Matches 1 - 50 out of 2101 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7425758 Metal core foldover package structures  
Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The...
7423340 Semiconductor package free of substrate and fabrication method thereof  
A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of...
7420285 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument  
A semiconductor device comprising: a semiconductor element having a plurality of electrodes; a passivation film formed on the semiconductor element in a region avoiding at least a part of each of...
7420284 Semiconductor device and manufacturing method thereof  
A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings...
7417327 IC chip package with cover  
An IC (integrated circuit) chip package includes a substrate ( 2 ), a chip ( 3 ), a plurality of bonding wires ( 32 ), and a cover ( 5 ). The substrate has a top surface, a bottom surface, a...
7417321 Via structure and process for forming the same  
Via structure and process flow for interconnection in a semiconductor product. A bottom metal layer is provided to represent a connection layer in the semiconductor product. An isolation layer on...
7417320 Substrate structure and manufacturing method of the same  
A Ti film is pattern-formed on a desired portion on a silicon substrate, and a Co film is formed on the substrate so as to cover the Ti film. CNTs are formed only on a portion, under which the Ti...
7417319 Semiconductor device with connecting via and dummy via and method of manufacturing the same  
An underlying interconnect including a first barrier metal layer, an interconnect metal layer and a second barrier metal layer is formed on a semiconductor substrate, and an interlayer dielectric...
7417318 Thick film circuit board, method of producing the same and integrated circuit device  
A thick film circuit board that can be produced at a low cost, a method of producing the same, and an integrated circuit device. A first thick film circuit board has conducting layers of a...
7417317 Post passivation interconnection schemes on top of the IC chips  
A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on...
7417314 Semiconductor chip assembly with laterally aligned bumped terminal and filler  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that...
7417302 Semiconductor device and method of manufacturing the same  
In a method of manufacturing a semiconductor device, a first insulation layer on the substrate is patterned to form a first opening having a first width. A lower electrode is formed along an inner...
7416974 Method of manufacturing semiconductor device, and semiconductor device  
A method of manufacturing a semiconductor device, comprising a first step of forming a layer insulation film on a lower layer wiring provided on a substrate and forming a connection hole in the...
7416973 Method of increasing the etch selectivity in a contact structure of semiconductor devices  
By providing an additional silicon dioxide based etch stop layer, a corresponding etch process for forming contact openings for directly connecting polysilicon lines and active areas may be...
7414316 Methods and apparatus for thermal isolation in vertically-integrated semiconductor devices  
A semiconductor structure ( 100 ) includes a first substrate ( 110 ) having a first semiconductor device ( 112 ) formed therein, a second substrate ( 120 ) having a second device ( 122 ) formed...
7414309 Encapsulated electronic part packaging structure  
An encapsulated electronic part packaging structure includes a step of mounting an electronic part having a connection terminal and a passivating film to cover the connection terminal, mounted on a...
7414301 Printed circuit board with soldering lands  
The present invention provides a printed circuit board having an area of non-resist portion, where each non-resist portion expands gradually toward the back end of a land array in the dipping...
7414275 Multi-level interconnections for an integrated circuit chip  
Multilevel metallization layouts for an integrated circuit chip including transistors having first, second and third elements to which metallization layouts connect. The layouts minimize current...
7414257 Switching device for configurable interconnect and method for preparing the same  
The present invention relates to a switching device to be irreversibly switched from an electrically isolating off-state into an electrically conducting on-state for use in a configurable...
7413978 Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus  
A contact structure, including: a first conductive layer; a insulating layer formed on the first conductive layer; a second conductive layer formed on the insulating layer; and a columnar...
7411305 Interconnect structure encased with high and low k interlevel dielectrics  
A structure for improving the electrostatic discharge robustness of an integrated circuit having an electrostatic discharge (ESD) device and a receiver network connected to a pad by interconnects....
7411303 Semiconductor assembly having substrate with electroplated contact pads  
An apparatus comprising an insulating substrate having first and second surfaces and a plurality of metal-filled vias extending from the first to the second surface. The first and second surfaces...
7411301 Semiconductor integrated circuit device  
In a semiconductor integrated circuit device having plural layers of buried wirings, it is intended to prevent the occurrence of a discontinuity caused by stress migration at an interface between a...
7411294 Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer  
A display device includes a display panel, and the circuit substrate is separately formed and positioned different from the array substrate of the display panel and connected to the display panel....
7411285 Low profile stacked semiconductor chip package  
A stacked semiconductor chip package comprising a first semiconductor chip having an upper surface, a lower surface opposed to said upper surface, and a plurality of conductive metal lines formed...
