Matches 251 - 300 out of 1960 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7397128 Semiconductor device and method of manufacturing the same  
Disclosed is a semiconductor device in which emitter pad electrodes connected to an active region, collector and base pad electrodes are formed on a surface of a semiconductor substrate....
7397125 Semiconductor device with bonding pad support structure  
A semiconductor device having bonding pads on a semiconductor substrate includes: an upper copper layer that is formed on the lower surface of the bonding pads with a barrier metal interposed and...
7397129 Interposers with flexible solder pad elements  
Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are...
7393770 Backside method for fabricating semiconductor components with conductive interconnects  
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a...
7394164 Semiconductor device having bumps in a same row for staggered probing  
A semiconductor device has a plurality of bumps in a same row for staggered probing. The bumps in a same row are disposed on a chip and include a plurality of regular bumps and a plurality of...
7394160 Printed wires arrangement for in-line memory (IMM) module  
An inline memory module (IMM) architecture may include: a printed circuit board (PCB); a first array of memory devices on a first side of the PCB; a second array of memory devices on a second side...
7394159 Delamination reduction between vias and conductive pads  
Vias and conductive pads configured and coupled in a manner to reduce delamination are described herein. The via and the conductive pads may be located in a substrate such as a carrier substrate, a...
7393782 Process for producing layer structures for signal distribution  
Structures for signal distribution are produced by applying a metallic seed layer over a semiconductor body. An insulating layer is applied over the metallic seed layer and openings in the...
7391115 Semiconductor device and manufacturing method thereof  
An object of the present invention is to provide a semiconductor device which comprises a barrier film having a high etching selection ratio of the interlayer insulating film thereto, a good...
7391114 Electrode pad section for external connection  
A pad section serving as an electrode for external connection of a semiconductor device includes a first pad metal ( 61 ) formed in the top layer, a second pad metal ( 62 ) formed under the first...
7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions  
An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided...
7388256 Semiconductor device and a method of manufacturing the same  
In a technique to improve the high-frequency power gain of an LDMOS, the distance from the surface of a passivation film covering electrode pads to the rear surface of a silicon substrate is set...
7388439 Low pass filter and electronic device  
The electronic device ( 100 ) of the invention comprises a semiconductor device ( 30 ) and a low-pass filter ( 20 ), which are present in a stacked configuration, and which together include a phase...
7385287 Preventing damage to low-k materials during resist stripping  
A method of forming a feature in a low-k dielectric layer is provided. A low-k dielectric layer is placed over a substrate. A patterned photoresist mask is placed over the low-k dielectric layer....
7385283 Three dimensional integrated circuit and method of making the same  
A three dimensional integrated circuit structure includes at least first and second devices, each device comprising a substrate and a device layer formed over the substrate, the first and second...
7382060 Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts  
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit...
7382052 Post passivation interconnection schemes on top of IC chip  
A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on...
7382054 Method for forming self-aligned contacts and local interconnects simultaneously  
The present invention relates generally to semiconductors, and more specifically to semiconductor memory device structures and an improved fabrication process for making the same. The improved...
7382055 Integrated thin-film resistor with direct contact  
A BEOL thin-film resistor adapted for flexible integration rests on a first layer of ILD. The thickness of the first layer of ILD and the resistor thickness combine to match the nominal design...
7382053 Power supply wiring structure  
Provided is a power supply wiring structure which comprises a first and a second power supply wirings, which are disposed on different planes to cross each other two-dimensionally. The first and...
7382037 Semiconductor device with a peeling prevention layer  
The invention is directed to improvement of reliability of a semiconductor device having penetrating electrodes by preventing a protection film and an insulation film peeling. A peeling prevention...
7382005 Circuit component with bump formed over chip  
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the...
7378744 Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistance  
A method of manufacturing a semiconductor device contact including forming an insulating layer over a substrate and forming an agglutinating layer over the insulating layer. The agglutinating layer...
7378745 Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns  
A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together...
7375428 Flip-chip bonding structure using multi chip module-deposited substrate  
Flip-chip bonding structures using an MCM-D substrate are disclosed. A flip-chip bonding structure using an MCM-D substrate includes: a silicon substrate, a Si-bump disposed at a predetermined...
7375432 Via attached to a bond pad utilizing a tapered interconnect  
An interconnect includes a pad and at least two vias coupled to the pad. In one embodiment, the pad has five substantially straight edges, one via directly coupled to the pad by being formed...
