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5075965 |
Low temperature controlled collapse chip attach process
A controlled collapse chip connect method of joining an IC chip to a microelectronic circuit card. According to the method an inhomogeneous, anisotropic column of solder is deposited from a Pb/Sn...
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5069626 |
Plated plastic castellated interconnect for electrical components
A plated plastic castellated interconnect comprises a substrate made from a molded polymeric material and having top and bottom surfaces with a plurality of separate mutually spaced apart...
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5060027 |
Light emitting diode array with aligned solder bumps
A close-spaced diode array in which connection to driver circuitry is enabled by application of a flip-chip solder bonding technique. Not only does this allow dense packing, high pixel content to...
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5051811 |
Solder or brazing barrier
A method of preparing a substrate such as a semiconductor chip or ceramic thin film having vias for soldering to a substrate requires that a first metal that is resistive to solder bonding be...
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5048744 |
Palladium enhanced fluxless soldering and bonding of semiconductor device contacts
The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide...
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5023697 |
Semiconductor device with copper wire ball bonding
A semiconductor device in accordance with the present invention includes a semiconductor chip which is bonded to a die pad using a solder having a liquidus temperature of 370° C. or less. A copper...
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5022580 |
Vernier structure for flip chip bonded devices
A flip-chip solder bonding structure having first and second components. Each component is made from a substrate haivng on one surface an array of solderable pads. Selected pads have solder bumps...
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5010387 |
Solder bonding material
Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight...
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5001829 |
Method for connecting a leadless chip carrier to a substrate
A Leadless Chip Carrier (LCC) is mounted on a circuit board on elongated solder posts to provide clearance between the LCC and the board. The process for producing solder posts involves the...
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4970570 |
Use of tapered head pin design to improve the stress distribution in the braze joint
The present invention teaches a structure for reducing the stresses created on a substrate and on the bonding surface at which a connector is attached. The connector has a tapered or beveled head...
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4960436 |
Radiation or light detecting semiconductor element containing heavily doped p-type stopper region
A radiation or light detecting semiconductor element comprises a p-type monocrystalline silicon substrate having a high specific resistance of about 10,000 ohm-cm, a stopper layer formed in a part...
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4947238 |
Submount for semiconductor laser element
A submount for a semiconductor laser element includes a substrate and a barrier layer disposed on opposed surfaces of the substrate and including a plurality of layers wherein the outermost layer...
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4922322 |
Bump structure for reflow bonding of IC devices
In a semiconductor device tape assembly bonding process the fingers of a copper tape are reflow soldered to metal bumps located on the semiconductor device. First, the semiconductor wafer is...
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4872049 |
Encapsulated low-noise ultra-high frequency semiconductor device
An ultra-high frequency transistor is mounted in a hermetically sealed package in order to be made usable and in order to improve its performance characteristics to the optimum level. To diminish...
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4769744 |
Semiconductor chip packages having solder layers of enhanced durability
Solder layers in a semiconductor chip package, which electrically interconnect conductors used to gain electrical access to the electrodes on the semiconductor chip, are subjected to a transverse...
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4724473 |
Micropackage for encapsulating an electronic component
A micropackage (1) for encapsulating an electronic component (5), includes a body fitted with a plurality of external connection tabs (2) which pass underneath the body (at 3) and which terminate...
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H000434 |
Contacts to III-V semiconductors
A contact structure and method of bonding III-V semiconductors which prevents shorting of the edges of the semiconductor chip and also allows the chip to be bonded with either major surface facing...
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4709253 |
Surface mountable diode
A surface mountable bipolar zener diode includes first and second semiconductor elements, each of which defines a respective p-n junction near a respective inner face, and each of which defines a...
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4707724 |
Semiconductor device and method of manufacturing thereof
A nickel-alloy layer is formed on a lead frame made of a material which consists chiefly of copper as a base material, a pellet is then mounted, and a resin is applied thereto to form a package....
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4697204 |
Leadless chip carrier and process for fabrication of same
A leadless chip carrier is constructed in such a manner that each of the electrode terminals is made to be recessed from the insulation layer of the bottom surface of the carrier so as to have a...
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4673967 |
Surface mounted system for leaded semiconductor devices
An improved surface mounted system for leaded semiconductor devices has J-shaped device leads soldered to respective portions of circuit pads on a printed circuit board, each lead having inner and...
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4635093 |
Electrical connection
An improved electrical connection between a leadless chip carrier and one or more circuits on a printed circuit board is disclosed. A solder fillet connects a metallization layer on the groove face...
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4604644 |
Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
An improved solder interconnection for forming I/O connections between an integrated semiconductor device and a support substrate having a plurality of solder connections arranged in an area array...
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4577398 |
Method for mounting a semiconductor chip
A method of attaching a semiconductor chip to a mounting surface is disclosed. A solder barrier is applied to the mounting surface, and a preform of solder is located within the solder barrier. The...
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4574297 |
Encapsulated semiconductor with terminals having tabs to increase solder wetting
A semiconductor device encapsulated within a plastic housing facilitates attachment to a circuit board when a dip soldering process is used. Terminal leads from the semiconductor device extend...
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4554575 |
Low stress leadless chip carrier and method of assembly
A leadless integrated circuit chip carrier apparatus and method of assembly to a printed circuit board. A plurality of castellations are provided in the perimeter walls of the carrier member and...
