains a photon-emitting active zone and that is joined by an...
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6927487 |
Protective device with spacer for subassemblies
A protective device is provided for subassemblies having a substrate and a component disposed thereon and needing to be protected. The component typically is a semiconductor component. The...
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6924868 |
Liquid crystal display device, method for fabricating the same, and portable telephone using the same
A liquid crystal display device comprises a liquid crystal display panel and a semiconductor integrated circuit for driving and controlling the liquid crystal display panel. The number of...
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6921979 |
Semiconductor device having a bond pad and method therefor
A bond pad ( 200 ) has a first wire bond region ( 202 ) and a second wire bond region ( 204 ). In one embodiment, the first wire bond region ( 202 ) extends over a passivation layer ( 18 ). In an...
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6919643 |
Multi-chip module semiconductor devices
In a multi-chip module semiconductor device ( 1 ), at least one first semiconductor die ( 20 ) is mounted on the base portion ( 11 ) of a lead-frame ( 10 ). A flip chip IC die ( 30 ) is mounted by...
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6919644 |
Semiconductor device manufacturing method and semiconductor device manufactured thereby
A method of manufacturing a semiconductor device involves mounting a semiconductor chip, formed on top with a main electrode and a subelectrode smaller in area than the main electrode, on a die pad...
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6919137 |
High-strength solder joint
A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder...
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6913948 |
Partially captured oriented interconnections for BGA packages and a method of forming the interconnections
A Ball Grid Array package having an increased fatigue life and improved conductive pad adhesion strength, as well as providing sufficient wiring space within the package, is disclosed. In...
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6909194 |
Electronic assembly having semiconductor component with polymer support member and method of fabrication
A semiconductor component includes a substrate, bonding pads on the substrate, and external contacts bonded to the bonding pads. Exemplary external contacts include solder balls, solder bumps,...
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6905954 |
Method for producing a semiconductor device and corresponding semiconductor device
The present invention provides a method for producing a semiconductor device, with the steps of: applying an interconnect level ( 11, 12 ) to a semiconductor substrate ( 10 ); structuring the...
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6906425 |
Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
An assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface mounted electronic device facing the printed circuit...
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6906417 |
Ball grid array utilizing solder balls having a core material covered by a metal layer
A ball grid array for a flip-chip assembly. The ball grid array includes a plurality of bumps bonded between an active surface of a semiconductor die and a top surface of a printed circuit board or...
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6906427 |
CONDUCTIVE PARTICLES AND METHOD AND DEVICE FOR MANUFACTURING THE SAME, ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE CONNECTION STRUCTURE, AND ELECTRONIC CIRCUIT COMPONENTS AND METHOD OF MANUFACTURING THE SAME
An electrical connection is formed by using a double laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle by electroless...
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6897567 |
Method of making wireless semiconductor device, and leadframe used therefor
A method of making a semiconductor device is provided. The method includes the following steps. First, a semiconductor chip is mounted on a lower conductor, with first solder material applied...
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6894390 |
Soft error resistant semiconductor device
A semiconductor device comprises a material layer adapted to efficiently stop alpha particles that are substantially generated within a solder bump of a flip chip device. The materials used for...
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6894378 |
Electronic component with stacked semiconductor chips
An electronic component with at least two stacked semiconductor chips is described. The chips are respectively mounted on a wiring board. The wiring boards are stacked one on top of the other and...
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6891274 |
Under-bump-metallurgy layer for improving adhesion
An under-bump-metallurgy layer is provided. The under-bump-metallurgy layer is formed over the contact pad of a chip and a welding lump is formed over the under-ball-metallurgy layer. The...
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6888242 |
Color contacts for a semiconductor package
The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal...
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6879041 |
Semiconductor device with joint structure having lead-free solder layer over nickel layer
The impact strength resistance of a solder joint portion of a semiconductor device is improved. The semiconductor device has a joint structure wherein a jointing layer which does not contain sulfur...
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6879048 |
Glass frit wafer bonding process and packages formed thereby
A method of glass frit bonding wafers to form a package, in which the width of the glass bond line between the wafers is minimized to reduce package size. The method entails the use of a glass frit...
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6873056 |
Electrode-to-electrode bond structure
A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin...
