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7375434 |
Semiconductor chip with flexible contacts at a face
The present invention relates to a semiconductor chip comprising a semiconductor element, at least a conducting line and a contact area being arranged on the semiconductor element, the conducting...
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7375431 |
Solder bump formation in electronics packaging
A polymer stencil is applied to the active surface of a wafer. The stencil has openings that at least partially overlay associated metallization pads on the wafer and divider strips positioned...
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7375429 |
Integrated circuit component and mounting method thereof
Disclosed are an integrated circuit component capable of simply mounting at low cost a chip part which adjusts impedance of wiring patterns as well as capable of effectively reducing switching...
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7373033 |
Chip-to-chip optical interconnect
A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic...
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7372167 |
Semiconductor device and method of manufacturing semiconductor device
A semiconductor device according to claim 1, wherein A method of manufacturing a semiconductor chip the carrier substrate A semiconductor device includes; a carrier substrate in which a...
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7372153 |
Integrated circuit package bond pad having plurality of conductive members
An integrated circuit package bond pad includes an insulating layer and an electrode located over the insulating layer. The electrode has a first surface configured to be bonded to external...
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7368815 |
Semiconductor device which prevents light from entering therein
A CSP type semiconductor device protects a circuit from the influences exerted by an external light on a circuit. In the CSP type semiconductor device, a light-shielding material, such as a...
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7368824 |
Diffusion solder position, and process for producing it
A diffusion solder position between two parts has intermetallic phases formed by two solder components. Nanoparticles of a filler material are three-dimensionally distributed in its diffusion...
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7364943 |
Method of bonding a microelectronic die to a substrate and arrangement to carry out method
A method and an arrangement to bond a die to a substrate of a die-substrate combination to form a microelectronic package. The method comprises: providing the die-substrate combination including a...
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7358608 |
Semiconductor device having chip size package with improved strength
The present invention provides a semiconductor device wherein a passivation film, an insulating film and an encapsulating layer are formed, in this order, on the surface of a semiconductor...
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7355280 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad...
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7351649 |
Recording head unit and method of producing the same
A method of producing a recording head unit including: (A) a recording head including: a plurality of recording elements; and an actuator unit including a plurality of individual electrodes which...
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7345369 |
Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same
A semiconductor device includes: a base member; a solder layer; and a semiconductor chip disposed on the base member through the solder layer. The chip has an in-plane temperature distribution when...
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7335995 |
Microelectronic assembly having array including passive elements and interconnects
A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are...
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7332817 |
Die and die-package interface metallization and bump design and arrangement
A die metallization and bump design/arrangement, and a die-package interface metallization and bump design/arrangement are described herein.
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7317258 |
Thermal interface apparatus, systems, and fabrication methods
An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.
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7315085 |
Ball grid array package and method thereof
A ball grid array package includes a substrate, a chip, a plurality of pads, a solder mask, a plurality of partitioning walls, and a plurality of solder balls. The substrate has an upper surface...
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7312533 |
Electronic component with flexible contacting pads and method for producing the electronic component
An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the...
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7309647 |
Method of mounting an electroless nickel immersion gold flip chip package
A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex...
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7307352 |
Semiconductor package having changed substrate design using special wire bonding
A semiconductor package utilizing an existing substrate regardless of the change of the semiconductor chip design, and manufacturing method thereof are provided. The semiconductor package including...
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7304391 |
Modified chip attach process and apparatus
A method of packaging a die includes reflowing the solder to electrically connect the die to a substrate at a first temperature, cooling the die and substrate to a second temperature, and placing a...
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7301244 |
Semiconductor device
A semiconductor device should have a structure that allows locating electronic components in a region under a bonding pad. The semiconductor device includes a bonding pad constituting the external...
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7294928 |
Components, methods and assemblies for stacked packages
A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both...
