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7239010 |
Semiconductor device
By securing a fatigue life of a connection portion with a semiconductor package and a mount board, a semiconductor device having a high reliability is provided. The semiconductor device consists...
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7235886 |
Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
A chip-join process to reduce elongation mismatch between the adherents involves thermally expanding each of a coefficient of thermal expansion mismatched semiconductor chip and substrate a...
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7235871 |
Stacked microelectronic dies
An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device...
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7235874 |
Semiconductor device, its manufacturing method, circuit board, and electronic unit
A semiconductor device includes an interposer having first and second faces pointing in opposite directions to each other and a metallization pattern formed on the first face, and a semiconductor...
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7235887 |
Semiconductor package with improved chip attachment and manufacturing method thereof
A semiconductor package comprises a chip having a top surface for chip pads and a bottom surface opposite the top surface. The top and bottom surfaces define side surfaces. The package further...
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7232707 |
Method of making a semiconductor chip assembly with an interlocked contact terminal
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to...
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7233060 |
Module card structure
A module card structure includes a structure, a first chip, a second chip, an adhesive layer, and a compound layer. The substrate has an upper surface on which a plurality of golden fingers are...
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7230329 |
Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device
A method is provided to realize a three-dimensional mounting structure of different types of packages. By bonding protruding electrodes onto lands, which are formed on a first carrier substrate,...
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7230331 |
Chip package structure and process for fabricating the same
A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the...
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7230317 |
Capacitor placement for integrated circuit packages
A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the...
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7230332 |
Chip package with embedded component
A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes...
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7227268 |
Placement of sacrificial solder balls underneath the PBGA substrate
The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and...
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7227267 |
Semiconductor package using flip-chip mounting technique
A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the...
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7224071 |
System and method to increase die stand-off height
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a...
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7224062 |
Chip package with embedded panel-shaped component
A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical...
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7224232 |
RF power amplifier and method for packaging the same
A method and apparatus is provided for use in power amplifiers for reducing the peak voltage that transistors are subjected to. A power amplifier is provided with first and second switching devices...
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7224072 |
Mounting structure for ball grid array type IC
A mounting structure of a ball grid array type IC includes resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC, engaging pawls formed at distal ends of the...
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7224045 |
Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
A leadless type semiconductor package includes a plate-like mount, and at least one semiconductor chip mounted on the plate-like mount such that a bottom surface of the semiconductor chip is...
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7221045 |
Flat chip semiconductor device and manufacturing method thereof
A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead...
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7221058 |
Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip
A substrate for mounting a semiconductor chip is formed as a multilayer substrate by alternately laminating insulation layers and wiring layers. Wires of the wiring layers are electrically...
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7219825 |
SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same
Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is...
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7221044 |
Heterogeneous integrated high voltage DC/AC light emitter
A single-chip integrated LED particularly adapted for direct use with a high voltage DC or AC power sources comprises a plurality of electrically isolated LEDs on a generally transparent substrate...
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7221055 |
System and method for die attach using a backside heat spreader
According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to...
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7221041 |
Multi-chips module package and manufacturing method thereof
A multi-chips module package comprises a lead frame, a first chip, a second chip, a plurality of electrically conductive wires and an encapsulation. The lead frame has a plurality of first leads,...
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7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a...
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7221059 |
Wafer level semiconductor component having thinned, encapsulated dice and polymer dam
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit...
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7218007 |
Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices
An electronic structure includes an electronic device coupled to a substrate by conductive bumps and ball limiting metallurgy (BLM). Underfill material having filler particles is disposed in a...
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7218005 |
Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same
In a semiconductor device, rewirings 3 for connecting a semiconductor chip 1 a , a semiconductor chip 1 b and external connecting terminals 4 with each other are formed on the semiconductor...
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7218001 |
Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one...
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7214561 |
Packaging assembly and method of assembling the same
A packaging assembly includes a substrate; chip-site lands disposed on the first surface; first solder balls connected to the chip-site lands; second solder balls connected to the first solder...
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7215015 |
Imaging system
A semiconductor package includes a substrate, and a semiconductor die flip chip mounted to the substrate. The package also includes substrate circuitry on a circuit side of the substrate, die...
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7215026 |
Semiconductor module and method of forming a semiconductor module
In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the...
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7215017 |
Wafer level package, wafer level packaging procedure for making wafer level package
A wafer level packaging procedure provides a wafer having a pad mounting surface with bonding pads on the pad mounting surface. An insulative layer is formed with conductor formation holes exposing...
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7215030 |
Lead-free semiconductor package
A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1...
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7211893 |
Integrating chip scale packaging metallization into integrated circuit die structures
Wafer-level chip-scale packaging technology is used for improving performance or reducing size of integrated circuits by using metallization of pad-to-bump-out beams as part of the integrated...
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7208758 |
Dynamic integrated circuit clusters, modules including same and methods of fabricating
A semiconductor wafer or other bulk semiconductor substrate having a plurality of dice thereon is manufactured using conventional processing techniques. The wafer is subjected to testing to...
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7208833 |
Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate
An electronic circuit device comprises: a semiconductor element having a first surface and a second surface, with the first and second surfaces being on first and second sides of the semiconductor...
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7208402 |
Method and apparatus for improved power routing
An apparatus comprising: a die having a top metal layer, the top metal layer comprised of at least a first metal line and a second metal line; a passivation layer covering the top metal layer; a C4...
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7208828 |
Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external...
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7208820 |
Substrate having a plurality of I/O routing arrangements for a microelectronic device
A substrate is provided for packaging a microelectronic device having a pattern of contacts on the surface thereof. The substrate is formed from a support member having a substantially planar...
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7208825 |
Stacked semiconductor packages
A semiconductor package and a fabrication method thereof are provided in which a chip is mounted on a substrate, and a dielectric layer is applied over the substrate and chip, with bond fingers...
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7205177 |
Methods of bonding two semiconductor devices
A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface...
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7205671 |
Semiconductor device
A semiconductor device has peripheral electrode pads formed on the periphery of a semiconductor chip, land pads comprising the first land pads and the second land pads formed on the semiconductor...
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7205672 |
Flip chip mounted to thermal sensing element through the back side of the chip
A method for providing cooled flip chip is provided. Solder paste is placed on a back side of a flip chip. A heat sink is placed against the solder paste. The solder paste is reflowed. In addition,...
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7205670 |
Semiconductor device and manufacturing method therefor
A semiconductor device is disclosed which comprises a plurality of semiconductor chips having a plurality of terminals, two chip mounting bases on each of which at least one of the semiconductor...
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7205646 |
Electronic device and chip package
The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is...
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7202420 |
Methods to prevent mechanical flexure related BGA failure
Methods and associated apparatus of reducing stress in a package are described in which a package is provided comprising an array of interconnects that are connected to a substrate, and then...
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7202556 |
Semiconductor package having substrate with multi-layer metal bumps
A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external...
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7202569 |
Semiconductor device and manufacturing method of the same
A semiconductor device comprises a semiconductor element which is flip-chip bonded to a circuit substrate. The semiconductor element and the circuit substrate are flip-chip bonded using a sealing...
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7202571 |
Electronic module with form in-place pedestal
An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive...
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