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7576435 |
Low-cost and ultra-fine integrated circuit packaging technique
A semiconductor package structure and the methods for forming the same are provided. The semiconductor package structure includes an interposer; a first plurality of bonding pads on a side of the...
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7576436 |
Structure of wafer level package with area bump
A package structure with an area bump has at least a chip (also known as a die), a redistribution layer, a plurality of first bumps (normal bumps) and at least a second bump (area bump). The...
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7576434 |
Wafer-level solder bumps
In one embodiment, the present invention includes a semiconductor package having a support substrate coupled to a first semiconductor die, where the first semiconductor die includes first...
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7573139 |
Packed system of semiconductor chips having a semiconductor interposer
A semiconductor system ( 200 ) of one or more semiconductor interposers ( 201 ) with a certain dimension ( 210 ), conductive vias ( 212 ) extending from the first to the second surface, with...
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7573138 |
Stress decoupling structures for flip-chip assembly
A stress decoupling structure provided underneath the under-ball-metallurgy (UBM) pads of a flip-chip bonding integrated circuit (IC) chip enhances the cyclic fatigue life of the solder joints...
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7573720 |
Active socket for facilitating proximity communication
One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon...
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7569939 |
Self alignment features for an electronic assembly
Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7569924 |
Semiconductor device and manufacturing method thereof
A semiconductor chip 11 comprising an element formation layer which is formed on a first main surface 35 A of a semiconductor substrate 35 and has a semiconductor element, through electrodes ...
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7569935 |
Pillar-to-pillar flip-chip assembly
A pillar-to-pillar flip-chip assembly primarily comprises a substrate, a chip disposed on the substrate, a plurality of first copper pillars on the bonding pads of the chip, a plurality of second...
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7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same
A semiconductor device includes: a first semiconductor chip face-down mounted on a substrate; a second semiconductor chip face-up mounted on the first semiconductor chip; an electromagnetic...
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7566649 |
Compressible films surrounding solder connectors
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a...
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7566961 |
Multi-stacked package and method of manufacturing the same
A multi-stacked package includes a first package, a second package and a combining member. The second package supports the first package, and is electrically connected to the first package and has...
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7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit
A method according to the present invention for producing a semiconductor-chip-mounting circuit 1 includes mainly three steps. In a first step, contacts 2 each in the form of a conical helix...
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7564130 |
Power micro surface-mount device package
A semiconductor device is provided, which comprises: a die including an active surface; a multiplicity of bond pads formed on the active surface of the die, wherein a first one of the bond pads is...
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7564139 |
Semiconductor device and method for manufacturing the same
It is an object of the present invention to provide a technique for making a semiconductor device thinner without using a back-grinding method for a silicon wafer. According to the present...
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7564140 |
Semiconductor package and substrate structure thereof
A semiconductor package and a substrate structure thereof are provided. A solder mask layer applied on the substrate structure is formed with outwardly extended openings corresponding to corner...
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7564131 |
Semiconductor package and method of making a semiconductor package
Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on...
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7560812 |
Cooling module against ESD and electronic package, assembly and system using the same
An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence...
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7560821 |
Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
An area mount type semiconductor device having high reliability when a semiconductor element is mounted on a surface with the use of a lead-free solder, and a die bonding resin composition and...
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7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
A semiconductor device, including a semiconductor chip having electrodes, a substrate having an interconnect pattern, and an adhesive, the adhesive having a first portion and a second portion, the...
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7560802 |
Electrical connections in substrates
A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and...
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7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
A conductive structure configured to connect a contact pad of a semiconductor device with a corresponding contact pad of a substrate. The conductive structure includes two interconnectable members,...
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7557450 |
Wiring substrate and electronic parts packaging structure
In a wiring substrate of the present invention in which a bump of an electronic parts is bonded to a connection pad of a wiring pattern provided on an insulating film by an ultrasonic flip-chip...
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7557439 |
Layered chip package that implements memory device
A layered chip package includes a main body, and wiring disposed on a side surface of the main body. The main body includes a plurality of first-type layer portions each including a first-type...
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7557438 |
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same
A stacked die package includes a substrate ( 210, 310 ), a first die ( 220, 320 ) above the substrate, a spacer ( 230, 330 ) above the first die, a second die ( 240, 340 ) above the spacer, and a...
