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7619257 |
Devices including graphene layers epitaxially grown on single crystal substrates
An electronic device comprises a body including a single crystal region on a major surface of the body. The single crystal region has a hexagonal crystal lattice that is substantially...
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7615804 |
Superlattice nitride semiconductor LD device
A nitride semiconductor device including a light emitting device comprises a n-type region of one or more nitride semiconductor layers having n-type conductivity, a p-type region of one or more...
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7615787 |
Photo-semiconductor device and method of manufacturing the same
A photo-semiconductor device comprises a photoconductive semiconductor film provided with electrodes and formed on a second substrate, the semiconductor film being formed by epitaxial growth on a...
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7601986 |
Epitaxial semiconductor structures having reduced stacking fault nucleation sites
Epitaxial silicon carbide layers are fabricated by forming features in a surface of a silicon carbide substrate having an off-axis orientation toward a crystallographic direction. The features...
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7601985 |
Semiconductor light-emitting device
A semiconductor light-emitting device includes: a substrate; a first conductivity type layer formed on the substrate and including a plurality of group III-V nitride semiconductor layers of a first...
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7598576 |
Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices
An improved termination structure for high field semiconductor devices in silicon carbide is disclosed. The termination structure includes a silicon carbide-based device for high-field operation,...
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7598520 |
Semiconductor device including active layer of zinc oxide with controlled crystal lattice spacing and manufacturing method thereof
A semiconductor device includes an oxide semiconductor thin film layer of zinc oxide. The (002) lattice planes of at least a part of the oxide semiconductor thin film layer have a preferred...
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7595507 |
Semiconductor devices having gallium nitride epilayers on diamond substrates
Methods for integrating wide-gap semiconductors with synthetic diamond substrates are disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or...
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7573075 |
Compound semiconductor device, production method of compound semiconductor device and diode
A compound semiconductor device includes hexagonal silicon carbide crystal substrate and a boron-phosphide-based semiconductor layer formed on the silicon carbide crystal substrate, wherein the...
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7564061 |
Field effect transistor and production method thereof
A field effect transistor having a gate, a source, and a drain formed from metallic materials is disclosed that is able to supply a high driving current. In the field effect transistor, a source...
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7550821 |
Nitride semiconductor device
A nitride semiconductor device includes: a substrate; a nitride semiconductor layer formed on a main surface of the substrate and having a channel region through which electrons drift in a...
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7544249 |
Large-diameter SiC wafer and manufacturing method thereof
From the viewpoint of manufacturing an SiC semiconductor device economically, a present Si device manufacturing line is utilized to make it possible to handle a small-diameter SiC wafer....
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7538352 |
Semiconductor device and power converter, driving inverter, general-purpose inverter and high-power high-frequency communication device using same
In a semiconductor device that uses a silicon carbide semiconductor substrate having p type, n type impurity semiconductor regions formed by ion implantation, the electrical characteristics of the...
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7538340 |
Low side emitting light source and method of making the same
A light source having a die, a substrate, and a housing is disclosed. The die has a semiconducting light emitting device thereon, the die having a top surface and a bottom surface, light being...
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7525122 |
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
A passivated semiconductor structure and associated method are disclosed. The structure includes a silicon carbide substrate or layer; an oxidation layer on the silicon carbide substrate for...
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7514349 |
Semiconductor optical device and manufacturing method thereof
The object of the invention is to reduce the deterioration of crystallinity in the vicinity of an active layer when C, which is a p-type dopant, is doped and to suppress the diffusion of Zn, which...
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7504679 |
Enhancement mode GaN FET with piezoelectric gate
One or more enhancement mode GaN devices has a stress-reduced gate region which interrupts the normally conductive 2Deg layer. A piezoelectric film is disposed over the stress-reduced gate region...
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7452814 |
Method of polishing GaN substrate
In a polishing method of a GaN substrate according to this invention, first, while supplying a polishing solution 27 containing abrasives 23 and a lubricant 25, onto a platen 101, the GaN...
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7432531 |
Semiconductor device
A semiconductor device, which can accurately control carrier density, includes: a single crystal substrate; a semiconductor layer which is made of hexagonal crystal with 6 mm symmetry and is formed...
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7378684 |
Pendeoepitaxial gallium nitride semiconductor layers on silicon carbide substrates
An underlying gallium nitride layer on a silicon carbide substrate is masked with a mask that includes an array of openings therein, and the underlying gallium nitride layer is etched through the...
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7372078 |
Vertical gallium-nitride based light emitting diode
A vertical GaN-based LED includes: an n-electrode; a light-emitting structure in which an n-type GaN layer, an active layer, and a p-type GaN layer are sequentially formed under the n-electrode; a...
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7309959 |
Light-emitting device with improved brightness control and narrow frame and electronic apparatus with the light-emitting device
A light-emitting device and an electronic apparatus, which are capable of preventing reduction of the amount of current flowing through light-emitting elements and which have an excellent display...
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7288830 |
III-V nitride semiconductor substrate and its production method
A self-supported III-V nitride semiconductor substrate having a substantially uniform carrier concentration distribution in a surface layer existing from a top surface to a depth of at least 10 μm...
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7274040 |
Contact and omnidirectional reflective mirror for flip chipped light emitting devices
A light emitting device includes a substrate, a doped substrate layer, a layer of first conductivity type overlying the doped substrate layer, a light emitting layer overlying the layer of first...
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7271416 |
Strain compensated semiconductor structures
Semiconductor structure and method of fabricating a semiconductor structure are provided that include a substrate having a first in-plane unstrained lattice constant, a first layer comprising a...