7372163 Semiconductor device and production method therefor  
A semiconductor device provided with: a first interconnection layer provided on a semiconductor substrate; an interlevel insulation film provided over the first interconnection layer; a second...
7371602 Semiconductor package structure and method for manufacturing the same  
A semiconductor package structure comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an optical component...
7372165 Method for making a semiconductor device having increased conductive material reliability  
A method and apparatus for a semiconductor device having a semiconductor device having increased conductive material reliability is described. That method and apparatus comprises forming a...
7372143 Printed circuit board including via contributing to superior characteristic impedance  
A via is formed in a printed circuit board to penetrate through an insulating layer. A guard pattern, made of an electrically-conductive material, extends on the front surface of the insulating...
7372166 Sublithographic contact structure, phase change memory cell with optimized heater shape, and manufacturing method thereof  
An electronic semiconductor device has a sublithographic contact area between a first conductive region and a second conductive region. The first conductive region is cup-shaped and has vertical...
7372164 Semiconductor device with parallel interconnects  
A semiconductor forming transistors on a semiconductor substrate includes a low concentration source/drain region formed in the semiconductor substrate, a high concentration source/drain region...
7368666 Surface-mounting type electronic circuit unit without detachment of solder  
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
7368806 Flip chip package with anti-floating structure  
A flip chip package with an anti-floating structure includes a leadframe, a flip chip, and a plurality of solders. The leadframe includes a plurality of leads and a fastening part. At least one...
7365001 Interconnect structures and methods of making thereof  
A method of making a diffusion barrier for a interconnect structure. The method comprises: providing a conductive line in a bottom dielectric trench; depositing a sacrificial liner on the cap...
7365435 Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid  
A printed circuit board (PCB) assembly having a plurality of circuit layers including outer layers and intervening layers with through-vias and micro-vias used to translate a portion of the signal...
7365440 Semiconductor device and fabrication method thereof  
A semiconductor device includes a second insulating film formed on a second surface of a semiconductor substrate whose first surface has been formed with a first insulating film and an electrode...
7365434 Semiconductor device and manufacturing method for the same  
To provide a semiconductor device with high performance and reliability, in which peeling off an interconnection layer caused due to peeling off of a resin film at a land part is suppressed and...
7365413 Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern  
Electrical interconnects with a slotting pattern are provided in the present invention. In addition, the masks for making such interconnects and semiconductor devices incorporating such...
7365436 Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same  
A disclosed substrate includes a base member having a through-hole, and a conductive metal filling in the through-hole so as to form a penetrating via. The penetrating via contains a conductive...
7365421 IC chip package with isolated vias  
An IC chip package includes a substrate ( 2 ), a chip ( 5 ), a plurality of bonding wires ( 52 ), and a cover ( 6 ). The substrate has a top surface, a receiving chamber ( 23 ) having an opening at...
7365433 High-frequency semiconductor device and method of manufacturing the same  
The object of the present invention is to implement an enhancement in a noise eliminating characteristic of a wiring compatibly with promotion of microfabrication and simplification of a...
7365437 Method of wet etching vias and articles formed thereby  
A method for forming smooth walled, prismatically-profiled through-wafer vias and articles formed through the method. An etch stop material is provided on a wafer, which may be a <110>...
7361994 System to control signal line capacitance  
A system may include a conductive plane defining a non-conductive antipad area and a second non-conductive area extending from the antipad area in at least a first direction, a dielectric plane...
7361991 Closed air gap interconnect structure  
A closed air gap interconnect structure is described. The structure includes discrete regions of a permanent support dielectric under the interconnect lines so that the lines are substantially...
7361992 Semiconductor device including interconnects formed by damascene process and manufacturing method thereof  
After etching the interlayer dielectric film 4 formed on the lower layer interconnect line 1 into a shape with holes, the upper layer dielectric film 6 is etched into a shape with trenches...
7358170 Methods of forming conductive interconnects, and methods of depositing nickel  
The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The electroless plating can utilize a bath which...
7358602 Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer  
A semiconductor chip includes: a semiconductor substrate; a penetrating electrode which is formed through the semiconductor substrate from a first surface to a second surface of the semiconductor...
7358613 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a plurality of wirings each wiring including a metal wiring layer, a first barrier metal layer disposed on the metal wiring layer, a second barrier metal layer...
7355290 Interposer and method for fabricating the same  
The interposer comprises a base 8 formed of a plurality of resin layers 68, 20, 32, 48 ; thin-film capacitors 18 a , 18 b buried between a first resin layer 68 of said plurality of resin...
Matches 251 - 300 out of 1960 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >