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9074113 Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device  
The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for...
9041177 Semiconductor device with sealing resin  
Various embodiments of the present invention include a semiconductor device, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing...
9041192 Hybrid thermal interface material for IC packages with integrated heat spreader  
Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first...
9041223 Bump-on-trace (BOT) structures  
A bump-on-trace (BOT) structure is described. The BOT structure includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis. The...
9035443 Massively parallel interconnect fabric for complex semiconductor devices  
An embodiment of this invention uses a massive parallel interconnect fabric (MPIF) at the flipped interface of a core die substrate (having the core logic blocks) and a context die (used for in...
9035468 Copper post structure for wafer level chip scale package  
In a method for forming a packaging structure, a metal pad is formed on a semiconductor substrate, and a first polymer insulating layer is formed over the semiconductor substrate. An opening...
9035194 Circuit board with integrated passive devices  
Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations....
9035466 Dicing tape-integrated film for semiconductor back surface  
The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer...
9035442 Semiconductor module  
A semiconductor module having a second semiconductor package 200 mounted on a first semiconductor package 100, wherein the first semiconductor package 100 includes: pads 15 formed on the top...
9029196 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask  
A semiconductor device has a semiconductor die with a die bump pad. A substrate has a conductive trace with an interconnect site. A conductive bump material is deposited on the interconnect site...
9029968 Optical sensor device  
An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate...
9030017 Z-connection using electroless plating  
An assembly includes a substrate having a substrate conductor and a contact at a first surface and a terminal at a second surface for electrically interconnecting the assembly with a component...
9024205 Advanced device assembly structures and methods  
A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further...
9024452 Semiconductor package comprising an interposer and method of manufacturing the same  
A semiconductor package and a method of manufacturing the same. The semiconductor package includes; a printed circuit board (PCB); a first semiconductor chip attached onto the PCB; an interposer...
9026872 Flexible sized die for use in multi-die integrated circuit  
An integrated circuit (IC) structure can include a first die and a second die. The second die can include a first base unit and a second base unit. Each of the first base unit and the second base...
9018774 Chip package  
A Chip Scale Package (CSP) and a method of forming the same are disclosed. Single chips without the conventional ball mountings, are first attached to an adhesive-substrate (adsubstrate) composite...
9018281 Set of resin compositions for preparing system-in-package type semiconductor device  
Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin...
9013039 Wafer support system for 3D packaging  
A method for handling and supporting a device wafer during a wafer thinning process and the resulting device are provided. Embodiments include forming a plurality of solder bumps on a first...
9013040 Memory device with die stacking and heat dissipation  
A memory device with die stacking is provided. A plurality of substrates layers are stacked together into a stack. Each substrate layer may include a substrate having a plurality of cavities to...
9012787 Electronic system for wave soldering  
An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for...
9006908 Integrated circuit interposer and method of manufacturing the same  
Systems and methods are provided for an interposer for coupling two or more integrated circuit dies to a circuit package. A first integrated circuit portion is disposed on a first location of a...
9006889 Flip chip packages with improved thermal performance  
Systems and methods for improving thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal...
RE45463 Stacked microelectronic assemblies with central contacts  
A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at...
9006909 Solder mask shape for BOT laminate packages  
A device is provided. The device may comprise an integrated circuit package. The integrated circuit package may comprise a first layer and a solder mask. The first layer may comprise a top surface...
9000600 Reduced stress TSV and interposer structures  
A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the...
9001520 Microelectronic structures having laminated or embedded glass routing structures for high density packaging  
Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a...
9000587 Wafer-level thin chip integration  
A wafer-level package device and techniques for fabricating the device are described that include embedding a silicon chip onto an active device wafer or a passive device wafer, where the embedded...
8994194 Semiconductor device having Au—Cu electrodes, and method of manufacturing semiconductor device  
A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by...
8994162 Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package  
A single metal layer tape substrate includes a patterned metal layer affixed to a patterned dielectric layer. The dielectric layer is patterned to provide openings exposing lands and bond sites on...
8994193 Semiconductor package including a metal plate, semiconductor chip, and wiring structure, semiconductor apparatus and method for manufacturing semiconductor package  
A semiconductor package includes: a metal plate including a first surface, a second surface and a side surface; a semiconductor chip on the first surface of the metal plate, the semiconductor chip...
8994190 Low-temperature flip chip die attach  
A mechanism for electrically coupling a semiconductor device die to a semiconductor device package substrate that avoids introduction of excessive temperature induced stresses to the semiconductor...
8994157 Circuit system in a package  
A circuit packaging system allows a combination of integrated circuit dice and surface mount electronic components to be mounted on a printed circuit board which is in turn mounted on a lead frame...
8994192 Integrated circuit packaging system with perimeter antiwarpage structure and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system comprising: providing a package carrier; mounting an integrated circuit to the package carrier; and forming a perimeter...
8994174 Structure having a planar bonding surface  
A structure and method of handling a device wafer during through-silicon via (TSV) processing are described in which a device wafer is bonded to a temporary support substrate with a permanent...
8994168 Semiconductor package including radiation plate  
A semiconductor package includes a wiring board; a semiconductor chip mounted on the wiring board; and a radiation plate mounted on the semiconductor chip, including an insulating member including...
8987055 Method for packaging low-K chip  
Provided is a method for packaging a low-k chip, comprising: attaching onto a carrier wafer a layer of temporary strippable film; arranging inversely a chip (2-1) onto the carrier wafer via the...
8987064 Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: providing a lead-frame having a metal connector mounted thereon and having a peripheral mounting region; forming an...
8987919 Built-in electronic component substrate and method for manufacturing the substrate  
A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first...
8987874 Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces  
Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces are disclosed. In one embodiment, a microelectronic assembly comprises a support member...
8987920 Wafer substrate bonding structure and light emitting device comprising the same  
A wafer substrate bonding structure may be provided that includes: a first substrate; and a conductive thin film which is disposed on the first substrate and includes a resin and conductive...
8981550 Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same  
A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly...
8981577 Integrated circuit packaging system with interconnect and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer first side and an interposer second side opposing the interposer first...
8981575 Semiconductor package structure  
A semiconductor package structure includes: a dielectric layer; a metal layer disposed on the dielectric layer and having a die pad and traces, the traces each including a trace body, a bond pad...
8975757 Lead-free solder connection structure and solder ball  
Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic...
8975182 Method for manufacturing semiconductor device, and semiconductor device  
A method for manufacturing a semiconductor device is carried out by readying each of a semiconductor element, a substrate having Cu as a principal element at least on a surface, and a ZnAl solder...
8975537 Circuit substrate, laminated board and laminated sheet  
A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the...
8975756 Electric terminal device and method of connecting the same  
An electric terminal device is provided with glass substrate 11, glass-substrate-side electric terminals 15 formed on glass substrate 11, tape carrier packages 16a and 16b which are larger in...
8970036 Stress relieving second level interconnect structures and methods of making the same  
Provided is a stress-relieving, second-level interconnect structure that is low-cost and accommodates thermal coefficient of expansion (TCE) mismatch between low-TCE packages and printed circuit...
8970042 Circuit board, comprising a core insulation film  
A circuit board is provided including a core insulation film having a thickness and including a first surface and an opposite second surface, an upper stack structure and a lower stack structure....
8970035 Bump structures for semiconductor package  
A package structure includes a first substrate bonded to a second substrate by Connecting metal pillars on the first substrate to connectors on the second substrate. A first metal pillar is formed...