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7608891 |
Thin film transistor, circuit apparatus and liquid crystal display
A thin film transistor includes a one conductive type semiconductor layer ( 11 ); a source region ( 12 ) and a drain region ( 13 ) which are separately provided in the semiconductor layer; and a...
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7602059 |
Lead pin, circuit, semiconductor device, and method of forming lead pin
A lead pin of a circuit includes a pin, an insulator that surrounds the pin, and a conductor that surrounds the insulator, the conductor including non-uniformity.
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7598615 |
Analytic structure for failure analysis of semiconductor device having a multi-stacked interconnection structure
In an analytic structure for failure analysis of a semiconductor device, a plurality of analytic regions are arranged in regions of a semiconductor substrate. A plurality of semiconductor...
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7595549 |
Surface mount semiconductor device
A surface mount semiconductor device using a lead frame can suppress stress applied to a package by a load in a forming process performed for the lead frame projecting from the package at a portion...
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7595265 |
Semiconductor device and method for forming a metal line in the semiconductor device
Contact resistance of a semiconductor device may be reduced, and thereby the reliability of the semiconductor device may be enhanced, when a metal line is formed in a semiconductor device according...
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7592705 |
Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device
A method and apparatus for partially strapping two polysilicon lines, each having a first end and second end, uses a metal line having a plurality of spaced apart metal segments with each metal...
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7592701 |
Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure
An electrode structure includes at least a contact button portion that has a portion of multilayer structure of two or more conductor layers stacked and enlarged in area. A part mounting structure...
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7589019 |
Memory cell array and method of forming a memory cell array
A memory cell array includes a plurality of first conductive lines running in a first direction, where the first conductive lines have a pitch Bp, a plurality of second conductive lines, and a...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7582971 |
Semiconductor device and manufacturing method of the same
The invention is directed to a semiconductor device having a penetrating electrode and a manufacturing method thereof in which reliability and a yield of the semiconductor device are enhanced. A...
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7566972 |
Semiconductor device and method for manufacturing the semiconductor device
A semiconductor device, comprises: a wiring formed on a first insulating film, a second insulating film formed on the first insulating film and on the wiring, a contact hole formed in the second...
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7564695 |
Circuit connection structure and printed circuit board
While gradually increasing the widths of signal lines ( 104 a, 104 b, 105 a, 105 b ) of first and second groups of differential signal lines ( 104, 105 ) to suppress attenuation in the lines,...
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7564130 |
Power micro surface-mount device package
A semiconductor device is provided, which comprises: a die including an active surface; a multiplicity of bond pads formed on the active surface of the die, wherein a first one of the bond pads is...
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7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
A semiconductor device, including a semiconductor chip having electrodes, a substrate having an interconnect pattern, and an adhesive, the adhesive having a first portion and a second portion, the...
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7557449 |
Flexible via design to improve reliability
An integrated circuit includes a metallization layer, a first metal line in the metallization layer, and a first via electrically connected to the first metal line. The first via has a first via...
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7557304 |
Printed circuit board having closed vias
Closed vias are formed in a multilayer printed circuit board by laminating a dielectric layer to one side of a central core having a metal layer on each side. A second dielectric layer is laminated...
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RE40819 |
Semiconductor device with improved bond pads
A semiconductor device with improved bond pads. The semiconductor device includes bond pads electrically connected to an active circuit in the device and openings formed in the bonding surface of...
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7550855 |
Vertically spaced plural microsprings
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
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7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
A semiconductor device comprises a plurality of semiconductor constructions being mutually laminated each having a semiconductor substrate and a plurality of external connection electrodes arranged...
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7547974 |
Wiring substrate with improvement in tensile strength of traces
A wiring substrate with tensile-strength enhanced traces primarily comprises a core layer, a plurality of connecting pads, a plurality of traces, and a solder resist where the connecting pads and...
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7541676 |
Fuse-structure
A metal layer structure is disclosed. The metal layer structure includes a substrate, a first dielectric layer on a surface of the substrate, and at least one first conductor and at least one...
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7540970 |
Methods of fabricating a semiconductor device
Methods of fabricating a semiconductor device are provided. Methods of forming a finer pattern of a semiconductor device using a buffer layer for retarding, or preventing, bridge formation between...
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7538417 |
Semiconductor device with signal line having decreased characteristic impedance
A semiconductor device includes a semiconductor chip, electrodes pads, first and second insulating layers, first and second conductive patterns and external terminals. The electrode pads are formed...
