Matches 1 - 50 out of 168 1 2 3 4 >
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7622184 Multilevel interconnection board and method of fabricating the same  
A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the...
7615776 Method of self-assembling electronic circuitry and circuits formed thereby  
A method of assembling a circuit includes providing a template, enabling a semiconductor material to self assemble on the template, and enabling self-assembly of a connection between the...
7612438 Active matrix substrate with height control member  
An active matrix substrate comprises a substrate, a plurality of adhesion parts provided on the substrate so as to have substantially the same height, and a plurality of active elements provided on...
7582964 Semiconductor package having non-ceramic based window frame  
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
7550848 Semiconductor constructions comprising particle-containing materials  
The invention includes methods of forming particle-containing materials, and also includes semiconductor constructions comprising particle-containing materials. One aspect of the invention includes...
7535014 Integrally gated carbon nanotube field ionizer device and method of manufacture therefor  
A field ionization device can include a first insulator layer on a first side of a substrate, a conductive gate layer on the first insulator layer, a cavity in the substrate, a portion of first...
7485908 Insulated gate silicon nanowire transistor and method of manufacture  
An insulated gate silicon nanowire transistor amplifier structure is provided and includes a substrate formed of dielectric material. A patterned silicon material may be disposed on the substrate...
7456502 Wiring board with connection electrode formed in opening and semiconductor device using the same  
The invention provides a wiring board ( 2,15 ) to which a semiconductor chip ( 3 ) is to be bonded while directing a surface of the semiconductor chip toward the wiring board. The wiring board...
7439560 Semiconductor device using semiconductor nanowire and display apparatus and image pick-up apparatus using the same  
A semiconductor device, comprising a semiconductor nanowire having a first region with one of a PN junction and a PIN junction and a second region with a field effect transistor structure, a pair...
7429795 Bond pad structure  
Bond pad structures are presented. Some embodiments of the structure include a conductive conductor-insulator layer overlying a substrate. The conductive conductor-insulator layer includes a...
7414313 Polymeric conductor donor and transfer method  
The present invention relates to a donor laminate for transfer of a conductive layer comprising at least one electronically conductive polymer on to a receiver, wherein the receiver is a component...
7405419 Unidirectionally conductive materials for interconnection  
A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie...
7348670 Nanostructure, electronic device and method of manufacturing the same  
Cylinders having Al as a major constituent are orderly arrayed in an (Si, Ge) matrix. In a nanostructure in the form of a mixture film having a plurality of cylinders having Al as a major...
7332810 Integrated circuit device and method of producing the same  
An integrated circuit device having vias having good resistance to migration causing the breaking of a wiring line, or an integrated circuit device having a wiring structure that is fined by...
7298046 Semiconductor package having non-ceramic based window frame  
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
7247877 Integrated carbon nanotube sensors  
A method and structure for an integrated circuit comprising a first transistor and an embedded carbon nanotube field effect transistor (CNT FET) proximate to the first transistor, wherein the CNT...
7151313 Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment  
Methods are provided to form wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment, with which highly reliable electrical wirings having minute...
7135728 Large-area nanoenabled macroelectronic substrates and uses therefor  
A method and apparatus for an electronic substrate having a plurality of semiconductor devices is described. A thin film of nanowires is formed on a substrate. The thin film of nanowires is formed...
7132677 Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same  
An GaN light emitting diode (LED) having a nanorod (or, nanowire) structure is disclosed. The GaN LED employs GaN nanorods in which a n-type GaN nanorod, an InGaN quantum well and a p-type GaN...
7105428 Systems and methods for nanowire growth and harvesting  
The present invention is directed to systems and methods for nanowire growth and harvesting. In an embodiment, methods for nanowire growth and doping are provided, including methods for epitaxial...
7064372 Large-area nanoenabled macroelectronic substrates and uses therefor  
A method and apparatus for an electronic substrate having a plurality of semiconductor devices is described. A thin film of nanowires is formed on a substrate. The thin film of nanowires is formed...
6992389 Barrier for interconnect and method  
A method of creating a multi-layered barrier for use in an interconnect, a barrier for an interconnect, and an interconnect including the barrier are disclosed. The method includes creating the...
6987320 Pressure-welded semiconductor device  
In a pressure-welded semiconductor device where at least one semiconductor element is disposed inside a casing, a buffer conductive layer including conductive carbons is disposed at pressure-welded...
6973720 Method for manufacturing a connector integrated with a LED  
Method for manufacturing an elastic connector, integrated with an electrode of at least either a chip-type LED or a printed circuit board on which a LED element is directly mounted and to which the...
6946675 Microelectronic components and electronic networks comprising DNA  
A microelectronic network is fabricated on a fibrous skeleton by binding or complexing electronically functional substances to the nucleic acid skeleton. The skeleton comprises fibers with...
