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Document Title |
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7429797 |
Electronic device and carrier substrate
Consistent with an example embodiment, an electronic device comprises a semiconductor device, particularly an integrated circuit, and a carrier substrate with conductive layers on the first side...
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7429793 |
Semiconductor device having an electronic circuit disposed therein
A semiconductor device and a fabrication method thereof are provided. A semiconductor device which is packaged as it includes a semiconductor in which an electronic circuit is disposed, the...
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7429796 |
Semiconductor device and fabrication process thereof
A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor...
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7429798 |
Integrated circuit package-in-package system
A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first...
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7427809 |
Repairable three-dimensional semiconductor subsystem
A tightly packed three-dimensional electronic system or subsystem comprising multiple stacks of semiconductor elements is described. The system is repairable because the elements connect together...
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7425745 |
Semiconductor device and method for manufacturing the same
A semiconductor device includes a semiconductor substrate, an isolation film that is provided in one principal surface of the semiconductor substrate, wiring that is arranged on the isolation film,...
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7425758 |
Metal core foldover package structures
Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The...
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7423337 |
Integrated circuit device package having a support coating for improved reliability during temperature cycling
An apparatus and method for increasing integrated circuit device package reliability is disclosed. According to one embodiment of the present invention, a support coating is added to a wafer after...
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7420282 |
Connection structure for connecting semiconductor element and wiring board, and semiconductor device
In a connection structure of the present invention, the wiring board including a solder resist covering part which covers the wiring pattern with solder resist, the solder resist covering part...
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7420265 |
Integrated circuit package system with integrated circuit support
An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the...
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7420817 |
MEMS device seal using liquid crystal polymer
An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape...
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7417293 |
Image sensor packaging structure
An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second...
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7417309 |
Circuit device and portable device with symmetrical arrangement
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first...
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7417323 |
Neo-wafer device and method
A neo-wafer made from integrated circuit die and methods for making a neo-wafer are disclosed. A substrate is provided and includes a dielectric layer with conductive pads for the receiving of one...
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7413928 |
Die-wafer package and method of fabricating same
A die-wafer package includes a singulated semiconductor die having a first plurality of bond pads on a first surface and a second plurality of bond pads on a second opposing surface thereof. Each...
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7411225 |
Light source apparatus
A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light...
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7410833 |
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an...
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7411297 |
Microfeature devices and methods for manufacturing microfeature devices
Microfeature devices, microfeature workpieces, and methods for manufacturing microfeature devices and microfeature workpieces are disclosed herein. The microfeature workpieces have an integrated...
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7411285 |
Low profile stacked semiconductor chip package
A stacked semiconductor chip package comprising a first semiconductor chip having an upper surface, a lower surface opposed to said upper surface, and a plurality of conductive metal lines formed...
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7411306 |
Packaging structure and method of an image sensor module
This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an...
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7408243 |
High temperature package flip-chip bonding to ceramic
A sensor package apparatus and method are disclosed in which a sensor die is provided and based on a substrate. An integrated circuit is generally associated with the sensor die. A leadframe is...
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7407833 |
Process for fabricating chip package structure
A chip package structure comprising a carrier, a chip and an underfill layer is disclosed. The carrier has a plurality of bumps disposed thereon. The chip has an active surface. The chip is...
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7405468 |
Plastic package and method of fabricating the same
A plastic package includes a plurality of terminal members each having an outer terminal, an inner terminal, and a connecting part connecting the outer and the inner terminal; a semiconductor...
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7405456 |
Optical sensor chip package
The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids...
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7405478 |
Substrate package structure and packaging method thereof
A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second...
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7402912 |
Method and power control structure for managing plurality of voltage islands
A power control method and power control structures are provided for managing a plurality of voltage islands of a functional chip. The power control structure includes a supply control and...
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7402901 |
Semiconductor device and method of manufacturing semiconductor device
The present invention provides a semiconductor device that is inexpensive and can suppress signal transmission delay, and a manufacturing method thereof. The semiconductor device includes: a...
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7400036 |
Semiconductor chip package with a package substrate and a lid cover
A semiconductor chip package includes a package substrate having a first bond pad pattern. A semiconductor chip resides on the package substrate. The semiconductor chip has a second bond pad...
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7400048 |
Void-free circuit board and semiconductor package having the same
A void-free circuit board and a semiconductor package having the same includes a protective layer covering and protecting an electrode pattern formed on an upper surface of a substrate. The...
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7400035 |
Semiconductor device having multilayer printed wiring board
A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support...
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7400032 |
Module assembly for stacked BGA packages
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid...
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7397138 |
Semiconductor device
Input/output cells are formed so as to be peripherally arranged adjacent to a corner cell on a surface of a semiconductor chip, and electrode pads are formed on the respective input/output cells....
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7397115 |
Folding chip planar stack package
A folding chip planar stack package is realized by employing folding chips. The folding chip planar stack package includes a substrate, first and second semiconductor chips attached to an upper...
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7397134 |
Semiconductor device mounted on and electrically connected to circuit board
The invention provides a package type semiconductor device and a manufacturing method thereof where reliability is improved without increasing a manufacturing cost. A resin layer and a supporting...
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7397132 |
Semiconductor device
Disclosed is a semiconductor device including an organic material substrate, a semiconductor chip flip chip connected to substantially a center of one surface of the organic material substrate, and...
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7397133 |
Submount for diode with single bottom electrode
A submount is used to mount a diode between two metal areas on the upper surface of a substrate. One of the areas is connected to a metal plate at the lower surface of the substrate through a via....
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7394163 |
Method of mounting semiconductor chip
A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill...
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7394164 |
Semiconductor device having bumps in a same row for staggered probing
A semiconductor device has a plurality of bumps in a same row for staggered probing. The bumps in a same row are disposed on a chip and include a plurality of regular bumps and a plurality of...
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7393719 |
Increased stand-off height integrated circuit assemblies, systems, and methods
Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by...
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7394150 |
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on...
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7391118 |
Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same
An integrated circuit device with embedded passive component by flip-chip connection is provided which includes a flip chip and a dummy chip. The dummy chip includes at least an embedded passive...
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7391122 |
Techniques for flip chip package migration
Techniques for integrated circuit packaging in a flip chip configuration that ensures a migration path between related integrated circuits and utilizes core I/O (or area I/O) are provided. An...
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7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors
One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the...
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7391119 |
Temperature sustaining flip chip assembly process
A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure...
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7389012 |
Electro-optical module comprising flexible connection cable and method of making the same
An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a...
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7387910 |
Method of bonding solder pads of flip-chip package
Disclosed herein is a method of bonding solder pads of a flip-chip package. This invention relates to a method of bonding solder pads having different sizes to each other, when a bonding operation...
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7388281 |
Encapsulated electronic component and production method
The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by...
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7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions
An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided...
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7387958 |
MMIC having back-side multi-layer signal routing
A method includes providing a single crystal wafer having MMIC chips. Each chip has an active device in a first surface portion of a semiconductor substrate provided by the wafer and an electrical...
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7388294 |
Semiconductor components having stacked dice
A semiconductor package component includes a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary...
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