Matches 551 - 600 out of 773 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >
Match Document Document Title
6084308 Chip-on-chip integrated circuit package and method for making the same  
A chip-on-chip integrated circuit package is disclosed. The device includes a substrate having a plurality of conductive landings disposed on a first surface thereof, a first die that is positioned...
6084310 Semiconductor device, lead frame, and lead bonding  
In a semiconductor device, each of a plurality of leads has a chip mounting portion electrically connected to the semiconductor chip through a bump and a lead main body supporting the chip mounting...
6078514 Semiconductor device and semiconductor system for high-speed data transfer  
A semiconductor system includes at least one logic chip and at least one memory chip arranged such that one side of the at least one memory chip faces one side of the at least one logic chip. The...
6071800 Electronic device and manufacturing method thereof  
An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the...
6046499 Heat transfer configuration for a semiconductor device  
Disclosed is a semiconductor package having: a semiconductor chip; a package substrate; a wire connected to the semiconductor chip; and an electric connection member formed on the package substrate...
6037667 Socket assembly for use with solder ball  
A socket assembly for removably receiving a solder ball of a chip package and methods for forming the same. The socket assembly is a raised construction formed over a substrate and includes a...
6018196 Semiconductor flip chip package  
A semiconductor flip chip package is provided having a semiconductor flip chip integrated circuit device and a laminated substrate. The laminated substrate has a conductive core and at least one...
6018197 Wired board with improved bonding pads  
A wired ceramic board has on a main surface of a ceramic substrate thereof a plurality of bonding pads each of which has a projection having a solderable outer surface and positioned inside an...
6011314 Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps  
An integrated circuit redistribution structure. The integrated circuit redistribution structure includes a plurality of conductive pads located on an active side of an integrated circuit. The...
6011313 Flip chip interconnections on electronic modules  
A device which utilizes flip chip technology to provide interconnection between printed circuit boards and integrated circuits is disclosed. The method involves metallization of the bond pad and...
6008542 Semiconductor device having long pads and short pads alternated for fine pitch without sacrifice of probing  
An integrated circuit fabricated on a semiconductor chip is electrically connected through an array of pads to leads of a package; the pad array includes long pads exposed to first partially...
6008543 Conductive bumps on pads for flip chip application  
A semiconductor device including a semiconductor element having a plurality of pads, and a method of manufacturing the semiconductor device. The semiconductor element includes a plurality of wiring...
5990565 Flip chip package  
The invention is related to a new technology for improving a flip chip package. It is characterized by that at least one pad and at least one lead are formed on the surface of one side of a chip,...
5986338 Assembly of semiconductor device  
A semiconductor wafer having one or more pad electrodes is joined to a reinforcing insulator plate formed with a plurality of through holes. On both sides of the reinforcing plate, there are formed...
5982038 Cast metal seal for semiconductor substrates  
The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method...
5977633 Semiconductor device with metal base substrate having hollows  
In the manufacture of a semiconductor device, an insulator film is attached to the back surface of a metal base substrate, and over the insulator film a wiring pattern is formed. A silicon chip is...
5973404 Underfill of bumped or raised die using a barrier adjacent to the sidewall of semiconductor device  
A method and apparatus for attaching a semiconductor device to a substrate. One end of the substrate is elevated to position the substrate and the coupled semiconductor device on an inclined plane....
5965944 Printed circuit boards for mounting a semiconductor integrated circuit die  
The present invention provides printed circuit boards for mounting to a semiconductor integrated circuit die. In one embodiment the printed circuit boards comprise a rigid dielectric substrate...
5965945 Graded PB for C4 pump technology  
An improved solder bump composition and method advantageously employs a thin low-alpha layer of lead (Pb) deposited in close proximity to alpha particle sensitive devices, while ordinary (i.e., low...
5965947 Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads  
In a semiconductor package which includes a plurality of semiconductor chips of different kinds, some of the chips are bonded to die bonding pad by means of a conductive adhesive, while the other...
5959352 Chip arrangement and method of producing the same  
A chip arrangement has a first chip, a connecting device and at least a second chip or a substrate. The connecting device has a plurality of individual, spaced diamond parts which are arranged...
5939786 Uniform plating of dendrites  
The present invention provides uniform dendrites, on circuit features instead of large, elongated dendrites along the edges of the circuit features. The dendrites are formed by a method comprising...
5939778 Integrated circuit chip package  
A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is...
5936309 Mounted structure of printed circuit board in semiconductor package  
A mounted structure of printed circuit board in semiconductor package, the mounted structure comprising a solder resist formed with at least more than one tunnel connecting outsides with respective...
