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5512786 |
Package for housing semiconductor elements
A package for housing semiconductor elements including an insulating base which consists of electrical insulation material, and has a mounting portion that mounts semiconductor elements on the...
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5508562 |
Outer electrode structure for a chip type electronic part appropriate for reflow soldering
A chip type electronic part has an outer electrode structure appropriate mainly for reflow soldering. An outermost layer of the outer electrode, provided at both end portions of the chip type...
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5491364 |
Reduced stress terminal pattern for integrated circuit devices and packages
A terminal pattern is provided for an integrated circuit device, such as a ball grid array package or an integrated circuit flip chip. The terminal pattern is composed of a number of terminals...
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5490040 |
Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
An electrical device for logic circuits having a package comprising a combination of controlled collapse electrical interconnections, such as solder balls and pin through-hole conductors, wherein...
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5483105 |
Module input-output pad having stepped set-back
A ceramic substrate pad used for establishing brazed connection between a pin and the substrate in the packaging of microelectronic semiconductor circuit chip. The pad is characterized by a stepped...
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5480835 |
Electrical interconnect and method for forming the same
A method for forming an electrical interconnect on a substrate. At least one pad (14) is formed on a substrate (11). The pad (14) is formed having a non-wetting surface (12) and a wettable surface...
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5477087 |
Bump electrode for connecting electronic components
The present invention relates to connecting electronic components using bump electrodes to connect electronic components such as semiconductors with the patterning electrodes of a circuit board. In...
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5471092 |
Metallurgical joint including a stress release layer
A metallurgical joint structure between two workpieces to be joined by soldering or brazing includes a stress release layer of a low yield point metal, preferably silver, gold, copper, palladium or...
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5471090 |
Electronic structures having a joining geometry providing reduced capacitive loading
Electrical interconnection structures are described. The electrical interconnection structures are formed by electrically interconnecting in a stack a plurality of discrete substrates. By using a...
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5463255 |
Semiconductor integrated circuit device having an electrode pad including an extended wire bonding portion
Disclosed is a semiconductor integrated circuit device with an electrode pad having a lower conductive film (second aluminum film) formed on a semiconductor substrate, an upper conductive film...
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5450289 |
Semiconductor package and a printed circuit board applicable to its mounting
An arrangement for vertically mounting a semiconductor device to a substrate, e.g., a printed circuit board (PCB), in which a plurality of sequentially arranged external leads of the semiconductor...
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5448114 |
Semiconductor flipchip packaging having a perimeter wall
A semiconductor device contains a semiconductor chip and a circuit board. The chip has a first surface at which the main region is formed. On the surface, a plurality of chip electrodes and a...
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5447886 |
Method for mounting semiconductor chip on circuit board
In mounting a semiconductor chip on a circuit board by a flip chip bonding method, an improved mounting method holds the circuit with a warp prevention device, on which the semiconductor chip is...
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5446625 |
Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface
A chip carrier (20) includes a substrate (11) having a first copper pattern (12) deposited on a first surface (13), and a second copper pattern (14) deposited on a second surface (16). The second...
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5442236 |
Semiconductor device having a multilayered wiring structure with dummy wiring
The present invention is characterized in that a dummy wiring is provided between wirings constituting a multi-layered wiring, when an electric connection is prepared between wirings disposed in...
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5418688 |
Cardlike electronic device
An electronic device (100) comprises a first substrate (102) having a first circuit pattern disposed thereon which is selectively processed to provide pretinned connection pads (108, 116, 124, 132,...
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5414303 |
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.
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5406458 |
Printed circuit board having tapered contact pads for surface mounted electrical components
A printed circuit board (23) having a plurality of solder coated contact pads (24, 26) for the surface mounting of electrical components (10 1 ) thereon. Each pad (24, 26) has a rectangular portion...
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5397921 |
Tab grid array
A TAB Grid Array (TGA) pack package for an integrated circuit. A TGA package provides an efficient structure and method to connect a semiconductor die encapsulated in the TGA package to an external...
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5381307 |
Self-aligning electrical contact array
A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the...
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5379189 |
Electrical assemblies
An electrical circuit has a substrate and a surface mount capacitor having a connector pad at each end. The substrate has two separate contact pads that are both soldered to the same connector pad...
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5378926 |
Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal nitride barrier layer to block migration of tin through via holes
A gallium arsenide monolithic microwave integrated circuit (MMIC) chip (12) has microelectronic devices (16, 18) formed on a frontside surface (12a), and via holes (12c, 12d) formed through the...
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5367435 |
Electronic package structure and method of making same
An electronic package and method of making same wherein a flexible circuitized substrate is used to interconnect contact sites on a semiconductor device (chip) to respective conductors on a...
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5363277 |
Structure and method for mounting semiconductor device
The structure and method for mounting a semiconductor device, in which a wiring pattern 2 on a circuit substrate 1 and projection electrodes 5 of an integrated circuit 4 are made to be in...