7408241 Semiconductor device with a recessed bond pad  
A semiconductor device with surface-mountable outer contacts and to a process for producing it is disclosed. In one embodiment, surface-mountable outer contacts are arranged on outer contact...
7408215 Dynamic random access memory  
A DRAM structure on a silicon substrate has an active area, gate conductors, deep trench capacitors, and vertical transistors. The deep trench capacitors are formed at intersections of the active...
7408181 Phase-change memory device and method of manufacturing the same  
Disclosed are a phase-change memory device and its manufacturing method, which can reduce a contact area between a bottom electrode and a phase-change layer, thereby reducing the quantity of...
7405474 Low cost thermally enhanced semiconductor package  
In one embodiment, a device is packaged using a low-cost thermally enhanced ball grid array (LCTE-BGA) package. The device may include a die with its backside mounted to the bottom side of a...
7405470 Adaptable electronic storage apparatus  
A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12 a disposed on the first...
7405419 Unidirectionally conductive materials for interconnection  
A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie...
7402883 Back end of the line structures with liner and noble metal layer  
A back end of the line (BEOL) structure of a semiconductor device is presented. In one embodiment, the structure may include a first liner layer disposed on an intermediate interconnect structure,...
7402515 Method of forming through-silicon vias with stress buffer collars and resulting devices  
A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding...
7400046 Semiconductor device with guard rings that are formed in each of the plural wiring layers  
A semiconductor IC device which includes a circuit region and a peripheral region on a main surface of a semiconductor substrate, a first insulating film formed over the main surface, external...
7400039 Semiconductor device and semiconductor package  
For delivering supply power evenly into chip, a semiconductor device includes plural power supply pads 17 a and grounding pads 18 a , arranged in alternation in X-direction. The device also...
7400028 Semiconductor device  
The present invention provides a technique for improving the reliability of a semiconductor device where spreading of cracking that occurs at the time of dicing to a seal ring can be restricted...
7400025 Integrated circuit inductor with integrated vias  
Integrated circuit inductors ( 5 ) are formed by interconnecting various metal layers ( 10 ) in an integrated circuit with continuous vias ( 200 ). Using continuous vias ( 200 ) improves the Q...
7399661 Method for making an integrated circuit substrate having embedded back-side access conductors and vias  
A method for making an integrated circuit substrate having embedded back-side access conductors and vias provides a high-density mounting and interconnect structure for integrated circuits that is...
7397130 Semiconductor devices with contact holes self-aligned in two directions  
A method of forming a semiconductor device can include forming a plurality of gate structure patterns including gates and first mask patterns stacked on a semiconductor substrate, the gate...
7397129 Interposers with flexible solder pad elements  
Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are...
7397128 Semiconductor device and method of manufacturing the same  
Disclosed is a semiconductor device in which emitter pad electrodes connected to an active region, collector and base pad electrodes are formed on a surface of a semiconductor substrate....
7397125 Semiconductor device with bonding pad support structure  
A semiconductor device having bonding pads on a semiconductor substrate includes: an upper copper layer that is formed on the lower surface of the bonding pads with a barrier metal interposed and...
7394164 Semiconductor device having bumps in a same row for staggered probing  
A semiconductor device has a plurality of bumps in a same row for staggered probing. The bumps in a same row are disposed on a chip and include a plurality of regular bumps and a plurality of...
7394160 Printed wires arrangement for in-line memory (IMM) module  
An inline memory module (IMM) architecture may include: a printed circuit board (PCB); a first array of memory devices on a first side of the PCB; a second array of memory devices on a second side...
7394159 Delamination reduction between vias and conductive pads  
Vias and conductive pads configured and coupled in a manner to reduce delamination are described herein. The via and the conductive pads may be located in a substrate such as a carrier substrate, a...
7393782 Process for producing layer structures for signal distribution  
Structures for signal distribution are produced by applying a metallic seed layer over a semiconductor body. An insulating layer is applied over the metallic seed layer and openings in the...
7393770 Backside method for fabricating semiconductor components with conductive interconnects  
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a...
7391115 Semiconductor device and manufacturing method thereof  
An object of the present invention is to provide a semiconductor device which comprises a barrier film having a high etching selection ratio of the interlayer insulating film thereto, a good...
7391114 Electrode pad section for external connection  
A pad section serving as an electrode for external connection of a semiconductor device includes a first pad metal ( 61 ) formed in the top layer, a second pad metal ( 62 ) formed under the first...
7388439 Low pass filter and electronic device  
The electronic device ( 100 ) of the invention comprises a semiconductor device ( 30 ) and a low-pass filter ( 20 ), which are present in a stacked configuration, and which together include a phase...
Matches 1 - 50 out of 2101 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >