Patents in Class 257/773

Matches 1 - 50 out of 1806

Match	Document	Document Title
1	7622757	Semiconductor device having multiple wiring layers A semiconductor device comprises a plurality of semiconductor elements; and a first wire and a second wire provided to connect the semiconductor elements in parallel. The first wire and the second...
2	7622329	Method for fabricating core substrate using paste bumps A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps...
3	7615864	Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor...
4	7612439	Semiconductor package having improved thermal performance A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation...
5	7608891	Thin film transistor, circuit apparatus and liquid crystal display A thin film transistor includes a one conductive type semiconductor layer ( 11 ); a source region ( 12 ) and a drain region ( 13 ) which are separately provided in the semiconductor layer; and a...
6	7605474	Structure of polymer-matrix conductive film and method for fabricating the same A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
7	7605473	Nonvolatile memory devices Methods of fabricating nonvolatile memory devices are provided. An isolation layer is formed on a substrate. The substrate has a memory region and a well contact region and the isolation layer...
8	7602068	Dual-damascene process to fabricate thick wire structure A method and semiconductor device. In the method, at least one partial via is etched in a stacked structure and a border is formed about the at least one partial via. The method further includes...
9	7602064	Semiconductor device having an inspection hole striding a boundary The semiconductor device includes a semiconductor substrate, a diffusion layer, an interconnect layer, a contact plug, a contact-inspection hole, a via plug, and a via-inspection hole. Similarly to...
10	7602058	Flip-chip semiconductor device with improved power pad arrangement A semiconductor device is composed of a power supply interconnection extending from a certain starting point in a first direction and also extending from the starting point in a second direction...
11	7602019	Drive circuit and drain extended transistor for use therein A transistor comprises a source region of a first conductivity type and electrically communicating with a first semiconductor region. The transistor also comprises a drain region of the first...
12	7601630	Semiconductor device and method for fabricating the same A method of fabricating a semiconductor memory device and a structure that forms both a resistor and an etching protection layer to reduce a contact resistance. The method of fabricating a...
13	7598617	Stack package utilizing through vias and re-distribution lines A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof...
14	7598609	Structure of polymer-matrix conductive film and method for fabricating the same A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
15	7596862	Method of making a circuitized substrate A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially...
16	7595562	Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically...
17	7595561	Semiconductor device including multiple rows of peripheral circuit units In a semiconductor device including an internal circuit, multiple rows of peripheral circuit units are electrically connected to the internal circuit and arranged on at least one peripheral edge of...
18	7595557	Semiconductor device and manufacturing method thereof A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal...
19	7595549	Surface mount semiconductor device A surface mount semiconductor device using a lead frame can suppress stress applied to a package by a load in a forming process performed for the lead frame projecting from the package at a portion...
20	7592705	Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device A method and apparatus for partially strapping two polysilicon lines, each having a first end and second end, uses a metal line having a plurality of spaced apart metal segments with each metal...
21	7592703	RF and MMIC stackable micro-modules A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The method comprises, first, providing a substrate. The substrate is...
22	7592702	Via heat sink material The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be...
23	7592701	Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure An electrode structure includes at least a contact button portion that has a portion of multilayer structure of two or more conductor layers stacked and enlarged in area. A part mounting structure...
24	7592244	Semiconductor device and method of manufacturing the same A method of manufacturing a semiconductor device includes the step of forming a first insulating section with a protruding section on a semiconductor substrate, the step of forming a first...
25	7589419	Side connectors for RFID chip An RFID chip can have an RFID circuit having first and second initial bond pads and conductive paths on the RFID chip connecting the first and second bond pads to the different sides of the chip....
26	7589411	Device for electrical connection of an integrated circuit chip A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the...
27	7589388	Semiconductor device and method of manufacturing the same The invention is directed to providing a package type semiconductor device with high reliability and smaller size and a method of manufacturing the same. A semiconductor substrate formed with a...
28	7586199	Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging...
29	7586188	Chip package and coreless package substrate thereof A chip package includes a coreless package substrate and a chip. The coreless package substrate includes an interconnection structure and a ceramic stiffener. The interconnection structure has a...
30	7586187	Interconnect structure with stress buffering ability and the manufacturing method thereof An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic...
31	7586186	Ball grid array A ball grid array includes: a semiconductor chip having multiple pads; and an interposer for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings on the...
32	7582974	Semiconductor device and method of manufacturing same A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted;...
33	7579696	Semiconductor device A semiconductor device includes an effective wire formed above a substrate in a multilayer interconnection structure and having a first electrode pad in a top layer; a first reinforcing material...
34	7579693	Mounting structure of ball grid array A ball grid array is mounted on a wiring board in a rectangular shape provided with screw insertion holes and fixed with screws to a mounting member at four points. Solder banks are formed around...
35	7579692	Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad...
36	7579685	Wafer level packaging cap and fabrication method thereof A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on...
37	7579681	Super high density module with integrated wafer level packages A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
38	7576437	Printed circuit board of semiconductor package and method for mounting semiconductor package using the same Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving...
39	7576390	System for vertical DMOS with slots A method for providing a high power, low resistance, high efficient vertical DMOS device is disclosed. The method comprises providing a semiconductor substrate with a source body structure thereon....
40	7575994	Semiconductor device and manufacturing method of the same The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film...
41	7573135	Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an...
42	7572730	Method of manufacturing wiring substrate, liquid ejection head and image forming apparatus The method of manufacturing a wiring substrate includes the steps of: filling conductive material into a through hole and a non-through hole of a substrate; removing the conductive material filled...
43	7572681	Embedded electronic component package A method of forming an embedded electronic component package includes coupling a substrate to a first dielectric layer, strip, or panel, and forming first electrically conductive vias and traces in...
44	7569938	Interconnections for integrated circuits An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described....
45	7569936	Semiconductor device and method of manufacturing the same A semiconductor device which is capable of avoiding an increase in pattern ratio and allowing wiring dummy patterns to improve global steps developed by CMP upon insertion of the dummy patterns...
46	7567424	Electronic component This electronic component comprises a substrate; and a capacitor part provided on the substrate, the capacitor part includes a first electrode part provided on the substrate; a dielectric film...
47	7566976	Semiconductor device and method for fabricating the same A semiconductor device has a porous low-dielectric-constant film formed on a substrate and having an opening and a fine particle film composed of a plurality of aggregately deposited fine particles...
48	7566585	Semiconductor component and method for production of a semiconductor component A semiconductor substrate, a semiconductor chip and a semiconductor component with areas composed of a stressed monocrystalline material, and a method for production of a semiconductor component is...
49	7564137	Stackable integrated circuit structures and systems devices and methods related thereto An apparatus and a method for packaging semiconductor devices. The apparatus is a three-dimensional electronic package comprising one or more electronic components, a plurality of electrical...
50	7564136	Integration scheme for Cu/low-k interconnects A semiconductor structure having an opening formed in a porous dielectric layer is provided. The exposed pores of the dielectric layer along the sidewalls of the opening are sealed. The sealing may...

Matches 1 - 50 out of 1806

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