Patents in Class 257/774

Matches 1 - 50 out of 1946

Match	Document	Document Title
1	7622810	Semiconductor device and manufacturing method thereof Disconnection of wiring and deterioration of step coverage are prevented to offer a semiconductor device of high reliability. A pad electrode formed on a silicon die is connected with a...
2	7622804	Semiconductor device and method of manufacturing the same Provided is a semiconductor device including a semiconductor chip, a film (first film) which is provided so as to cover an active region with a peripheral portion of the semiconductor chip being...
3	7621042	Method for mounting electronic components on a substrate A film substrate in a mounting structure of electronic components has positioning holes capable of positioning the electronic components passing therethrough. One surface of each of the electronic...
4	7619311	Memory cell device with coplanar electrode surface and method A memory device described herein includes a bit line having a top surface and a plurality of vias. The device includes a plurality of first electrodes each having top surfaces coplanar with the top...
5	7615487	Power delivery package having through wafer vias An integrated circuit chip package and a method of manufacture thereof are provided. In one embodiment, the integrated circuit chip package comprises a semiconductor die having power and ground...
6	7614141	Fabricating substrates having low inductance via arrangements A low inductance via arrangement for multilayer ceramic (MLC) substrates is provided. With the MLC substrate and via arrangement of the illustrative embodiments, the via-field inductance for a...
7	7612454	Semiconductor device with improved contact fuse One aspect of the invention provides an integrated circuit(IC) [ 400 b ]. The IC comprises transistors [ 410 b ] and contact fuses [ 422 b ]. The contact fuses each comprise a conducting layer [...
8	7612451	Reducing resistivity in interconnect structures by forming an inter-layer An integrated circuit structure having improved resistivity and a method for forming the same are provided. The integrated circuit structure includes a dielectric layer, an opening in the...
9	7605475	Semiconductor device The invention reduces outside dimensions of a semiconductor device mounted with a semiconductor die on an external connection medium and minimizes degradation of electrical characteristics of the...
10	7605458	Method and apparatus for integrating capacitors in stacked integrated circuits Method and apparatus for integrating capacitors in stacked integrated circuits are described. One aspect of the invention relates to a semiconductor assembly having a carrier substrate, a plurality...
11	7605085	Method of manufacturing interconnecting structure with vias First wirings and first dummy wirings are formed in a p-SiOC film formed on a substrate. A p-SiOC film is formed, and a cap film is formed on the p-SiOC film. A dual damascene wiring, including...
12	7605080	Semiconductor device and method of manufacturing the same In a method of manufacturing a semiconductor device having a through electrode 56 that connects an electrode pad 20 of a semiconductor element 14, which has a device forming layer 18 and...
13	7602064	Semiconductor device having an inspection hole striding a boundary The semiconductor device includes a semiconductor substrate, a diffusion layer, an interconnect layer, a contact plug, a contact-inspection hole, a via plug, and a via-inspection hole. Similarly to...
14	7602055	Semiconductor device and method for fabricating the same A semiconductor device with a WLP structure that enables the improvement of heat resistance. A dam layer which spreads over a PI film and an Si substrate for a chip is formed between the Si...
15	7598617	Stack package utilizing through vias and re-distribution lines A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof...
16	7598616	Interconnect structure A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in...
17	7595559	Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip Packaged integrated circuit devices include a package substrate and a multi-chip stack of integrated circuit devices on the package substrate. The multi-chip stack includes at least one chip-select...
18	7595558	Semiconductor device and method of manufacturing the same A semiconductor device includes a first well formed in a predetermined region of a semiconductor substrate, a second well formed in a predetermined region in the first well, and a third well formed...
19	7595557	Semiconductor device and manufacturing method thereof A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal...
20	7595556	Semiconductor device and method for manufacturing the same Embodiments relate to a semiconductor device and a method for manufacturing the same. According to embodiments, the semiconductor device may include a semiconductor substrate formed with a metal...
21	7595554	Interconnect structure with dielectric air gaps An interconnect structure with improved performance and capacitance by providing air gaps inside the dielectric layer by use of a multi-phase photoresist material. The interconnect features are...
22	7595549	Surface mount semiconductor device A surface mount semiconductor device using a lead frame can suppress stress applied to a package by a load in a forming process performed for the lead frame projecting from the package at a portion...
23	7592704	Etched interposer for integrated circuit devices In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected...
24	7592703	RF and MMIC stackable micro-modules A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The method comprises, first, providing a substrate. The substrate is...
25	7592700	Semiconductor chip and method of manufacturing semiconductor chip A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an...