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7294929 |
Solder ball pad structure
An interconnect structure a substrate, a contact pad disposed over a surface of the substrate, and an insulative mask disposed over the contact pad. The insulative mask can include an opening that...
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7294389 |
Microstructure array and a microlens array
In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of...
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7291900 |
Lead frame-based semiconductor device packages incorporating at least one land grid array package
A lead frame-based semiconductor device package including at least one land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the...
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7291922 |
Substrate with many via contact means disposed therein
A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner...
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7279795 |
Stacked die semiconductor package
In one embodiment, the present invention includes a semiconductor package including a first semiconductor die with first active circuitry and a second semiconductor die with second active...
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7279784 |
Semiconductor package
A semiconductor package mainly includes a semiconductor chip and a plurality of L-shaped leads arranged at the periphery of the semiconductor chip. Each of the L-shaped leads has an inner lead...
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7276801 |
Designs and methods for conductive bumps
Methods, techniques, and structures relating to die packaging. In one exemplary implementation, a die package interconnect structure includes a semiconductor substrate and a first conducting layer...
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7274088 |
Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof
A flip-ship semiconductor package with a lead frame as a chip carrier is provided, wherein a plurality of leads of the lead frame are each formed with at least a dam member thereon. When a chip is...
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7271484 |
Substrate for producing a soldering connection
A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that...
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7271482 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a...
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7268069 |
Method of fabricating semiconductor device having multilayer wiring structure
A method of fabricating a semiconductor device includes forming a lower wiring layer on a semiconductor substrate, forming an interlayer insulating film on the lower wiring layer, layer, forming a...
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7268438 |
Semiconductor element including a wet prevention film
A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package...
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7267861 |
Solder joints for copper metallization having reduced interfacial voids
A metal interconnect structure ( 100 ) comprising a bond pad ( 101 ), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction,...
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7262513 |
Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
A method and apparatus for making pad structures suitable for wirebonding and, optionally, also for solder-ball connections. Some embodiments include an electronics chip having a substrate with...
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7259465 |
Semiconductor device with lead-free solder
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the...
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7259457 |
Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second...
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7256117 |
Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
A method of reducing a likelihood that a die pad will be delaminated from a die in an integrated circuit die package for a structure design during an attachment of a heat sink member to the die pad...
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7256501 |
Semiconductor device and manufacturing method of the same
In a semiconductor device having a package structure in which lead terminals connected to electrodes on both of the upper and lower surfaces of a semiconductor chip are exposed from both of the...
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7256496 |
Semiconductor device having adhesion increasing film to prevent peeling
A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting...
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7245024 |
Electronic assembly with reduced leakage current
An electronic assembly includes a substrate and at least one surface mounted electronic component. The substrate includes a first side and a second side opposite the first side. The first side of...
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7245023 |
Semiconductor chip assembly with solder-attached ground plane
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, a solder joint and a ground plane. The...
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7245025 |
Low cost bonding pad and method of fabricating same
A structure and a method of forming the structure. The structure including: an integrated circuit chip having a set of wiring levels from a first wiring level to a last wiring level, each wiring...
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7242097 |
Electromigration barrier layers for solder joints
A microelectronic package is disclosed including a microelectronic device, a substrate, and a signaling path coupling the microelectronic device with the substrate. The signaling path includes a...
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7239027 |
Bonding structure of device packaging
A bonding structure of device packaging includes a first substrate and a second substrate. The surfaces of the first substrate have metal pads and a first bonding layer connected to the second...
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7239025 |
Selective deposition of solder ball contacts
Methods of forming solder ball contacts having dimensions of approximately 2.5 microns in diameter for use in C4-type connections. The methods form solder ball contacts using selective deposition...
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7239023 |
Package assembly for electronic device
A buffer layer is formed on a substrate and then electronic devices are packed on the buffer layer in the present invention, and problems of lower hermeticity and complex process in the...
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7235871 |
Stacked microelectronic dies
An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device...
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