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7554198 |
Flexible joint methodology to attach a die on an organic substrate
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic...
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7554203 |
Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture
An integrated circuit (“IC”) package having two or more dice stacked on a substrate and electrically coupled using two or more different connection technologies may improve high-speed...
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7554193 |
Semiconductor device
A semiconductor device capable of reducing the thermal resistance in a flip chip packaging structure while achieving both the high radiation performance and manufacturing readiness without...
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7554185 |
Flip chip and wire bond semiconductor package
A semiconductor package and method of forming the package, including a substrate having an opening formed therein. Contact pads are formed about a periphery of the opening on a first side of the...
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7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same
Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing...
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7554167 |
Three-dimensional analog input control device
A method and device for 3-dimensional input finger control of different functions in electronic consumer devices is provided. Certain versions of the Present Invention provide a 3-dimensional input...
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7550830 |
Stacked semiconductor package having fan-out structure through wire bonding
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A...
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7550852 |
Composite metal column for mounting semiconductor device
An integrated circuit chip which has a plurality of pads and non-reflowable contact members to be connected by reflow attachment to external parts. Each of these contact members has a...
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7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
A semiconductor device comprises a plurality of semiconductor constructions being mutually laminated each having a semiconductor substrate and a plurality of external connection electrodes arranged...
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7550853 |
Electrical isolation of monolithic circuits using a conductive through-hole in the substrate
A monolithic electronic chip including: a substrate; a first circuit formed on a first circuit portion of the substrate; a second circuit formed on a second circuit portion of the substrate; and at...
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7550856 |
Grooved substrates for uniform underfilling solder ball assembled electronic devices
A semiconductor assembly ( 300 ) comprising a semiconductor device ( 301 ), which has a plurality of metallic contact pads ( 302 ) and an outline by sides ( 303 ). A metallic bump ( 304 ) made of...
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7547975 |
Module with embedded semiconductor IC and method of fabricating the module
A module with embedded semiconductor IC of the present invention includes a first resin layer, a second resin layer, post electrodes passing through the first and second resin layers, and a...
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7545031 |
Multipackage module having stacked packages with asymmetrically arranged die and molding
Semiconductor chip packages have die asymmetrically arranged on the respective substrates. Two such packages having complementary arrangements can be stacked, one inverted with respect to the...
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7545047 |
Semiconductor device with a wiring substrate and method for producing the same
A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound...
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7545049 |
Electronic parts packaging structure
An electronic parts packaging structure of the present invention includes a wiring substrate having a wiring pattern, a first insulating film which is formed on the wiring substrate and which has...
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7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first and second areas formed with a high-frequency circuit element, and a third area...
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7541677 |
Semiconductor device comprising through-electrode interconnect
A semiconductor device having a through electrode excellent in performance as for an electrode and manufacturing stability is provided. There is provided a through electrode composed of a...
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7541681 |
Interconnection structure, electronic component and method of manufacturing the same
An interconnection structure includes an electrically conductive bump, wherein the electrically conductive bump has a metal body having a distal end. The metal body is free of solder. An outermost...
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7538419 |
Stacked-type chip package structure
A stacked-type chip package structure including a substrate, a first chip, bonding wires, a second chip and B-stage conductive bumps is provided. The first chip is disposed on the substrate, and it...
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7538421 |
Flip-chip package structure with stiffener
A flip-chip package structure with stiffener includes a substrate, a first stiffener positioned on a surface of the substrate, a chip having a plurality of bumps adopted to electrically connect the...
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7538440 |
Method for improved high current component interconnections
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is...
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7535101 |
Electrode pad on conductive semiconductor substrate
An electrode pad on a semiconductor substrate having a reduced capacitance of an electrode pad portion and allowing control of a characteristic impedance for a practical electrode pad size is...
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7535086 |
Integrated circuit package-on-package stacking system
An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and...
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7535084 |
Multi-chip package with a single die pad
A multi-chip package with a single die pad is provided. The multi-chip package includes a leadframe having a die pad and a plurality of leads surrounding the die pad. Each of the leads includes an...
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