26	7589425	Method of manufacturing a semiconductor device having damascene structures with air gaps A method of manufacturing a semiconductor device having damascene structures with air gaps is provided. In one embodiment, the method comprises providing a substantially planar layer having a first...
27	7589424	Thin silicon based substrate Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build...
28	7589411	Device for electrical connection of an integrated circuit chip A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the...
29	7589410	Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package A stack package includes at least two stacked package units. Each package unit comprises semiconductor chips having bonding pads on upper surfaces thereof; a molding part formed to surround side...
30	7589394	Interposer An interposer is constructed with a substrate body having first and second through-holes, a capacitor formed by a laminating dielectric layer and a second electrode portion on a first electrode...
31	7589390	Shielded through-via A shielded through-via that reduces the effect of parasitic capacitance between the through-via and surrounding wafer while providing high isolation from neighboring signals. A shield electrode is...
32	7589379	Power semiconductor and method of fabrication This invention is generally concerned with power semiconductors such as power MOS transistors, insulated gate by bipolar transistors (IGBTs), high voltage diodes and the like, and methods for their...
33	7589011	Semiconductor device and method of forming intermetal dielectric layer There is provided a semiconductor device in which extension units are formed in the ends of a slit that constitutes a slit pattern to relieve stress transmitted between interconnect layers. The...
34	7586196	Apparatus for an improved air gap interconnect structure In one embodiment, an apparatus comprises a first layer having at least one interconnect formed in an interlayer dielectric (ILD), a second layer formed over the first layer having a second at...
35	7582972	Semiconductor device and fabrication method thereof A semiconductor device includes a semiconductor substrate with circuit elements and electrode pads formed on one surface. This surface is covered by a dielectric layer with openings above the...
36	7582971	Semiconductor device and manufacturing method of the same The invention is directed to a semiconductor device having a penetrating electrode and a manufacturing method thereof in which reliability and a yield of the semiconductor device are enhanced. A...
37	7582959	Driver module structure with flexible circuit board A driver module structure includes a flexible circuit board ( 2 ) provided with a wiring pattern ( 7 ), a semiconductor device mounted on the flexible circuit board ( 2 ), and an electrically...
38	7579685	Wafer level packaging cap and fabrication method thereof A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on...
39	7576435	Low-cost and ultra-fine integrated circuit packaging technique A semiconductor package structure and the methods for forming the same are provided. The semiconductor package structure includes an interposer; a first plurality of bonding pads on a side of the...
40	7576433	Semiconductor memory device and manufacturing method thereof A semiconductor memory device has a plurality of core chips and an interface chip, whose specification can be easily changed, while suppressing the degradation of its reliability. The device has an...
41	7576421	Semiconductor device having a multi-layered semiconductor substrate A semiconductor device includes an interface chip and a plurality of DRAM chips consecutively layered on the interface chip. A plurality of source electrodes, a plurality of ground electrodes, and...
42	7576401	Direct glass attached on die optical module An optical module includes an image sensor having an active area and a window mounted directly to the image sensor above the active area. The optical module further includes a mount mounted to the...
43	7573135	Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an...
44	7573116	Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device A method used to fabricate a semiconductor device comprises etching a dielectric layer, resulting in an undesirable charge buildup along a sidewall formed in the dielectric layer during the etch....
45	7572730	Method of manufacturing wiring substrate, liquid ejection head and image forming apparatus The method of manufacturing a wiring substrate includes the steps of: filling conductive material into a through hole and a non-through hole of a substrate; removing the conductive material filled...
46	7569486	Spin on glass (SOG) etch improvement method A system and method of preventing pattern lifting during a trench etch/clean process is disclosed. A first layer comprising a first dip is formed over a first via pattern. A trench resist layer is...
47	7566976	Semiconductor device and method for fabricating the same A semiconductor device has a porous low-dielectric-constant film formed on a substrate and having an opening and a fine particle film composed of a plurality of aggregately deposited fine particles...
48	7566973	Semiconductor device and method of manufacturing the same The method of manufacturing a semiconductor device according to the present invention includes: forming an interconnect trench in an insulating film formed on a semiconductor substrate (S 100 );...
49	7566969	Semiconductor device with improved arrangement of a through-hole in a wiring substrate To miniaturize a semiconductor device, a package substrate is provided having terminals formed on the main surface, lands formed on the back surface, through holes formed by laser beam machining...
50	7564137	Stackable integrated circuit structures and systems devices and methods related thereto An apparatus and a method for packaging semiconductor devices. The apparatus is a three-dimensional electronic package comprising one or more electronic components, a plurality of electrical...

Matches 1 - 50 out of 1946

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