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7622810 |
Semiconductor device and manufacturing method thereof
Disconnection of wiring and deterioration of step coverage are prevented to offer a semiconductor device of high reliability. A pad electrode formed on a silicon die is connected with a...
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7622779 |
Interconnection architecture and method of assessing interconnection architecture
A multi-celled chip. The chip includes a plurality of hexagonal cells arranged in an array. A plurality of interconnects including Y's connect the cells in clusters of three cells each, so that...
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7602069 |
Micro electronic component with electrically accessible metallic clusters
A micro electronic component, preferably in the form of an electronic memory, includes the use of clusters as an electronic memory. Also disclosed as part of the present invention is a method for...
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7602058 |
Flip-chip semiconductor device with improved power pad arrangement
A semiconductor device is composed of a power supply interconnection extending from a certain starting point in a first direction and also extending from the starting point in a second direction...
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7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7595549 |
Surface mount semiconductor device
A surface mount semiconductor device using a lead frame can suppress stress applied to a package by a load in a forming process performed for the lead frame projecting from the package at a portion...
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7586188 |
Chip package and coreless package substrate thereof
A chip package includes a coreless package substrate and a chip. The coreless package substrate includes an interconnection structure and a ceramic stiffener. The interconnection structure has a...
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7586187 |
Interconnect structure with stress buffering ability and the manufacturing method thereof
An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic...
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7586186 |
Ball grid array
A ball grid array includes: a semiconductor chip having multiple pads; and an interposer for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings on the...
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7566976 |
Semiconductor device and method for fabricating the same
A semiconductor device has a porous low-dielectric-constant film formed on a substrate and having an opening and a fine particle film composed of a plurality of aggregately deposited fine particles...
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7564130 |
Power micro surface-mount device package
A semiconductor device is provided, which comprises: a die including an active surface; a multiplicity of bond pads formed on the active surface of the die, wherein a first one of the bond pads is...
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7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
A semiconductor device, including a semiconductor chip having electrodes, a substrate having an interconnect pattern, and an adhesive, the adhesive having a first portion and a second portion, the...
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7560814 |
Semiconductor device that improves electrical connection reliability
A semiconductor device including: a semiconductor section in which an element is formed; an insulating layer formed on the semiconductor section; an electrode pad formed on the insulating layer; a...
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7559139 |
Method for manufacturing a probe unit
A method for manufacturing a probe unit includes: (a) preparing a substrate; (b) forming a hollow part in the substrate; (c) forming a sacrificial layer that buries the hollow part on the...
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7557451 |
Electro-optical device and electronic apparatus
An electro-optical device includes a substrate that holds an electro-optical material; and a flexible substrate that is connected to the substrate. The flexible substrate has a first connecting...
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7557449 |
Flexible via design to improve reliability
An integrated circuit includes a metallization layer, a first metal line in the metallization layer, and a first via electrically connected to the first metal line. The first via has a first via...
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7554202 |
Semiconductor integrated circuit device
Interconnections are formed over an interlayer insulating film which covers MISFETQ1 formed on the principal surface of a semiconductor substrate, while dummy interconnections are disposed in a...
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7554197 |
High frequency IC package and method for fabricating the same
A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to...
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7553703 |
Methods of forming an interconnect structure
Semiconductor devices having conductive lines with extended ends and methods of extending conductive line ends by a variable distance are disclosed. An end of a first conductive feature of an...
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7550855 |
Vertically spaced plural microsprings
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
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7550854 |
Integrated interconnect arrangement
An explanation is given of an integrated interconnect arrangement having a plurality of interconnects that cross over one another at two crossover sections. By virtue of this measure, it is...
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7550842 |
Integrated circuit assembly
In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical...
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7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
A semiconductor device comprises a plurality of semiconductor constructions being mutually laminated each having a semiconductor substrate and a plurality of external connection electrodes arranged...
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7547965 |
Package and package module of the package
A package includes a carrier, a first chip, a first dielectric layer and at least one first connecting part. The carrier has a first surface and a second surface, and at least one first pad is...
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7547935 |
Semiconductor devices including buried digit lines that are laterally offset from corresponding active-device regions
A method of electrically linking contacts of a semiconductor device to their corresponding digit lines. The method includes disposing a quantity of mask material into a trench through which the...
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7541678 |
Printed wiring board, information processing apparatus, and method of manufacturing the printed wiring board
Disclosed is a printed wiring board comprising an insulating layer having a rectangular flat shape and provided with fibers in the layer, the direction of the fiber in the layer being almost...
