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7619316 |
Semiconductor package and method for manufacturing the same
A semiconductor package includes: a build-up wiring layer including a metal wiring layer and an insulation resin layer; and a low thermal expansion material layer having a coefficient of thermal...
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7619315 |
Stack type semiconductor chip package having different type of chips and fabrication method thereof
A stack type semiconductor chip package includes a first wafer mold, a protection substrate, and a second wafer mold that are stacked in a wafer level process. The first wafer mold includes a first...
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7619314 |
Integrated circuit package system including die stacking
An integrated circuit package system includes providing a leadframe, forming an aperture within the leadframe, mounting an integrated circuit package over or under the aperture, and mounting a die...
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7619313 |
Multi-chip module and methods
A substrate includes first and second regions over which first and second semiconductor devices are to be respectively positioned. The first region is located at least partially within the second...
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7619312 |
Method and apparatus for precisely aligning integrated circuit chips
A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit...
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7619303 |
Integrated circuit package
An integrated circuit package is described that includes two dice. The active surface of each die includes a plurality of I/O pads. The active surface of the first die is positioned adjacent first...
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7619282 |
Hybrid circuit and electronic device using same
There is disclosed a hybrid circuit in which a circuit formed of TFTs in integrated with an RF filter. The TFTs are fabricated on a quartz substrate. A ceramic filter forming the RF filter is...
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7615871 |
Method and apparatus for attaching microelectronic substrates and support members
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
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7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board
Cut pieces of a flexible tape respectively having positioning holes are superposed on a substrate having positioning holes, while positioning the substrate and the cut pieces by inserting a...
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7615869 |
Memory module with stacked semiconductor devices
Embodiments are described in which a stacked arrangement of integrated circuit packages comprises a dummy substrate comprising an embedded discrete or distributed capacitor connected to first...
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7615856 |
Integrated antenna type circuit apparatus
An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes...
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7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar
The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing...
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7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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7608925 |
Relay board with bonding pads connected by wirings
A relay board provided in a semiconductor package where a plurality of semiconductor chips are provided, the relay board relaying a wire for wiring the semiconductor chips or a wire for wiring a...
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7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The...
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7608921 |
Multi-layer semiconductor package
A semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base substrate and an interposer substrate mounted on top of the die. The bottom side of the...
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7608920 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
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7608919 |
Interconnect packaging systems
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods...
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7608918 |
Semiconductor device
A semiconductor device is provided which comprises a heat-radiative support plate 5 ; and first and second semiconductor elements 1 and 2 mounted and layered on support plate 5 for alternate...
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7605479 |
Stacked chip assembly with encapsulant layer
A microelectronic subassembly 210 includes a substrate 215 having a top surface 216 and at least one peripheral region 219, a microelectronic element 201 mounted over the substrate 215, ...
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7605478 |
Semiconductor package and method of manufacturing the same
Provided are a semiconductor package and a method of manufacturing the semiconductor package, and more particularly, a semiconductor package with bonding wires and a method of manufacturing the...
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7605477 |
Stacked integrated circuit assembly
A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the...
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7605476 |
Stacked die semiconductor package
A stacked die semiconductor package includes: a substrate, having a first surface and an opposite surface thereto; a plurality of dice, structured for being stacked one on top of the other on the...
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7605459 |
Coreless substrate and manufacturing thereof
An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper...
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7605457 |
Semiconductor device and method of manufacturing the same
The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is...
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7605454 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
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7604152 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same
A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit...
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7602070 |
Room temperature metal direct bonding
A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to...
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7602066 |
Method of filling structures for forming via-first dual damascene interconnects
A method of forming via-first, dual damascene interconnect structures by using a gap-filling, bottom anti-reflective coating material whose thickness is easily controlled by a solvent is provided....
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7602028 |
NAND flash memory devices having 3-dimensionally arranged memory cells and methods of fabricating the same
A NAND flash memory device includes a lower semiconductor layer and an upper semiconductor layer located over the lower semiconductor layer, a first drain region and a first source region located...
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7601561 |
Heat-radiating tape carrier package and method for manufacturing the same
A tape carrier package may include an interposer having a first surface and a second surface. The first surface of the interposer may be attached to an exposed active surface of a semiconductor...
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7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such...
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7598618 |
Semiconductor device
A semiconductor device that enables the transmission time of a signal and implementation area to be reduced, and a method for manufacturing the same. A semiconductor device includes a first...
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7598617 |
Stack package utilizing through vias and re-distribution lines
A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof...
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7598607 |
Semiconductor packages with enhanced joint reliability and methods of fabricating the same
Provided is a semiconductor package with enhanced joint reliability and methods of fabricating the same. The method includes: forming package units including a semiconductor chip interposed between...
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7598606 |
Integrated circuit package system with die and package combination
An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and...
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7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
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7598604 |
Low profile semiconductor package
A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor...
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7598123 |
Semiconductor component and method of manufacture
A semiconductor component comprising two stacked semiconductor dice and a method of manufacture. A leadframe having an active area that includes leadframe leads and a cavity is mounted to a support...
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7595559 |
Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip
Packaged integrated circuit devices include a package substrate and a multi-chip stack of integrated circuit devices on the package substrate. The multi-chip stack includes at least one chip-select...
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7595552 |
Stacked semiconductor package in which semiconductor packages are connected using a connector
A stacked semiconductor package includes a semiconductor package module in which a plurality of semiconductor packages, which include a substrate and a semiconductor chip mounted over the...
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7595551 |
Semiconductor package for a large die
A semiconductor package is provided. A semiconductor package has a die pad and a plurality of bonding fingers. A spacer is attached to the die pad, and a large die is attached to the spacer. The...
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7595468 |
Passive thermal solution for hand-held devices
The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal...
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7592707 |
Method and apparatus for facilitating proximity communication and power delivery
One embodiment of the present invention provides a system that facilitates precise inter-chip alignment for proximity communication and power delivery. The system includes a first integrated...
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7592706 |
Multi-layer circuit board with fine pitches and fabricating method thereof
A method for fabricating a multi-layer circuit board with fine pitch is provided. First, a plurality of contact pads is disposed on a core substrate. Next, a first dielectric layer, a second...
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7592700 |
Semiconductor chip and method of manufacturing semiconductor chip
A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an...
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7592692 |
Semiconductor device with a dummy electrode
A semiconductor device according to an embodiment of the present invention includes a semiconductor chip. The semiconductor chip includes a semiconductor substrate, an interconnect layer, a back...
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7592691 |
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
A stacked semiconductor die assembly includes at least two partially offset semiconductor dice with bond pads located adjacent at least one peripheral side thereof supported on a redistribution...
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7592690 |
Semiconductor device including semiconductor elements mounted on base plate
A semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate such that...
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7589410 |
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
A stack package includes at least two stacked package units. Each package unit comprises semiconductor chips having bonding pads on upper surfaces thereof; a molding part formed to surround side...
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