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7615851 |
Integrated circuit package system
An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical...
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7615850 |
Method and device including reworkable alpha particle barrier and corrosion barrier
A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the...
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7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
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7615413 |
Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
A first semiconductor element is bonded on a substrate. A complex film formed of integrated dicing film and adhesive film is affixed on a rear surface of a semiconductor wafer which is to be second...
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7615410 |
Chip-sized flip-chip semiconductor package and method for making the same
A semiconductor package ( 10; 14 ) comprises a semiconductor die ( 2; 2′ ) with a plurality of contact areas ( 4 ) on its active surface and an electrically conductive bump ( 7 ) on each contact...
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7614888 |
Flip chip package process
A flip chip package process is provided. First, a substrate strip including at least one substrate is provided. Next, at least one chip is disposed on the substrate, and the chip is electrically...
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7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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7608921 |
Multi-layer semiconductor package
A semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base substrate and an interposer substrate mounted on top of the die. The bottom side of the...
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7608920 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
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7608789 |
Component arrangement provided with a carrier substrate
A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which...
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7605480 |
Flip chip interconnection pad layout
A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from...
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7605479 |
Stacked chip assembly with encapsulant layer
A microelectronic subassembly 210 includes a substrate 215 having a top surface 216 and at least one peripheral region 219, a microelectronic element 201 mounted over the substrate 215, ...
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7605477 |
Stacked integrated circuit assembly
A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the...
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7605459 |
Coreless substrate and manufacturing thereof
An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper...
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7605454 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
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7604152 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same
A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit...
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7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
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7602060 |
Heat spreader in a flip chip package
A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface...
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7602058 |
Flip-chip semiconductor device with improved power pad arrangement
A semiconductor device is composed of a power supply interconnection extending from a certain starting point in a first direction and also extending from the starting point in a second direction...
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7598617 |
Stack package utilizing through vias and re-distribution lines
A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof...
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7598613 |
Flip chip bonding structure
A semiconductor device is provided with: a solid device having a connection surface formed with a connection electrode projected therefrom; a semiconductor chip which has a functional surface...
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7598610 |
Plate structure having chip embedded therein and the manufacturing method of the same
A plate structure having a chip embedded therein, comprises an aluminum plate having at least one aluminum oxide layer formed on its surface, and a cavity therein; a chip embedded in the cavity,...
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7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
An electronic component has at least one semiconductor power switch with at least one anode and at least one control electrode positioned on a first surface and at least one cathode positioned on a...
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7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a...
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7592707 |
Method and apparatus for facilitating proximity communication and power delivery
One embodiment of the present invention provides a system that facilitates precise inter-chip alignment for proximity communication and power delivery. The system includes a first integrated...
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7592702 |
Via heat sink material
The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be...
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7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same
A semiconductor module includes: a plastic housing composition; at least one semiconductor chip with an active top side, a coplanar underside of the semiconductor module including the active top...
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7589414 |
I/O Architecture for integrated circuit package
A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive...
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7586188 |
Chip package and coreless package substrate thereof
A chip package includes a coreless package substrate and a chip. The coreless package substrate includes an interconnection structure and a ceramic stiffener. The interconnection structure has a...
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7586181 |
Semiconductor device and method for manufacturing
A semiconductor device and method has trenches for raising reliability. An electrode pad, with a protective film and an interlayer film which form an opening on top, are on a substrate. A rewiring...
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7582973 |
Flip-chip type assembly
A structure for sufficiently alleviating the thermal stress between an LSI and substrate and allowing the LSI to be detached from a substrate easily is provided. In a flip-chip type assembly...
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7582972 |
Semiconductor device and fabrication method thereof
A semiconductor device includes a semiconductor substrate with circuit elements and electrode pads formed on one surface. This surface is covered by a dielectric layer with openings above the...
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7579694 |
Electronic devices including offset conductive bumps
Bumping a substrate having a metal layer thereon may include forming a barrier layer on the substrate including the metal layer and forming a conductive bump on the barrier layer. Moreover, the...
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7576436 |
Structure of wafer level package with area bump
A package structure with an area bump has at least a chip (also known as a die), a redistribution layer, a plurality of first bumps (normal bumps) and at least a second bump (area bump). The...
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7576435 |
Low-cost and ultra-fine integrated circuit packaging technique
A semiconductor package structure and the methods for forming the same are provided. The semiconductor package structure includes an interposer; a first plurality of bonding pads on a side of the...
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7576434 |
Wafer-level solder bumps
In one embodiment, the present invention includes a semiconductor package having a support substrate coupled to a first semiconductor die, where the first semiconductor die includes first...
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7573720 |
Active socket for facilitating proximity communication
One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon...
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7573139 |
Packed system of semiconductor chips having a semiconductor interposer
A semiconductor system ( 200 ) of one or more semiconductor interposers ( 201 ) with a certain dimension ( 210 ), conductive vias ( 212 ) extending from the first to the second surface, with...
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7573138 |
Stress decoupling structures for flip-chip assembly
A stress decoupling structure provided underneath the under-ball-metallurgy (UBM) pads of a flip-chip bonding integrated circuit (IC) chip enhances the cyclic fatigue life of the solder joints...
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7569939 |
Self alignment features for an electronic assembly
Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the...
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7569935 |
Pillar-to-pillar flip-chip assembly
A pillar-to-pillar flip-chip assembly primarily comprises a substrate, a chip disposed on the substrate, a plurality of first copper pillars on the bonding pads of the chip, a plurality of second...
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7569924 |
Semiconductor device and manufacturing method thereof
A semiconductor chip 11 comprising an element formation layer which is formed on a first main surface 35 A of a semiconductor substrate 35 and has a semiconductor element, through electrodes ...
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7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same
A semiconductor device includes: a first semiconductor chip face-down mounted on a substrate; a second semiconductor chip face-up mounted on the first semiconductor chip; an electromagnetic...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7566961 |
Multi-stacked package and method of manufacturing the same
A multi-stacked package includes a first package, a second package and a combining member. The second package supports the first package, and is electrically connected to the first package and has...
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7566649 |
Compressible films surrounding solder connectors
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a...
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7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit
A method according to the present invention for producing a semiconductor-chip-mounting circuit 1 includes mainly three steps. In a first step, contacts 2 each in the form of a conical helix...
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7564140 |
Semiconductor package and substrate structure thereof
A semiconductor package and a substrate structure thereof are provided. A solder mask layer applied on the substrate structure is formed with outwardly extended openings corresponding to corner...
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7564139 |
Semiconductor device and method for manufacturing the same
It is an object of the present invention to provide a technique for making a semiconductor device thinner without using a back-grinding method for a silicon wafer. According to the present...
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7564131 |
Semiconductor package and method of making a semiconductor package
Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on...
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