5920123 Multichip module assembly having via contacts and method of making the same  
A multichip module includes a printed circuit printed circuit board onto which traces of electrically conductive material are formed and into which groups of plated vias are formed. Each group of...
5917707 Flexible contact structure with an electrically conductive shell  
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The...
5914536 Semiconductor device and soldering portion inspecting method therefor  
A semiconductor device includes a wiring board having a main surface and a plurality of pad electrodes formed on the main surface, a rectangular semiconductor element having a main surface facing...
5912505 Semiconductor package and semiconductor device  
A semiconductor package and a semiconductor device comprises a metal bump to be placed between a metal pad formed on a package body of a substantially plate-like shape and an interconnecting solder...
5910354 Metallurgical interconnect composite  
A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of...
5907187 Electronic component and electronic component connecting structure  
In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connecting bumps...
5900673 Low-temperature fusing brazing material, and wiring board and semiconductor device-housing package assembled with the same  
A low-temperature fusing brazing material containing 10-70% by weight of silver, 10-75% by weight of antimony, 10-50% by weight of indium and/or tin and 0-15% by weight of copper, and wiring boards...
5898223 Chip-on-chip IC packages  
The specification describes interconnection layouts for chip-on-chip packages using solder bump interchip connections as vias between a single level metal interconnection pattern on the lower...
5883425 Circuit device  
A circuit device, for example, a hybrid integrated circuit device, for improving the positioning accuracy of a frame element is disclosed. At least two thick film electrodes (7a) of circular...
5883435 Personalization structure for semiconductor devices  
The preferred embodiment of the present invention provides a structure and method for personalizing a semiconductor device in the context of a bump array connection to packaging, substrates and...
5877543 Device assembly structure with reinforced outer leads  
A highly reliable assembly structure is provided by surely reducing a stress to be exerted on leads of a TCP device. Part of a soldered portion of outer leads that is located closer to a...
5869904 Semiconductor device having a projecting electrode  
A semiconductor device comprises a plurality of solder bumps each formed on a pad of a semiconductor device. The top of each of the solder bumps is covered with a masking film, and the bases of the...
5861666 Stacked chip assembly  
An assembly of semiconductor chips has the chips vertically stacked above one another. Interposers extending between adjacent chips have compliant layers to accommodate thermal expansion of the...
5859474 Reflow ball grid array assembly  
A first array of elongate pads is formed on a first surface, such as that of an integrated circuit substrate, and a second array of elongate pads is formed on a second surface, such as that of a...
5859463 Photosensitive imager contact pad structure  
A method of forming a contact for a photosensitive element of a photosensitive imager including a common electrode separated from a bottom contact by intervening layers of an SiOx transistor...
5844308 Integrated circuit anti-bridging leads design  
An IC package design and method of making the package design that provides anti-bridging between metal leads. The anti-bridge IC package design extends bottom covercoat material out onto the leads...
5844321 Semiconductor device comprising a chip which is provided with a via opening and is soldered on a support, and method of realizing this device  
A semiconductor device comprises a chip soldered to a support. The chip comprises a semiconductor substrate, a via a ground plane on a rear surface, and an anti-adhesion layer deposited...
5844320 Semiconductor unit with semiconductor device mounted with conductive adhesive  
A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two...
5844168 Multi-layer interconnect sutructure for ball grid arrays  
A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape...
5841178 Optical component package  
Disclosed is an optical package which is economical to manufacture. An optical component, such as a PIN photodiode, is bonded to a substrate such as silicon with no metallization on its side...
5841198 Ball grid array package employing solid core solder balls  
A ball grid array package utilizes solder balls having central cores of a material with a higher melting point than solder material surrounding the core. When the ball grid package and motherboard...
5838069 Ceramic substrate having pads to be attached to terminal members with Pb-Sn solder and method of producing the same  
A ceramic substrate having on the surface thereof a plurality of pads to be attached to terminal members is provided. Each pad includes a metallic layer formed on the surface of the substrate and a...
5838072 Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes  
An integrated circuit has a supply node for supplying power to at least one intermediate node coupled to circuitry for receiving power. Rather than transmit power from the supply node to the...
5838067 Connecting device for connecting a semiconductor chip to a conductor  
A connecting device, and corresponding method, for connecting a semiconductor chip/chip and a conductor, the connecting device including: a pad formed on the chip; a passivation layer formed around...
5838070 Apparatus having a substrate and electronic circuit solder-connected with the substrate  
An electronic circuit apparatus has first and second pad electrodes arranged on a substrate to be separated by a first interval, first and second chip electrodes to be separated by a second...
5828128 Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device  
A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the...
Matches 551 - 600 out of 773 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >