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7619257 |
Devices including graphene layers epitaxially grown on single crystal substrates
An electronic device comprises a body including a single crystal region on a major surface of the body. The single crystal region has a hexagonal crystal lattice that is substantially...
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7618884 |
Method and device with durable contact on silicon carbide
A Schottky barrier silicon carbide device has a Re Schottky metal contact. The Re contact 27 is thicker than 250 Angstroms and may be between 2000 and 4000 Angstroms. A termination structure is...
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7615788 |
Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry
A device and method of forming electronics and microelectromechanical on a silicon carbide substrate having a slow etch rate is performed by forming circuitry on the substrate. A protective layer...
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7615203 |
Single crystal diamond
A single crystal diamond grown by vapor phase synthesis, wherein when one main surface is irradiated with a linearly polarized light considered to be the synthesis of two mutually perpendicular...
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7612501 |
Plasma display apparatus comprising connector
A plasma display apparatus comprising a connector is provided. The plasma display apparatus comprises a plasma display panel comprising an electrode of a predetermined width and a connector...
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7608524 |
Method of and system for forming SiC crystals having spatially uniform doping impurities
In a physical vapor transport method and system, a growth chamber charged with source material and a seed crystal in spaced relation is provided. At least one capsule having at least one capillary...
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7601986 |
Epitaxial semiconductor structures having reduced stacking fault nucleation sites
Epitaxial silicon carbide layers are fabricated by forming features in a surface of a silicon carbide substrate having an off-axis orientation toward a crystallographic direction. The features...
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7601441 |
One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer
A single polytype single crystal silicon carbide wafer is disclosed having a diameter greater than three inches and less than five inches, resistivity greater than 10,000 ohm-cm, a micropipe...
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7591699 |
Method of manufacturing light-emitting element including the emission layer and the carrier transfer layer
Methods of manufacturing light-emitting elements including providing an emissive layer and a carrier transfer layer between a pair of electrodes, the carrier transfer layer mainly made of an...
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7582932 |
Silicon carbide semiconductor device and method for manufacturing the same
A silicon carbide semiconductor device includes: a semiconductor substrate having a silicon carbide substrate, a first semiconductor layer, a second semiconductor layer, and a third semiconductor...
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7579626 |
Silicon carbide layer on diamond substrate for supporting group III nitride heterostructure device
A high power, wide-bandgap device is disclosed that exhibits reduced junction temperature and higher power density during operation and improved reliability at a rated power density. The device...
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7569900 |
Silicon carbide high breakdown voltage semiconductor device
A semiconductor device includes an SiC substrate, an SiC layer of a first conductivity type disposed on the upper surface of the SiC substrate, a first SiC region of a second conductivity type...
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7569496 |
Method for manufacturing SiC semiconductor device
A method for manufacturing a SiC semiconductor device includes: forming an impurity layer in a SiC layer; and forming an oxide film on the SiC layer. The forming the impurity layer includes:...
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7569425 |
Method for manufacturing thermal interface material with carbon nanotubes
A method for manufacturing a thermal interface material includes the steps of: (a) forming an array of carbon nanotubes on a substrate; (b) submerging the carbon nanotubes in a liquid...
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7564062 |
Electrode for p-type SiC
A p-type electrode containing a first electrode material exhibiting an eutectic reaction at a temperature of 600° C. or lower, and a second electrode material of aluminum (Al).
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7557378 |
Boron aluminum nitride diamond heterostructure
A heterostructure having a heterojunction comprising: a diamond layer; and a boron aluminum nitride (B (x) Al (1−x) N) layer disposed in contact with a surface of the diamond layer, where x is...
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7553693 |
Method for making a field effect transistor with diamond-like carbon channel and resulting transistor
The field effect transistor comprises a source and a drain connected by a channel controlled by a gate electrode separated from the channel by a gate insulator. The channel is formed by a...
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7544970 |
Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
The temperature of a bipolar semiconductor element using a wide-gap semiconductor is raised using heating means, such as a heater, to obtain a power semiconductor device being large in controllable...
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7544249 |
Large-diameter SiC wafer and manufacturing method thereof
From the viewpoint of manufacturing an SiC semiconductor device economically, a present Si device manufacturing line is utilized to make it possible to handle a small-diameter SiC wafer....
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7538353 |
Composite barrier/etch stop layer comprising oxygen doped SiC and SiC for interconnect structures
A dual damascene structure comprising a composite barrier/etch stop layer including a lower silicon carbide (SiC) layer and an upper first oxygen doped SiC layer formed over a substrate is...
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7538352 |
Semiconductor device and power converter, driving inverter, general-purpose inverter and high-power high-frequency communication device using same
In a semiconductor device that uses a silicon carbide semiconductor substrate having p type, n type impurity semiconductor regions formed by ion implantation, the electrical characteristics of the...
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7535025 |
Structure and manufacturing method for a silicon carbide semiconductor device
In silicon carbide semiconductor device and manufacturing method therefor, a metal electrode which is another than a gate electrode and which is contacted with a singlecrystalline silicon carbide...
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7531840 |
Light emitting diode with metal coupling structure
An electronic device includes a conductive n-type substrate, a Group III nitride active region, an n-type Group III-nitride layer in vertical relationship to the substrate and the active layer, at...
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7528424 |
Integrated circuitry
This invention includes methods of forming layers comprising epitaxial silicon, and field effect transistors. In one implementation, a method of forming a layer comprising epitaxial silicon...
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7528413 |
Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly...
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7525129 |
Organic light-emitting display
It is an object of the present invention to provide an organic light-emitting display of high light-emitting efficiency. The organic light-emitting element comprising a board, upper electrode,...