6936912 Active matrix substrate with height control member  
An active matrix substrate comprises a substrate, a plurality of adhesion parts provided on the substrate so as to have substantially the same height, and a plurality of active elements provided on...
6909185 Composite material including copper and cuprous oxide and application thereof  
A composite material is provided, which has a low thermal expansivity, a high thermal conductivity, and a good plastic workability, which composite material may be applied to semiconductor devices...
6882051 Nanowires, nanostructures and devices fabricated therefrom  
One-dimensional nanostructures having uniform diameters of less than approximately 200 nm. These inventive nanostructures, which we refer to as “nanowires”, include single-crystalline...
6825560 Solder filler  
The present invention relates to electrically attaching a surface mount device to mounting structure via their respective contact pads using an attach material, such as solder or conductive epoxy,...
6818972 Reduction of chip carrier flexing during thermal cycling  
A method and structure for reducing chip carrier flexing during thermal cycling. A semiconductor chip is coupled to a stiff chip carrier (i.e., a chip carrier having an elastic modulus of at least...
6784543 External connection terminal and semiconductor device  
A structure in which a phosphorus-nickel layer, a rich phosphorus nickel layer that contains phosphorus or boron higher than this phosphorus-nickel layer, a nickel-tin ally layer, a tin-rich tin...
6781156 Recombination center diffusion controlled by carbon concentration  
A localised reduced lifetime region ( 1,25,41 ) is provided in a semiconductor device formed substantially of silicon. A predetermined concentration of carbon is provided in the region, and then...
6740972 Electronic device having fibrous interface  
Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in...
6727117 Semiconductor substrate having copper/diamond composite material and method of making same  
A semiconductor package for power transistors of the LDMOS type has a metallic substrate with a die mounted directly thereon, lead frame insulators mounted thereon adjacent the die and a plurality...
6657303 Integrated circuit with low solubility metal-conductor interconnect cap  
An integrated circuit and manufacturing method therefor is provided having a semiconductor substrate with a semiconductor device. A device dielectric layer formed on the semiconductor substrate. A...
6651736 Short carbon fiber enhanced thermal grease  
A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers...
6646344 Composite material, and manufacturing method and uses of same  
Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment...
6548898 External connection terminal and semiconductor device  
A structure in which a phosphorus-nickel layer, a rich phosphorus nickel layer that contains phosphorus or boron higher than this phosphorus-nickel layer, a nickel-tin ally layer, a tin-rich tin...
6545356 Graded layer for use in semiconductor circuits and method for making same  
Methods of forming a graded layer is disclosed. The graded layer transitions from one material to another material. The properties of these materials are chosen to optimize the interfaces on each...
6543524 Overplated thermally conductive part with EMI shielding  
A net-shape molded heat transfer component is provided which includes a thermally conductive core and a metallic coating for reflection of electromagnetic interference and radio frequency waves....
6521998 Electrode structure for nitride III-V compound semiconductor devices  
In an electrode structure for a nitride III-V compound semiconductor device, a metallic nitride is used as an electrode material. A metallic material of the metallic nitride has a negative nitride...
6479897 Semiconductor device having fluorine-added carbon dielectric film and method of fabricating the same  
A semiconductor device has a dielectric film made of a fluorine-added carbon film formed on a substrate, a metallic layer formed on the fluorine-added carbon film and an adhesive layer formed...
6444496 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof  
The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a...
6429533 Conductive polymer device and method of manufacturing same  
An electronic device includes a first conductive polymer layer sandwiched between a first external metal foil electrode and a first internal metal foil electrode, a second conductive polymer layer...
6410935 Semiconductor assisted metal deposition for nanolithography applications  
An article of manufacture and method of forming nanoparticle sized material components. A semiconductor oxide substrate includes nanoparticles of semiconductor oxide. A modifier is deposited onto...
6399475 Process for producing electrical connections on the surface of a semiconductor package with electrical-connection drops  
Process for producing electrical connections on the surface of a semiconductor package containing an integrated-circuit chip and having metal electrical-connection regions on the surface of the...
6396122 Method for fabricating on-chip inductors and related structure  
According to various disclosed embodiments, a conductor is patterned in a dielectric. The conductor can be patterned, for example, in the shape of a square spiral. The conductor can comprise, for...
6359337 Composite electrical contact structure and method for manufacturing the same  
An improved wear resistant bump contact is produced by the inclusion of small particles of hard materials in the conductive material of the contact bump, preferably by co-deposition at the time of...
6358625 Refractory metals with improved adhesion strength  
Refractory metal articles having hither than normal impurity levels of concentrations of additive species near the surface that promote chemically enhanced sintering without any adverse effect on...
6343647 Thermal joint and method of use  
A thermal joint for facilitating heat transfer between two components is described. The thermal joint is formed from an alloy of at least two constituents. The alloy has a liquid temperature and a...
Matches 1 - 50 out of 168 1 2 3 4 >