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7250630 |
Electronic devices formed of high-purity molybdenum oxide
The present invention is directed to electronic devices comprising high-purity molybdenum oxide in at least a part of the devices. The devices according to the present such a bipolar transistor, a...
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7230273 |
Semiconductor device with a plurality of semiconductor elements each including a wide band-gap semiconductor
A semiconductor module comprises independently operable segments 1 (semiconductor elements) on a SiC substrate. Each segment 1 comprises a source electrode pad 2 and a gate electrode pad 3 ...
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7229499 |
Manufacturing method for semiconductor device, semiconductor device and semiconductor wafer
A manufacturing method for a semiconductor device formed in a device region composed of a plurality of semiconductor layers on a substrate, the method including a trench forming step of forming a...
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7227189 |
Vapor-phase growth method for a nitride semiconductor and a nitride semiconductor device
Nitride semiconductor devices and methods of producing same are provided. The present invention includes forming a nitride semiconductor layer on a base body of the nitride semiconductor under...
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7220680 |
Method for photolithography in semiconductor manufacturing
The present disclosure relates generally to the manufacturing of semiconductor devices. In one example, a method for forming a portion of a semiconductor device includes forming a photo sensitive...
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7198970 |
Technique for perfecting the active regions of wide bandgap semiconductor nitride devices
This invention pertains to electronic/optoelectronic devices with reduced extended defects and to a method for making it. The method includes the steps of depositing a dielectric thin film mask...
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7176497 |
Group III nitride compound semiconductor
An Al 0.15 Ga 0.85 N layer 2 is formed on a silicon substrate 1 in a striped or grid pattern. A GaN layer 3 is formed in regions A where the substrate 1 is exposed and in regions B which...
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7173285 |
Lithographic methods to reduce stacking fault nucleation sites
Epitaxial silicon carbide layers are fabricated by forming features in a surface of a silicon carbide substrate having an off-axis orientation toward a crystallographic direction. The features...
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7170096 |
Antimonide-based optical devices
An optical device includes an antimonide-containing substrate, and an antimonide-containing n-doped layer provided on the substrate. The optical device further includes an antimonide-containing...
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7170095 |
Semi-insulating GaN and method of making the same
Large-area, single crystal semi-insulating gallium nitride that is usefully employed to form substrates for fabricating GaN devices for electronic and/or optoelectronic applications. The...
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7138668 |
Heterojunction diode with reduced leakage current
An aspect of the present invention provides a semiconductor device that includes a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity...
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7119400 |
Isotopically pure silicon-on-insulator wafers and method of making same
A semiconductor wafer structure having a device layer, an insulating layer, and a substrate which is capable of supporting increased semiconductor device densities or increased semiconductor device...
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7105932 |
Power semiconductor module
A power semiconductor module comprises a wide band gap semiconductor chip having its surface with an electrode provided thereon, and more than one bonding wire which is connected to an edge portion...
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7105875 |
Lateral power diodes
A lateral power diodes with an optimal drift doping formed in widebandgap semiconductors like Silicon Carbide, Aluminum Nitride and Gallium Nitride and Diamond are provided with a voltage rating...
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7075111 |
Nitride semiconductor substrate and its production method
A nitride semiconductor substrate having a diameter of 10 mm or more, which has a single-layer structure composed of a nitride semiconductor layer having a basic composition represented by Al x Ga...
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7061024 |
Light-emitting device comprising an EU(II)-activated phosphor
The invention concerns a light emitting device comprising a light emitting structure capable of emitting primary light of a wavelength less then 480 nm and a luminescent screen comprising a...
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7048872 |
Codoped direct-gap semiconductor scintillators
Fast, bright inorganic scintillators at room temperature are based on radiative electron-hole recombination in direct-gap semiconductors, e.g. CdS and ZnO. The direct-gap semiconductor is codoped...
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7026669 |
Lateral channel transistor
A lateral channel transistor with an optimal conducting channel formed in widebandgap semiconductors like Silicon Carbide and Diamond is provided. Contrary to conventional vertical design of power...
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7023010 |
Si/C superlattice useful for semiconductor devices
A Si/C superlattice useful for semiconductor devices comprises a plurality of epitaxially grown silicon layers alternating with carbon layers respectively adsorbed on surfaces of said silicon...
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7002179 |
ZnO system semiconductor device
In order to provide ZnO system semiconductor devices having a stable p-type ZnO layer, a ZnO thin film is doped with nitrogen atoms having a high concentration. By fabricating the stable p-type ZnO...
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6949769 |
Suppression of MOSFET gate leakage current
A MOSFET has greatly reduced leakage current between the gate electrode and the channel, source and drain regions. The gate electrode materials have lower electron affinities than the channel,...
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6946372 |
Method of manufacturing gallium nitride based semiconductor light emitting device
A method of manufacturing a gallium nitride (GaN)-based semiconductor light emitting device includes forming a contact resistance improved layer on a p-type GaN-based semiconductor layer with at...
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6936849 |
Silicon carbide gate transistor
A field-effect transistor (FET) device and method of fabrication uses an electrically interconnected polycrystalline or microcrystalline silicon carbide (SiC) gate having a lower electron affinity...
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6933531 |
Heat sink material and method of manufacturing the heat sink material
Graphite is placed in a case, and the case is set in a furnace. The interior of the furnace is subjected to sintering to produce a porous sintered member of graphite. After that, the case with the...
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6930329 |
Method for manufacturing gallium nitride compound semiconductor
An Al 0.15 Ga 0.85 N layer 2 is formed on a silicon substrate 1 in a striped or grid pattern. A GaN layer 3 is formed in regions A where the substrate 1 is exposed and in regions B which...
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