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4503597 |
Method of forming a number of solder layers on a semiconductor wafer
A method of forming a number of discrete solder layers on a semiconductor wafer of a large area. A number of regions which are easy to be wetted with solder are formed on one of the major surfaces...
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4479140 |
Thermal conduction element for conducting heat from semiconductor devices to a cold plate
A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cover positioned in close proximity to the bridge element has an axially...
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4437228 |
Method of mounting a silicon pellet on a ceramic substrate
A semiconductor device in which a silicon pellet is mounted on a ceramic substrate by means of a glass material of low melting point. To prevent the silicon pellet from being destroyed under...
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4417267 |
Cooling means for semiconductor device
A cooling means for a semiconductor device comprises a heat radiating plate made of aluminum or aluminum alloy, having a fitting part for a semiconductor device; an alloy layer formed only at said...
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4407006 |
Spiral strip brushlike stress buffering power semiconductor contacts
A large area semiconductor disk, wherein in order to be able to connect, for example, by soldering, welding or diffusion-bonding the semiconductor disk with copper disks serving for the heat...
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4335362 |
Semiconductor device and a method of contacting a partial region of a semiconductor surface
A semiconductor device comprising, a plurality of semiconductor layers having an outer semiconductor layer, and a contact layer uniformly and entirely covering said outer semiconductive layer and...
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4290079 |
Improved solder interconnection between a semiconductor device and a supporting substrate
A ball limiting metallurgy pad structure for a semiconductor device solder bond interconnection comprising: a conductive layer that is adherent to the semiconductor device passivating layer, ...
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4271584 |
Method of attaching LED chip to a header
A method of fabricating light emitting diodes to prevent degradation caused y thermally induced stress. A voltage is applied across the chip to cause it to bend to a prestressed condition while it...
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4219827 |
Integrated circuit with metal path for reducing parasitic effects
An integrated circuit comprises a semiconductor body with a metal path running at least partially on the component side surface of the semiconductor body itself. The invention also includes the...
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4210389 |
Bond and method of making the same
A solid state laser rod and a mount through which heat is dissipated from the rod are joined together at a bond comprised of a reflective layer on the surface of the rod, a barrier layer over the...
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4210926 |
Intermediate member for mounting and contacting a semiconductor body
An intermediate carrier with several contact fingers is disclosed for the support and contacting of a semiconductor member. The contact fingers have an outer contact and an inner contact. An inner...
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4171528 |
Solderable zener diode
A solderable zener diode adapted for mounting in a package of the type wherein leads or electrodes must be soldered to the diode contact pads has a shallow junction region formed by a controlled...
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4074299 |
Light-emitting diode element and device
A light-emitting diode element comprises a semiconductor wafer including a pair of a p-type semiconductor region and an n-type semiconductor region forming a pn junction, an inclined first...
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4055725 |
Circuit board assembly
Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the...
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3997910 |
Semiconductor device with solder conductive paths
In devices including a body of semiconductor material having layers of solder on a surface thereof serving as current connectors, flow of solder from the layers to terminal leads soldered to the...
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3964157 |
Method of mounting semiconductor chips
Disclosed is a bonding and packaging scheme for semiconductor device chips with particular application to semiconductor monolithic display chips. The display chip is bonded face down in a recess...
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3959522 |
Method for forming an ohmic contact
Gold is deposited onto a heated surface of N type semiconductor material composed of either gallium arsenide, gallium phosphide, aluminum gallium arsenide or aluminum gallium phosphide. The surface...
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3922385 |
Solderable multilayer contact for silicon semiconductor
A multilayer solderable low resistance contact for N-type and P-type regions on a semiconductor body comprising an aluminum layer directly on the semiconductor body, and a nickel alloy layer on the...
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3919709 |
Metallic plate-semiconductor assembly and method for the manufacture thereof
Disclosed is a semiconductor assembly and a method for the manufacture thereof. The assembly includes a wafer of semiconductive material that defines two substantially parallel major surfaces and...
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3887760 |
Layer circuit with at least one solder platform for the soldering on of semiconductor modules
A layer circuit arranged to receive semiconductor modules by soldering, the circuit having at least one conductor path extending therealong with a solder platform at one end of the conductor path....
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3871015 |
FLIP CHIP MODULE WITH NON-UNIFORM CONNECTOR JOINTS
The interconnecting joints between a semiconductor chip and a substrate are not uniform, but differ in shape or material. The difference results in different abilities to withstand shear stress and...
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3871014 |
FLIP CHIP MODULE WITH NON-UNIFORM SOLDER WETTABLE AREAS ON THE SUBSTRATE
The interconnecting joints between a semiconductor chip and a substrate are non-uniform in shape. The joints are solder and have varying shapes due to varying sizes of the solder wettable regions...
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3831066 |
HERMETICALLY SEALED SEMICONDUCTOR DEVICE WITH CORROSION INHIBITED FERROUS METAL PORTIONS
Semiconductor devices hermetically sealed within metal cases formed, at least in part, of laminated or clad ferrous metal are subject to corrosion of the exposed portions of the ferrous metal. The...
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3786556 |
MOUNTING SEMICONDUCTOR BODIES
Method of securing a semiconductor body to a support surface comprising steps of placing semiconductor body face in contact with surface with at least one solder body on the surface and spaced...
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