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7535108 |
Electronic component including reinforcing member
A method for manufacturing an electronic component includes: cutting a wiring substrate along a line intersecting with an outline of a reinforcing member, the wiring substrate including a base...
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7535085 |
Semiconductor package having improved adhesiveness and ground bonding
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
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7528491 |
Semiconductor components and assemblies including vias of varying lateral dimensions
Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. A first opening, a second opening, and a third opening are...
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7525190 |
Printed wiring board with wiring pattern having narrow width portion
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b, 58 c and 58 d , and a wiring pattern 58 is...
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7518241 |
Wafer structure with a multi-layer barrier in an UBM layer network device with power supply
A wafer structure including a semiconductor substrate, a number of UBM layers and a number of bumps is provided. The semiconductor substrate has an active surface, a number of bonding pads and a...
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7511351 |
Semiconductor device and method for fabricating the same
In a semiconductor device having a WCSP type construction package, to increase inductance without increasing further an area conventionally occupied by a coil. A pseudo-post part 27 comprising a...
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7511349 |
Contact or via hole structure with enlarged bottom critical dimension
An integrated circuit chip includes a buffer layer, an underlying layer, a dielectric layer, a hole, and barrier layer. The buffer layer is over the underlying layer. The dielectric layer is over...
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7504724 |
Semiconductor device
A semiconductor device comprises: a plurality of first wiring lines formed in a first layer with a first wiring width and a first wiring space; a plurality of second wiring lines formed in a second...
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7495340 |
Metal layer structure of semiconductor device
A metal layer structure of a semiconductor memory device is disclosed. The metal layer structure includes: a first metal layer to be connected to a contact plug; and a plurality of a second metal...
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7495327 |
Chip stacking structure
An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active...
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7489040 |
Interconnection structure of semiconductor device
An interconnection is provided with a dummy interconnection connected to an interconnection body, and the dummy interconnection is provided with a stress concentration portion in which tensile...
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7485952 |
Drop resistant bumpers for fully molded memory cards
A memory card comprising a leadframe having a plurality of contacts, at least one die pad, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad....
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7476974 |
Method to fabricate interconnect structures
A method includes forming a barrier layer on a substrate surface including at least one contact opening; forming an interconnect in the contact opening; and reducing the electrical conductivity of...
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7476965 |
Electronic device with integrated heat distributor
The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components....
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7473459 |
Method of manufacturing a film printed circuit board
A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic...
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7462905 |
Nonvolatile semiconductor memory device, semiconductor device and method of manufacturing nonvolatile semiconductor memory device
A nonvolatile semiconductor memory device includes a semiconductor substrate, a first floating gate formed on a main surface of the semiconductor substrate, a second floating gate formed on the...
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7462887 |
Semiconductor connection component
There is a need for providing a technology capable of decreasing on-resistance of a power transistor in a semiconductor device that integrates the power transistor and a control integrated circuit...
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7459391 |
Semiconductor device and method of fabricating the same
The semiconductor device fabrication method according the present invention having, forming an interlayer dielectric film containing carbon above a semiconductor substrate, forming a protective...
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7453151 |
Methods for lateral current carrying capability improvement in semiconductor devices
A semiconductor structure and methods for forming the same. The semiconductor structure includes (a) a substrate; (b) a first semiconductor device on the substrate; (c) N ILD (Inter-Level...
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7439623 |
Semiconductor device having via connecting between interconnects
A first insulating film is provided between a lower interconnect and an upper interconnect. The lower interconnect and the upper interconnect are connected to each other by way of a via formed in...
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7425766 |
Film substrate, fabrication method thereof, and image display substrate
In a film substrate (FB) including a film base material ( 1 ) and conductor wiring ( 23 ) that is formed on the film base material ( 1 ), the conductor wiring ( 23 ) is arranged such that the...
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7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
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7420211 |
Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof
To provide a technique for manufacturing a wiring line having a low resistance and a high heat resistance so as to make an active matrix type display device larger and finer. The wiring line is...
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7417312 |
Use of solder paste for heat dissipation
A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of...
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7414317 |
BGA package with concave shaped bonding pads
In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish...
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7414301 |
Printed circuit board with soldering lands
The present invention provides a printed circuit board having an area of non-resist portion, where each non-resist portion expands gradually toward the back end of a land array in the dipping...
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7411294 |
Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer
A display device includes a display panel, and the circuit substrate is separately formed and positioned different from the array substrate of the display panel and connected to the display panel....
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