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6870267 |
Off-center solder ball attach assembly
A connection component includes a dielectric element having a first surface and a second surface, and conductive pads on the first surface of the dielectric element, each conductive pad having a...
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6867503 |
Controlling interdiffusion rates in metal interconnection structures
A metal interconnection structure for semiconductor chips has a metal interface layer ( 105 ), preferably nickel, deposited over the metal of the chip contact pad ( 104 , usually aluminum or...
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6867504 |
Method and apparatus for printed circuit board pads with registering feature for component leads
A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component...
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6861750 |
Ball grid array package with multiple interposers
Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted to a first surface of a first stiffener. A peripheral edge portion of a second...
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6861740 |
Flip-chip die and flip-chip package substrate
A flip-chip die and a flip-chip package substrate. The flip-chip die has an active surface containing a plurality of core power/ground pads, at least one signal pad rings, at least one power pad...
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6861745 |
Method and apparatus for conducting heat in a flip-chip assembly
A method and apparatus for thermally conducting heat from a semiconductor device, namely, a flip-chip assembly. In one embodiment, a heat sink, such as a diamond layer having openings therein, is...
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6853087 |
Component and antennae assembly in radio frequency identification devices
Permanent physical and electrical attachment of electrically conductive contacts of a first component in a RFID device, such as a smart card or smart inlay, is made to the electrically conductive...
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6853091 |
Printed circuit board and soldering structure for electronic parts thereto
A printed circuit board having circuit patterns printed thereon has a plurality of composite lands each including a first land having a terminal hole formed at its center for inserting the terminal...
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6844626 |
Bond pad scheme for Cu process
A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second...
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6841869 |
Electronic package assembly
An electronic package assembly includes a number of semiconductor devices with first and second sides. A printed circuit substrate has a number of printed circuit patterns bonded to conductive pads...
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6836018 |
Wafer level package and method for manufacturing the same
A thermal-stress-absorbing interface structure is provided between a semiconductor integrated circuit chip and a surface-mount structure. The interface structure comprises an elongated...
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6833611 |
Semiconductor device
A semiconductor device mainly comprises a chip disposed on the upper surface of a substrate. The upper surface of the substrate is provided with a ground ring, a power ring, and a plurality of...
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6831360 |
Semiconductor device having an elastic resin with a low modulus of elasticity
A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on...
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6828677 |
Precision electroplated solder bumps and method for manufacturing thereof
A solder bump structure for use on a substrate. The solder bump structure includes a multilayer underbump metallization having a major upper surface with a solder wetable caplayer for contacting a...
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6819002 |
Under-ball-metallurgy layer
An under-ball-metallurgy layer between a bonding pad on a chip and a solder bump made with tin-based material is provided. The under-ball-metallurgy layer at least includes an adhesion layer over...
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6815834 |
Electronic part
An electronic component includes an electronic element and a substrate to which the electronic element is mounted, the electronic element and the substrate being electrically or mechanically...
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6815808 |
Hollow airtight semiconductor device package
The present invention comprises a first main face ( 22 a ) on the surface side of a substrate ( 21 a ). An island portion ( 26 ) is formed on the first main face ( 22 a ) and a semiconductor chip (...
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6812570 |
Organic packages having low tin solder connections
An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine...
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6809413 |
Microelectronic device package with an integral window mounted in a recessed lip
A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a...
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6806578 |
Copper pad structure
A structure (and method) for a metallurgical structure includes a passivation layer, a via through the passivation layer extending to a metal line within the metallurgical structure, a barrier...
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6800944 |
Power/ground ring substrate for integrated circuits
A substrate ( 110 ) for an unpackaged integrated circuit (IC) chip ( 118 ). The substrate comprises an insulative material ( 112 ), a plurality of contacts ( 114 ) disposed thereon, and a...
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6798667 |
Solder ball collapse control apparatus and method thereof
A solder ball collapse control apparatus and method thereof includes a plurality of first solder members, pieces of solder material in a shape capable of being used to properly create a solder...
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6798078 |
Power control device with semiconductor chips mounted on a substrate
A semiconductor device for power control includes a substrate made of aluminum. Lands of copper are formed on the substrate. Semiconductor chips, such as FETs, are mounted on the lands. The...
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6791199 |
Heat radiating semiconductor device
AS conductive patterns 11 A to 11 D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for...
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