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7508045 |
SiC Schottky barrier semiconductor device
A semiconductor device includes a first-conductivity-type SiC substrate, a first-conductivity-type SiC semiconductor layer formed on the substrate, whose impurity concentration is lower than that...
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7508000 |
Method of fabricating self-aligned silicon carbide semiconductor devices
Methods of constructing silicon carbide semiconductor devices in a self-aligned manner. According to one aspect of the invention, the method may include forming a mesa structure in a multi-layer...
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7507999 |
Semiconductor device and method for manufacturing same
An accumulation-mode MISFET comprises: a high-resistance SiC layer 102 epitaxially grown on a SiC substrate 101 ; a well region 103 ; an accumulation channel layer 104 having a multiple...
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7495249 |
Radiation-emitting semiconducting body with confinement layer
A radiation-emitting semiconductor with a radiation-emitting active layer having In x Al y Ga 1-x-y P (0≦x≦1, 0≦y≦1, 0≦x+y≦1) is described. The active layer is arranged between a first...
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7488984 |
Doping of SiC structures and methods associated with same
Doped silicon carbide structures, as well as methods associated with the same, are provided. The structures, for example, are components (e.g., layer, patterned structure) in MEMS structures. The...
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7485895 |
Silicon carbide semiconductor device
A silicon carbide semiconductor device is provided with a semiconductor substrate ( 20 ) of silicon carbide of a first conductivity type, a hetero semiconductor region ( 60 ) forming a...
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7482068 |
Lightly doped silicon carbide wafer and use thereof in high power devices
A uniform silicon carbide single crystal with either an n-type or a p-type conductivity. The crystal has a net carrier concentration less than 10 15 cm −3 and a carrier lifetime of at least 50...
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7481879 |
Diamond single crystal substrate manufacturing method and diamond single crystal substrate
A diamond single crystal substrate manufacturing method for growing by vapor-phase synthesis a single crystal from a diamond single crystal seed substrate, comprising etching away by reactive ion...
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7473930 |
Use of patterned CNT arrays for display purposes
Method and system for providing a dynamically reconfigurable display having nanometer-scale resolution, using a patterned array of multi-wall carbon nanotube (MWCNT) clusters. A diode, phosphor or...
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7473929 |
Semiconductor device and method for fabricating the same
Ion implantation is carried out to form a p-well region and a source region in parts of a high resistance SiC layer on a SiC substrate, and a carbon film is deposited over the substrate. With the...
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7470930 |
Silicon carbide semiconductor device
A silicon carbide semiconductor device includes a semiconductor element disposed in a semiconductor substrate having a first conductive type silicon carbide layer and a silicon substrate. The...
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7466019 |
Rectangular semi-conducting support for microelectronics and method for making same
The semi-conducting support comprises a graphite substrate having a front surface and a rear surface and at least a first stack arranged on the front surface of the substrate. The first stack...
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7439563 |
High-breakdown-voltage semiconductor device
A high-breakdown-voltage semiconductor device comprises a high-resistance semiconductor layer, trenches formed on the surface thereof in a longitudinal plane shape and in parallel, first regions...
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7435993 |
High temperature, high voltage SiC void-less electronic package
An electronic package designed to package silicon carbide discrete components for silicon carbide chips. The electronic package allows thousands of power cycles and/or temperature cycles between...
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7432534 |
III-nitride semiconductor light emitting device
The present invention relates to a III-nitride semiconductor light emitting device comprising a plurality of III-nitride semiconductor layers including an active layer emitting light by...
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7432532 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from...
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7432148 |
Shallow trench isolation by atomic-level silicon reconstruction
Methods of forming an improved shallow trench isolation (STI) region are disclosed. Several exemplary techniques are proposed for treating STI sidewalls to improve the silicon (Si) surface at the...
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7414268 |
High voltage silicon carbide MOS-bipolar devices having bi-directional blocking capabilities
Silicon carbide high voltage semiconductor devices and methods of fabricating such devices are provided. The devices include a voltage blocking substrate. Insulated gate bipolar transistors are...
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7411219 |
Uniform contact
A semiconductor device can comprise a contact material in substantially continuous contact with a contact region. In an embodiment the contact region may comprise an alloy comprising a wide...
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7411218 |
Method and device with durable contact on silicon carbide
A Schottky barrier silicon carbide device has a Re Schottky metal contact. The Re contact 27 is thicker than 250 Angstroms and may be between 2000 and 4000 Angstroms. A termination structure is...
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7410923 |
SiC material, semiconductor device fabricating system and SiC material forming method
A highly corrosion-resistant SiC material is formed on a base body by a CVD process. The SiC material contains β-SiC crystals so oriented that the ratio of the sum of peak intensities of x-ray...
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7407837 |
Method of manufacturing silicon carbide semiconductor device
Stress is exerted to the SiC crystal in the region, in which the carriers of a SiC semiconductor device flow, to change the crystal lattice intervals of the SiC crystal. Since the degeneration of...
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7405430 |
Highly uniform group III nitride epitaxial layers on 100 millimeter diameter silicon carbide substrates
A semiconductor structure is disclosed that includes a silicon carbide wafer having a diameter of at least 100 mm with a Group III nitride heterostructure on the wafer that exhibits high uniformity...
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7405422 |
Epitaxial and polycrystalline growth of Si1-x-yGexCy and Si1-yCy alloy layers on Si by UHV-CVD
A method and apparatus for depositing single crystal, epitaxial films of silicon carbon and silicon germanium carbon on a plurality of substrates in a hot wall, isothermal UHV-CVD system is...
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