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5352629 |
Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules
A method for attaching a chip to a substrate includes providing the substrate with an outer layer of an electrical conductor which is not wettable by solder and which has a window exposing an inner...
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5349495 |
System for securing and electrically connecting a semiconductor chip to a substrate
A system for securing and electrically connecting a semiconductor chip to a body of passive substrate. The semiconductor chip and the substrate are both provided with bonding pads or bonding areas....
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5347162 |
Preformed planar structures employing embedded conductors
An interposer (preformed planar structure) is disposed between a die and a substrate (which may be another die). Through holes in the interposer facilitate controlled formation of reflow solder...
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5329160 |
Semiconductor package with metalized portions
In a semiconductor package in which a cover and a substrate are combined with each other in a sealed state, metallized portions consisting of a material of a high solder wettability are provided on...
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5329158 |
Surface mountable semiconductor device having self loaded solder joints
An improved semiconductor device is disclosed having a predetermined amount of solder, or other electrically conductive binder adsorbed onto the exterior package leads of the semiconductor device....
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5327013 |
Solder bumping of integrated circuit die
A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a...
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5324890 |
Direct bond copper-output footprint
The invention includes a flat, planar, single piece copper footprint including a first portion for mounting an aluminum bond pad, and a third portion for mounting a semi-conductor device, and a...
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5316788 |
Applying solder to high density substrates
Process is described for applying large quantities of solder to small areas, such as the lands in a high density card, to which it is intended to surface mount electronic devices or directly attach...
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5313366 |
Direct chip attach module (DCAM)
A low cost Surface Mount Carrier (SMC) for carrying integrated circuit chips mounted thereon. The carrier, or interposer, is a thin-small single layer or, a multi-layer deck of printed circuit...
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5311399 |
High power ceramic microelectronic package
A microelectronic package comprising a ceramic substrate (22) having a first surface bonded to a metal heat sink (25) and a second surface (30) opposite said first surface and having at least one...
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5311402 |
Semiconductor device package having locating mechanism for properly positioning semiconductor device within package
A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an...
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5283446 |
Compact optical semiconductor module capable of being readily assembled with a high precision
In an optical semiconductor module having an optical semiconductor chip mounted on a substrate through a plurality of solder bumps each of which has a predetermined height and which is formed by...
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5276289 |
Electronic circuit device and method of producing the same
The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate...
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5239198 |
Overmolded semiconductor device having solder ball and edge lead connective structure
A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a...
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5220200 |
Provision of substrate pillars to maintain chip standoff
Pillars are formed on a substrate at the same time as electrical circuit components are formed thereon and of the same materials used to form the circuit, the pillars serving to maintain standoff...
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5198695 |
Semiconductor wafer with circuits bonded to a substrate
A bonded structure is described consisting of a semiconductor wafer, preferably gallium arsenide, soldered to a substrate material. A method for forming the structure is also described. The...
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5194930 |
Dielectric composition and solder interconnection structure for its use
Composition and solder interconnection structure for its use, wherein the gap created by solder connections between a carrier substrate and a semiconductor chip device mounted thereon is filled...
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5182628 |
Semiconductor device having particular solder interconnection arrangement
A semiconductor device which is resistant to cracking during a heat cycle is provided which uses a lead-tin alloy solder having a weight ratio in a range of 45/55 to 55/45 to bond an insulation...
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5148349 |
Electronic part mountable on the surface of a printed circuit board and method of mounting the same
A structure of an electronic part which may be mounted on and soldered to the surface of a printed circuit board, and a method of mounting such an electronic part. While the electronic part mounted...
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5136360 |
Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals
An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined...
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5132772 |
Semiconductor device having tape automated bonding (TAB) leads which facilitate lead bonding
A semiconductor device (20) has a plurality of TAB leads (28) which facilitate lead bonding. The device is comprised of a semiconductor die (22) having a plurality of bonding pads (24) located...
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5113239 |
Integrated device with improved connections between the pins and the semiconductor material chip
An integrated device with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components...
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5111279 |
Apparatus for isolation of flux materials in "flip-chip" manufacturing
A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be...
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5105260 |
RF transistor package with nickel oxide barrier
An improved transistor package with superior stability to wave soldering, having a nickel oxide barrier strip formed on the surface of the leads.
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5092034 |
Soldering interconnect method for semiconductor packages
A method and apparatus for attaching the outer leads of a semiconductor package (preferably a Tape Automated Bonded circuit) to the traces on a printed circuit board is described. The outer leads...
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5075965 |
Low temperature controlled collapse chip attach process
A controlled collapse chip connect method of joining an IC chip to a microelectronic circuit card. According to the method an inhomogeneous, anisotropic column of solder is deposited from a Pb/Sn...
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