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7541670 |
Semiconductor device having terminals
The power semiconductor package includes a semiconductor mounting substrate, a mother case having an opening and containing the semiconductor mounting substrate therein, a securing member having a...
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7540970 |
Methods of fabricating a semiconductor device
Methods of fabricating a semiconductor device are provided. Methods of forming a finer pattern of a semiconductor device using a buffer layer for retarding, or preventing, bridge formation between...
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7538442 |
Semiconductor chip and semiconductor device
In the peripheral part of a semiconductor chip, third electrode pads for wire bonding and plate wiring and first electrode pads dedicated to wire bonding are provided. On the other hand, second...
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7538417 |
Semiconductor device with signal line having decreased characteristic impedance
A semiconductor device includes a semiconductor chip, electrodes pads, first and second insulating layers, first and second conductive patterns and external terminals. The electrode pads are formed...
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7535108 |
Electronic component including reinforcing member
A method for manufacturing an electronic component includes: cutting a wiring substrate along a line intersecting with an outline of a reinforcing member, the wiring substrate including a base...
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7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure
The present invention relates to a substrate structure comprising at least two substrate layers extending in substantially parallel planes, which substrate layers are (Z-)interconnected in a...
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7521797 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device
A method of manufacturing a substrate joint body by mounting a TFT on a wiring substrate includes a step of arranging an electrode pad of the wiring substrate and an electrode pad of the TFT at a...
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7514795 |
Semiconductor integrated circuit having improved power supply wiring
In a semiconductor integrated circuit including a plurality of cells, a supplementary power-supply wire is disposed between a lattice-shaped upper power-supply wire and a lower cell power-supply...
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7509615 |
Circuit layout structure and method
A symmetrical circuit layout structure includes a number of signal wires, a ground wire and a dielectric layer. The signal wires include a first portion placed on a first plane and a second portion...
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7508079 |
Circuit substrate and method of manufacturing the same
In a method of manufacturing a circuit substrate of the present invention, a first through hole is formed in a semiconductor substrate and a first insulating layer is formed on the entire surface...
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7501701 |
Rewiring substrate strip having a plurality of semiconductor component positions
A rewiring substrate strip ( 100 ) has a plurality of semiconductor component positions ( 2 ) for semiconductor components ( 3 ). The semiconductor component positions are arranged in rows and...
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7498674 |
Semiconductor module having a coupling substrate, and methods for its production
A semiconductor module has a coupling substrate which is used for the internal electrical coupling of an integrated circuit on adjacent semiconductor chips. The semiconductor chips have integrated...
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7495343 |
Pad over active circuit system and method with frame support structure
An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is...
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7495340 |
Metal layer structure of semiconductor device
A metal layer structure of a semiconductor memory device is disclosed. The metal layer structure includes: a first metal layer to be connected to a contact plug; and a plurality of a second metal...
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7495335 |
Method of reducing process steps in metal line protective structure formation
A method of forming a protective structure on a top metal line on an interconnect structure is disclosed. The method includes providing a plate opening in the passivation layer on the top metal...
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7495327 |
Chip stacking structure
An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active...
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7495326 |
Stacked electronic structures including offset substrates
An electronic device may include first, second, and third substrates wherein the second electronic substrate is between the first and second electronic substrates. A first electrical and mechanical...
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7492013 |
Systems and arrangements to interconnect components of a semiconductor device
Systems and arrangements to interconnect cells and structures within cells of an integrated circuit to enhance cell density. Embodiments comprise an adjusted polysilicon gate pitch to metal wire...
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7479697 |
Resilient carrier assembly for an integrated circuit
Provided is a carrier assembly for an integrated circuit. The assembly includes a carrier having a matrix of island contacts interconnected by respective serpentine members to allow resilient...
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7476965 |
Electronic device with integrated heat distributor
The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components....
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7474002 |
Semiconductor device having dielectric film having aperture portion
In the semiconductor device having a structure in which a plurality of layers are built-up by layers made of different materials or layers including various formed patterns, it is an object to...
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7474000 |
High density contact to relaxed geometry layers
The present invention provides for a via and staggered routing level structure. Vertically overlapping vias connect to two or more routing levels formed at different heights. The routing levels are...
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7462887 |
Semiconductor connection component
There is a need for providing a technology capable of decreasing on-resistance of a power transistor in a semiconductor device that integrates the power transistor and a control integrated circuit...
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7453151 |
Methods for lateral current carrying capability improvement in semiconductor devices
A semiconductor structure and methods for forming the same. The semiconductor structure includes (a) a substrate; (b) a first semiconductor device on the substrate; (c) N ILD (Inter-Level...
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